专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明申请

US20100219078A1 PLATING APPARATUS AND PLATING METHOD 审中-公开
标题翻译：电镀设备和电镀方法
公开(公告)号：US20100219078A1
公开(公告)日：2010-09-02
申请号：US12771056
申请日：2010-04-30
申请人： Keiichi KURASHINA , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O'Neal , Hariklia Deligianni
发明人： Keiichi KURASHINA , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O'Neal , Hariklia Deligianni
IPC分类号： C25D21/12 , C25D5/00
CPC分类号： C25D5/22 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/004 , C25D17/005 , C25D17/12 , C25D21/12 , H01L21/2885 , H01L21/7684 , H01L21/76849 , H01L21/76877
摘要： A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.
摘要翻译：电镀装置可以牢固地进行基板的平坦化镀以形成具有平坦表面的镀膜而不使用昂贵的机构，并且不对基板施加额外的电镀。电镀装置包括：基板支架; 具有用于水密密封基板的周边部分的密封部件的阴极部分和用于向基板供给电流的阴极电极; 设置在面向所述基板的表面的位置的阳极; 设置在所述阳极和所述基板的表面之间的多孔构件; 恒定电压控制部分，用于以恒定值控制在所述阴极和所述阳极之间施加的电压; 以及电流监视部分，用于监视在阴极和阳极之间流动的电流，并将检测信号反馈到恒压控制部分。

62. 发明授权

US07736474B2 Plating apparatus and plating method 失效
标题翻译：电镀装置及电镀方法
公开(公告)号：US07736474B2
公开(公告)日：2010-06-15
申请号：US11245490
申请日：2005-10-07
申请人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O'Neal , Hariklia Deligianni
发明人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O'Neal , Hariklia Deligianni
IPC分类号： C25D17/00 , C25D7/12
CPC分类号： C25D5/22 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/004 , C25D17/005 , C25D17/12 , C25D21/12 , H01L21/2885 , H01L21/7684 , H01L21/76849 , H01L21/76877
摘要： A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.
摘要翻译：电镀装置可以牢固地进行基板的平坦化镀以形成具有平坦表面的镀膜而不使用昂贵的机构，并且不对基板施加额外的电镀。电镀装置包括：基板支架; 具有用于水密密封基板的周边部分的密封部件的阴极部分和用于向基板供给电流的阴极电极; 设置在面向所述基板的表面的位置的阳极; 设置在所述阳极和所述基板的表面之间的多孔构件; 恒定电压控制部分，用于以恒定值控制在所述阴极和所述阳极之间施加的电压; 以及电流监视部分，用于监视在阴极和阳极之间流动的电流，并将检测信号反馈到恒压控制部分。

63. 发明申请

US20100032315A1 Electrolytic processing apparatus and electrolytic processing method 审中-公开
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20100032315A1
公开(公告)日：2010-02-11
申请号：US12458956
申请日：2009-07-28
申请人： Junko Mine , Akira Susaki , Hiroyuki Kanda , Tsutomu Nakada
发明人： Junko Mine , Akira Susaki , Hiroyuki Kanda , Tsutomu Nakada
IPC分类号： C25F3/02
CPC分类号： C25F5/00 , H01L21/02068 , H01L21/76861 , H01L21/76873
摘要： An electrolytic processing apparatus, prior to carrying out plating directly on, e.g., a ruthenium film of a substrate using the ruthenium film as a seed layer, can securely remove a passive layer formed on a surface of the ruthenium film even when the substrate is a large-sized high-resistance substrate, such as a 300-mm wafer, thereby reducing the terminal effect during the subsequent plating, improving the quality of a plated film and enabling filling of a void-free plated film into a fine interconnect pattern. The electrolytic processing apparatus includes: an anode disposed opposite a seed layer of a noble metal or a high-melting metal, formed on a substrate; a porous body impregnated with an electrolytic solution, disposed in a space, filled with the electrolytic solution, between the substrate and the anode; and a control section for controlling an electric field on a surface of the seed layer so that a reduction reaction takes place in the seed layer, thereby electrolytically and electrochemically removing a passive layer formed in the surface of the seed layer.
摘要翻译：电解处理装置在使用钌膜作为种子层的基板钌膜直接进行电镀之前，可以可靠地除去形成在钌膜的表面上的钝化层，即使当基板为大尺寸高电阻基板，例如300mm晶片，从而降低了后续电镀期间的端子效应，提高了镀膜的质量，并且能够将无空隙的镀膜填充到精细的互连图案中。电解处理装置包括：在基板上形成的与贵金属或高熔点金属的种子层相对设置的阳极; 浸渍有电解液的多孔体，设置在填充有电解液的空间中，在基板和阳极之间; 以及控制部分，用于控制种子层表面上的电场，使得种子层中发生还原反应，从而电解和电化学去除形成在籽晶层表面的钝化层。

64. 发明授权

US07479213B2 Plating method and plating apparatus 失效
标题翻译：电镀方法和电镀装置
公开(公告)号：US07479213B2
公开(公告)日：2009-01-20
申请号：US11020068
申请日：2004-12-23
申请人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Hidenao Suzuki , Koji Mishima , Brett C. Baker-O'Neal , Hariklia Deligianni , Keith Kwietniak
发明人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Hidenao Suzuki , Koji Mishima , Brett C. Baker-O'Neal , Hariklia Deligianni , Keith Kwietniak
IPC分类号： C25D5/10
CPC分类号： C25D17/001 , C25D5/10 , C25D5/18 , C25D7/123 , H01L21/2885 , H01L21/7684 , H01L21/76877
摘要： A plating method is capable of preferentially precipitating a plated film fully and uniformly in trenches and via holes according to a mechanical and electrochemical process, and of easily forming a plated film having higher flatness surface without being affected by variations in the shape of trenches and via holes. The plating method includes a first plating process and a second plating process. The second plating process is performed by filling a plating solution between an anode and a substrate, with a porous member placed in the plating solution, repeatedly bringing the porous member and the substrate into and out of contact with each other, passing a current between the anode and the substrate while the porous member is being held in contact with the substrate.
摘要翻译：电镀方法能够根据机械和电化学方法优先将电镀膜完全均匀地沉积在沟槽和通孔中，并且容易地形成具有较高平坦度表面的电镀膜，而不受沟槽形状和通孔形状的变化的影响孔。电镀方法包括第一电镀工艺和第二电镀工艺。通过在阳极和基板之间填充电镀液，将多孔构件放置在电镀液中，反复使多孔构件和基板彼此接触和脱离接触来进行第二电镀工艺，使电流在阳极和衬底，同时多孔构件被保持与衬底接触。

65. 发明申请

US20080035171A1 Cleaning method and cleaning apparatus for porous member 审中-公开
标题翻译：多孔构件的清洗方法和清洁装置
公开(公告)号：US20080035171A1
公开(公告)日：2008-02-14
申请号：US11826275
申请日：2007-07-13
申请人： Hiroyuki Kanda , Natsuki Makino , Kazufumi Nomura
发明人： Hiroyuki Kanda , Natsuki Makino , Kazufumi Nomura
IPC分类号： C23G1/02
CPC分类号： B08B3/12 , B08B7/00
摘要： A porous member cleaning method enables effective cleaning of the interior of a porous member even when it has a small pore size, a high density and a large volume. The porous member cleaning method includes: disposing a porous member in a hermetic space, and cleaning the interior of the porous member with a pressurized cleaning liquid passing through the interior of the porous member; and then disposing the porous member in said hermetic space or in a different hermetic space, and supplying pressurized pure water to the interior of the porous member so that the pure water passes through the interior of the porous member.
摘要翻译：多孔构件清洁方法即使具有小孔径，高密度和大体积也能有效地清洁多孔构件的内部。多孔构件清洁方法包括：将多孔构件设置在密封空间中，并且通过穿过多孔构件内部的加压清洗液清洁多孔构件的内部; 然后将多孔构件设置在所述密封空间或不同的密封空间中，并将加压的纯水供应到多孔构件的内部，使得纯水通过多孔构件的内部。

66. 发明授权

US07311809B2 Plating apparatus for substrate 有权
标题翻译：基板电镀装置
公开(公告)号：US07311809B2
公开(公告)日：2007-12-25
申请号：US10930823
申请日：2004-09-01
申请人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Brett Baker , Hariklia Deligianni , Phillipe Vereecken
发明人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Brett Baker , Hariklia Deligianni , Phillipe Vereecken
IPC分类号： C25D17/00
CPC分类号： C25D7/123 , C25D17/001 , C25D17/004 , C25D17/008 , H01L21/2885
摘要： The present invention provides a plating apparatus for a substrate which can plate a substrate under uniform pressure without increasing a load to be applied while holding the entire surface of a porous member in contact with the surface, to be plated, of the substrate. The plating apparatus for a substrate, includes: a substrate holder for holding a substrate; a cathode unit having a seal member for abutting against and sealing, in a water-tight manner, a peripheral portion of a surface, to be plated, of the substrate held by the substrate holder, and a cathode electrode which is brought into contact with the substrate to supply current to the substrate. An anode which is vertically moveable is disposed in confronting relation to the surface, to be plated, of the substrate; a plating solution impregnated material is disposed between the anode and the surface, to be plated, of the substrate, the plating solution impregnated material being made of a water-retentive material; and a porous member is disposed between the plating solution impregnated material and the surface, to be plated, of the substrate. The plating solution impregnated material is constructed of a plurality of separate members.
摘要翻译：本发明提供了一种用于基板的电镀装置，其能够在保持多孔构件的整个表面与基板的被镀表面接触的同时，在均匀的压力下对基板进行平板化，而不增加要施加的载荷。用于基板的电镀装置包括：用于保持基板的基板保持器; 阴极单元，具有密封构件，该密封构件以水密方式邻接并密封被基板保持件保持的基板的待镀表面的周边部分，以及与基板保持件接触的阴极电极该基板向基板提供电流。可垂直移动的阳极以与基板的待镀表面相对的方式设置; 电镀溶液浸渍材料设置在阳极和待镀覆的表面之间，电镀液浸渍材料由保水材料制成; 并且多孔构件设置在电镀溶液浸渍材料和要被电镀的表面之间。电镀溶液浸渍材料由多个分开的构件构成。

67. 发明申请

US20070241122A1 Medicine Dispensing Device 失效
标题翻译：医药点胶装置
公开(公告)号：US20070241122A1
公开(公告)日：2007-10-18
申请号：US11597004
申请日：2005-05-18
申请人： Shoji Yuyama , Yasuhiro Shigeyama , Takayuki Fujikawa , Hiroyuki Kanda , Shigeyuki Sakai
发明人： Shoji Yuyama , Yasuhiro Shigeyama , Takayuki Fujikawa , Hiroyuki Kanda , Shigeyuki Sakai
IPC分类号： B65H1/08 , G01F11/00 , B65H3/44 , B65G59/00 , G07F11/16
CPC分类号： G07F11/42 , G07F11/165 , G07F17/0092
摘要： A medicine dispensing device capable of appropriately dispensing medicines independent of their form and having a compact structure. The medicine dispensing device has a device body (1) and a medicine conveyance member (3) for conveying, on one by one basis, medicines (D) arranged in rows in the device body (1). The medicine conveyance member (3) has a medicine holding member (40) reciprocatingly moving in the horizontal and vertical directions. The medicine holding member (40) has a support member (42), a forwardly/backwardly moving member (43) reciprocatingly moving in the forward and backward direction of the device body (1) while being supported by the support member(42), and a holding member (44) supported by the forwardly/backwardly moving member (43) so as to swing between a vertical position and a horizontal position and having a pair of holding sections (54) capable of holding a medicine (D).
摘要翻译：一种药物分配装置，其能够独立于其形式适当地分配药物并具有紧凑的结构。药剂分配装置具有装置主体（1）和药物输送部件（3），用于一个接一个地输送在装置主体（1）中排成行的药物（D）。药剂输送部件（3）具有沿水平方向和垂直方向往复移动的药剂保持部件（40）。药物保持部件（40）具有支撑部件（42），向前/向后移动的部件（43），其在由支撑部件（42）支撑的同时沿着装置主体（1）的前后方向往复移动，以及由所述向前/向后移动构件（43）支撑以在垂直位置和水平位置之间摆动并具有能够容纳药物（D）的一对保持部（54）的保持构件（44）。

68. 发明申请

US20070225775A1 Vision regeneration assisting device 有权
标题翻译：视力再生辅助装置
公开(公告)号：US20070225775A1
公开(公告)日：2007-09-27
申请号：US11727155
申请日：2007-03-23
申请人： Yasuo Tano , Hirokazu Sakaguchi , Eiji Yonezawa , Hiroyuki Kanda
发明人： Yasuo Tano , Hirokazu Sakaguchi , Eiji Yonezawa , Hiroyuki Kanda
IPC分类号： A61N1/18
CPC分类号： A61N1/36046
摘要： A vision regeneration assisting device for regenerating vision of a patient, comprising: a plurality of electrodes which are stuck and placed into an optic disc of the patient; a setting unit with which first output conditions for an electrical stimulation pulse signal from at least one of the electrodes are set variably; a storage unit which stores a generation position of a phosphene specific to the patient in association with the first output conditions for the stimulation signal that has caused to generate the phosphene, the storage unit storing various first output conditions for the stimulation signals and the generation positions of the phosphenes caused by the stimulation signals based on the various first output conditions in association with each other; a processor which sets second output conditions for the stimulation signal based on image data obtained by an external photography unit and the generation positions of the phosphenes stored in the storage unit, and converts the obtained image data into data for the stimulation signal based on the set second output conditions; and a controller which controls output of the stimulation signal from at least one of the electrodes based on the converted stimulation signal data. In this manner electrical stimulation is applied through the optic disc under applying conditions that are suitable for an individual patient so as to regenerate the patient's vision.
摘要翻译：一种用于再生患者视力的视觉再生辅助装置，包括：多个电极，其被卡住并放置在患者的视盘中; 设置单元，用于可变地设置来自至少一个电极的电刺激脉冲信号的第一输出条件; 存储单元，其与针对已经产生磷光体的刺激信号的第一输出条件相关联地存储与患者特异的磷光体的产生位置，所述存储单元存储用于刺激信号和生成位置的各种第一输出条件基于相互关联的各种第一输出条件由刺激信号引起的磷光体; 处理器，其基于由外部摄影单元获得的图像数据和存储在存储单元中的磷光体的生成位置，为刺激信号设定第二输出条件，并且将获得的图像数据转换为基于该组的刺激信号的数据第二输出条件; 以及控制器，其基于转换的刺激信号数据控制来自至少一个电极的刺激信号的输出。以这种方式，在适合于个体患者的条件下通过视盘施加电刺激，以便再生患者的视力。

69. 发明申请

US20070158202A1 Plating apparatus and method for controlling plating solution 审中-公开
标题翻译：电镀液控制电镀装置及方法
公开(公告)号：US20070158202A1
公开(公告)日：2007-07-12
申请号：US11488150
申请日：2006-07-18
申请人： Mizuki Nagai , Masao Hodai , Hiroyuki Kanda , Tsutomu Nakada , Takashi Kawakami
发明人： Mizuki Nagai , Masao Hodai , Hiroyuki Kanda , Tsutomu Nakada , Takashi Kawakami
IPC分类号： C25D21/18
CPC分类号： C25D17/001 , C25D7/123 , C25D17/002 , C25D21/14 , C25D21/18 , H01L21/2885 , H01L21/76877
摘要： A plating apparatus can keep concentrations of components of a plating solution constant over a long period of time and can stably form a plated film having a more uniform thickness on a surface of a substrate while minimizing an amount of the plating solution used. The plating apparatus includes a plating cell for carrying out electroplating of a surface of a substrate with a space between the surface of the substrate, serving as a cathode, and an insoluble anode filled with a plating solution, a plating solution circulation system for supplying the plating solution to the plating cell and recovering the plating solution in a circulatory manner, and a plating solution component replenishment system for supplying a replenisher solution, containing a component of the plating solution in a higher concentration than that in the plating solution, to the plating solution which circulates in the plating solution circulation system, thereby maintaining the concentration of the component in the plating solution within a predetermined range.
摘要翻译：电镀装置能够使电镀液的成分浓度恒定长时间稳定地形成在基材表面上具有更均匀厚度的电镀膜，同时最小化所用电镀液的量。电镀装置包括：电镀单元，用于在作为阴极的基板的表面和填充有电镀液的不溶性阳极之间具有空间的基板的表面进行电镀;电镀液循环系统，电镀液，并以循环方式回收电镀溶液，以及电镀液成分补充系统，用于将含有比镀液中的电镀液浓度高的电镀液成分的补充液供给电镀液溶液在电镀液循环系统中循环，从而将电镀溶液中的组分的浓度保持在预定范围内。

70. 发明申请

US20060285213A1 Light transmitting substrate with transparent conductive film 审中-公开
标题翻译：透光基板，透明导电膜
公开(公告)号：US20060285213A1
公开(公告)日：2006-12-21
申请号：US10558727
申请日：2004-05-26
申请人： Hiroyuki Kanda , Yasuhiro Seta , Tatsuya Ooashi
发明人： Hiroyuki Kanda , Yasuhiro Seta , Tatsuya Ooashi
IPC分类号： G02B27/10
CPC分类号： H01B1/08 , C23C18/1258 , G02F1/13439
摘要： A sufficiently high-transparent light transmitting substrate with a transparent conductive film, which is a light transmitting substrate with a transparent conductive film, includes a light transmitting substrate and a continuous transparent conductive film having a thickness of 12 to 2 nm formed on the light transmitting substrate. The transparent conductive film is made of an aggregate of columnar single crystals and has a maximum surface roughness within a range from 1 to 20 nm. It also has an average surface roughness within a range from 0.1 to 10 nm and is a thin film made of a tin-doped indium oxide. Tin atoms are uniformly distributed in the thin film made of the tin-doped indium oxide.
摘要翻译：作为具有透明导电膜的透光性基板的具有透明导电膜的充分透明的透光性基板具有形成在透光性基板上的透光性基板和厚度12〜2nm的连续透明导电膜基质。透明导电膜由柱状单晶的集合体构成，其最大表面粗糙度在1〜20nm的范围内。其平均表面粗糙度在0.1〜10nm的范围内，是由锡掺杂的氧化铟构成的薄膜。锡原子均匀分布在由锡掺杂的氧化铟制成的薄膜中。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式