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61. 发明授权

US08008419B2 Siloxane monomers and methods for use thereof 有权
标题翻译：硅氧烷单体及其使用方法
公开(公告)号：US08008419B2
公开(公告)日：2011-08-30
申请号：US12541027
申请日：2009-08-13
申请人： Stephen M. Dershem
发明人： Stephen M. Dershem
IPC分类号： C08F30/08 , C07F7/08
CPC分类号： C07F7/21 , C08G77/045
摘要： The invention provides novel siloxane monomers useful in a variety of adhesive applications. In one aspect, the siloxane compounds described herein can be used as Diels-Alder type curatives for bismaleimide or poly-maleimide monomers. The unsaturated resins shown here are attractive for use as maleimide curatives due to their poly-functionality. Each substituted styrenyl residue can react with two maleimide functional groups. Thus, an invention adhesive composition typically contains an excess of bismaleimide monomers.
摘要翻译：本发明提供了可用于各种粘合剂应用的新型硅氧烷单体。一方面，本文所述的硅氧烷化合物可用作双马来酰亚胺或聚马来酰亚胺单体的狄尔斯 - 阿尔德型固化剂。由于它们的多官能度，这里所示的不饱和树脂对于用作马来酰亚胺固化剂是有吸引力的。每个取代的苯乙烯基残基可以与两个马来酰亚胺官能团反应。因此，发明粘合剂组合物通常含有过量的双马来酰亚胺单体。

62. 发明授权

US07795362B2 Olefin oligomers containing pendant maleimide groups 有权
标题翻译：含有侧链马来酰亚胺基团的烯属低聚物
公开(公告)号：US07795362B2
公开(公告)日：2010-09-14
申请号：US11184305
申请日：2005-07-18
申请人： Stephen M. Dershem
发明人： Stephen M. Dershem
IPC分类号： C08F36/00 , C08K3/02
CPC分类号： H05K3/285 , C08F210/00 , C08F210/10 , C08F212/08 , C08F226/02
摘要： The invention is based on the discovery that certain crosslinkable functional groups can be incorporated into olefin oligomers, thereby making these functionalized olefin oligomers useful as thermosetting resin compositions. In particular, there are provided olefin oligomers containing pendant maleimide groups. These materials are readily prepared via cationic co-polymerization of cationically polymerizable olefin monomers and maleimide monomers containing a cationically polymerizable functional group.
摘要翻译：本发明是基于以下发现：某些可交联的官能团可以并入烯烃低聚物中，从而使这些官能化烯烃低聚物可用作热固性树脂组合物。特别地，提供了含有侧链马来酰亚胺基团的烯烃低聚物。这些材料可以通过阳离子聚合的烯烃单体和含有阳离子可聚合官能团的马来酰亚胺单体的阳离子共聚来容易地制备。

63. 发明授权

US07678879B2 Adhesive composition of phenol-functional polyamides 有权
标题翻译：苯酚官能聚酰胺的粘合剂组合物
公开(公告)号：US07678879B2
公开(公告)日：2010-03-16
申请号：US11592007
申请日：2006-11-01
申请人： Stephen M. Dershem
发明人： Stephen M. Dershem
IPC分类号： C07C231/02 , C08G69/26 , C08L77/06 , B32B33/00 , C08L63/02 , C08L63/04
CPC分类号： C07C235/50 , C08G69/26 , C08G69/265 , C08K5/20 , C08L63/00 , C08L77/06 , C08L2666/20 , C08L2666/22 , C09J163/00 , C09J177/06 , Y10T428/14
摘要： The invention is based on the discovery that the compounds and compositions described herein are useful as film-forming adhesives for use in a variety of applications, including, for example, adhesive tapes for the electronic packaging industry. The invention compositions described herein can be cured in a variety of ways with or without a catalyst.
摘要翻译：本发明基于以下发现：本文所述的化合物和组合物可用作用于各种应用的成膜粘合剂，包括例如用于电子包装工业的胶带。本文所述的本发明组合物可以以各种方式固化，使用或不使用催化剂。

64. 发明申请

US20100063184A1 LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF 有权
标题翻译：基于丙烯酸酯和马来酰亚胺的低温固化制剂及其使用方法
公开(公告)号：US20100063184A1
公开(公告)日：2010-03-11
申请号：US12595616
申请日：2008-04-14
申请人： Stephen M. Dershem
发明人： Stephen M. Dershem
IPC分类号： C09J4/00
CPC分类号： C09J135/06 , C08K5/10 , C08K5/3415 , H01L24/28 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15747 , H01L2924/00
摘要： The present invention is based on the discovery that certain electron poor olefins combined with nucleophiles and a base catalyst are useful as adhesive compositions for the electronic packaging industry. In particular, the adhesive formulations set forth herein are useful as low temperature curing formulations with high adhesion to a variety of substrates. Invention formulations typically cure at about 80° C. and have a potlife of about 24 hours. The formulations cure by the well-known Michael addition reaction.
摘要翻译：本发明基于以下发现：与亲核试剂结合的某些电子差的烯烃和碱催化剂可用作电子包装工业的粘合剂组合物。特别地，本文所述的粘合剂制剂可用作对各种基材具有高粘附性的低温固化配方。本发明配方通常在约80℃下固化并具有约24小时的固化期。配方通过众所周知的迈克尔加成反应固化。

65. 发明申请

US20100056671A1 POLYFUNCTIONAL EPOXY OLIGOMERS 审中-公开
标题翻译：多官能环氧低聚物
公开(公告)号：US20100056671A1
公开(公告)日：2010-03-04
申请号：US12595589
申请日：2008-04-14
申请人： Stephen M. Dershem
发明人： Stephen M. Dershem
IPC分类号： C09J163/00 , C08G65/04 , C08F124/00
CPC分类号： C08G59/3209 , B32B37/1207 , B32B2309/02 , C09J163/00
摘要： The present invention provides epoxy functional oligomeric compounds, methods of preparation and uses therefor. In particular, the present invention provides to oligomeric epoxy compounds derived from allyl glycidyl ether.
摘要翻译：本发明提供环氧官能低聚化合物，其制备方法和用途。特别地，本发明提供了衍生自烯丙基缩水甘油醚的低聚环氧化合物。

66. 发明授权

US07645899B1 Vinyl compounds 失效
标题翻译：乙烯基化合物
公开(公告)号：US07645899B1
公开(公告)日：2010-01-12
申请号：US11469964
申请日：2006-09-05
申请人： Stephen M. Dershem , Dennis B. Patterson , Jose A. Osuna, Jr.
发明人： Stephen M. Dershem , Dennis B. Patterson , Jose A. Osuna, Jr.
IPC分类号： C07C69/74
CPC分类号： C07D401/04 , C07D207/452
摘要： In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.
摘要翻译：根据本发明，提供了新型热固性树脂组合物，其不需要溶剂来提供具有合适粘度的系统以便于处理。本发明组合物具有快速固化的益处。所得到的热固性材料对于升高的温度是稳定的，高度柔性的，具有低吸湿性，因此可用于各种应用中，例如在粘合剂应用中，因为它们对基材和附着于其上的装置表现出良好的粘合性。

67. 发明授权

US07517925B2 Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof 有权
标题翻译：苯并恶嗪，其组合的热固性树脂及其使用方法
公开(公告)号：US07517925B2
公开(公告)日：2009-04-14
申请号：US10735119
申请日：2003-12-11
申请人： Stephen M. Dershem , Puwei Liu , Farhad G. Mizori
发明人： Stephen M. Dershem , Puwei Liu , Farhad G. Mizori
IPC分类号： C08K5/34
CPC分类号： C07D413/04 , C07D265/16 , C08G77/26 , Y10T428/31678
摘要： In accordance with the present invention, there are provided novel benzoxazine compounds and thermosetting resin compositions prepared therefrom. Invention compositions are particularly useful for increasing adhesion at interfaces within microelectronic packages. Invention benzoxazines are useful for the preparation of invention compositions with properties which are associated with increased adhesion at interfaces, such as, for example, low shrinkage on cure and low coefficient of thermal expansion (CTE). In another aspect of the invention, there are provided die-attach pastes having increased interfacial adhesion. Invention die-attach pastes include benzoxazine-containing thermosetting resin compositions. In further aspects of the invention, there are provided methods for enhancing adhesive strength of thermosetting resin compositions and methods for enhancing adhesion of a substrate bound to a metallic surface by a thermosetting resin composition.
摘要翻译：根据本发明，提供了由其制备的新型苯并恶嗪化合物和热固性树脂组合物。本发明组合物特别可用于增加微电子封装内的界面处的粘附性。本发明的苯并恶嗪可用于制备本发明组合物，其性能与界面处的增加的粘附性相关，例如固化时的低收缩率和低的热膨胀系数（CTE）。在本发明的另一方面，提供了具有增加的界面粘合力的模片附着浆料。本发明的模片附着膏包括含有苯并恶嗪的热固性树脂组合物。在本发明的另一方面，提供了用于提高热固性树脂组合物的粘合强度的方法和通过热固性树脂组合物增强与金属表面结合的基材的粘附性的方法。

68. 发明申请

US20080210375A1 Free-radical curable polyesters and methods for use thereof 有权
标题翻译：自由基可固化聚酯及其使用方法
公开(公告)号：US20080210375A1
公开(公告)日：2008-09-04
申请号：US11974673
申请日：2007-10-15
申请人： Stephen M. Dershem , Farhad G. Mizori
发明人： Stephen M. Dershem , Farhad G. Mizori
IPC分类号： B32B27/36 , C08K3/22 , C08G63/60 , C08L67/00 , B32B37/12
CPC分类号： C09J167/07 , C07C69/54 , C07C69/60 , C07C69/75 , C07C69/753 , C07C69/76 , C07C69/80 , C07C69/82 , C07C69/88 , C07C2601/14 , C07C2602/42 , C07C2603/68 , C08G63/21 , C08K3/04 , C08K3/08 , C08K3/10 , C09J9/00 , C09J9/02 , C09J11/04 , C09J2433/00
摘要： The invention is based on the discovery that certain polyester compounds bearing are useful as b-stageable and/or liquid adhesives for the microelectronic packaging industry.
摘要翻译：本发明基于以下发现：某些聚酯化合物轴承可用作用于微电子包装工业的b阶和/或液体粘合剂。

69. 发明申请

US20080103240A1 Film-forming adhesive compositions and methods for use thereof 有权
标题翻译：成膜粘合剂组合物及其使用方法
公开(公告)号：US20080103240A1
公开(公告)日：2008-05-01
申请号：US11592007
申请日：2006-11-01
申请人： Stephen M. Dershem
发明人： Stephen M. Dershem
IPC分类号： C08K5/04 , C07C205/00
CPC分类号： C07C235/50 , C08G69/26 , C08G69/265 , C08K5/20 , C08L63/00 , C08L77/06 , C08L2666/20 , C08L2666/22 , C09J163/00 , C09J177/06 , Y10T428/14
摘要： The invention is based on the discovery that the compounds and compositions described herein are useful as film-forming adhesives for use in a variety of applications, including, for example, adhesive tapes for the electronic packaging industry. The invention compositions described herein can be cured in a variety of ways with or without a catalyst.
摘要翻译：本发明基于以下发现：本文所述的化合物和组合物可用作用于各种应用的成膜粘合剂，包括例如用于电子包装工业的胶带。本文所述的本发明组合物可以以各种方式固化，使用或不使用催化剂。

70. 发明申请

US20080017308A1 Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof 有权
标题翻译：聚（苯乙烯 - 共 - 烯丙醇）的衍生物及其使用方法
公开(公告)号：US20080017308A1
公开(公告)日：2008-01-24
申请号：US11880944
申请日：2007-07-24
申请人： Stephen M. Dershem
发明人： Stephen M. Dershem
IPC分类号： C09J5/06 , C08F118/02 , C08F20/10 , C08F212/06 , C08F22/40 , C08F222/02 , C08F222/10 , C08F24/00 , C08L25/02 , C08L33/06 , C08L37/00
CPC分类号： H01L24/83 , C08F212/14 , C08F216/08 , C09D125/08 , C09J125/08 , H01L24/29 , H01L24/81 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29386 , H01L2224/29393 , H01L2224/29439 , H01L2224/29447 , H01L2224/29455 , H01L2224/81801 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15747 , H01L2924/00014 , H01L2924/05032 , H01L2924/04642 , H01L2924/0503 , H01L2924/05432 , H01L2924/00
摘要： The invention provides derivatives of poly(styrene-co-allylalcohol). These materials are useful as thermosetting monomers that can be incorporated into adhesive compositions. In some embodiments, the adhesive compositions are useful in the microelectronic packaging industry.
摘要翻译：本发明提供聚（苯乙烯 - 共 - 烯丙醇）的衍生物。这些材料可用作可并入粘合剂组合物中的热固性单体。在一些实施方案中，粘合剂组合物可用于微电子封装工业。

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