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61. 发明授权

US06532555B1 Method and apparatus for integration of real-time tool data and in-line metrology for fault detection in an advanced process control (APC) framework 有权
标题翻译：用于在先进过程控制（APC）框架中集成实时工具数据和故障检测的在线计量的方法和装置
公开(公告)号：US06532555B1
公开(公告)日：2003-03-11
申请号：US09430475
申请日：1999-10-29
申请人： Michael Lee Miller , Qingsu Wang , Elfido Coss, Jr.
发明人： Michael Lee Miller , Qingsu Wang , Elfido Coss, Jr.
IPC分类号： G06F1100
CPC分类号： G05B19/4184 , G05B2219/37207 , G05B2219/45031 , Y02P90/14
摘要： A method and apparatus for providing near real-time fault detection in a manufacturing process is provided. The apparatus includes a processing tool adapted to manufacture a processing piece and an interface, coupled to the processing tool, for receiving operational data from the processing tool related to the manufacture of the processing piece, and product data defining characteristics of the processing piece. In one embodiment, the processing tool is in the form of semiconductor fabrication equipment and the processing piece is a silicon wafer. A fault detection unit is provided to determine if a fault condition exists with the processing tool from the operational data or with the processing piece from the product data. An Advanced Process Control (APC) framework is further provided to receive the operational and product data from the first interface, and to send the data to the fault detection unit.
摘要翻译：提供了一种用于在制造过程中提供近实时故障检测的方法和装置。该装置包括适于制造加工件和接口的加工工具，该处理件和接口耦合到处理工具，用于接收来自与加工件的制造相关的加工工具的操作数据，以及定义加工件特征的产品数据。在一个实施例中，处理工具是半导体制造设备的形式，并且处理件是硅晶片。提供故障检测单元，以从操作数据或来自产品数据的加工件确定处理工具是否存在故障状况。进一步提供高级过程控制（APC）框架以从第一接口接收操作和产品数据，并将数据发送到故障检测单元。

62. 发明授权

US06457587B1 Integrated reticle sorter and stocker 有权
标题翻译：集成标线分选机和储料机
公开(公告)号：US06457587B1
公开(公告)日：2002-10-01
申请号：US09545768
申请日：2000-04-10
申请人： Michael R. Conboy , Elfido Coss, Jr. , Russel Shirley
发明人： Michael R. Conboy , Elfido Coss, Jr. , Russel Shirley
IPC分类号： B07C500
CPC分类号： H01L21/67271 , G03F7/70741 , Y10S209/933
摘要： Reticles are selected for use in a wafer processing system based on the wafer-processing recipe and on the level of degradation exhibited by the reticle after multiple exposures to light and constant physical handling. In an example embodiment of an integrated reticle sorter and stocker, a scanner identifies the reticle and gathers dimensional data on each reticle. A sorter sorts reticles within reticle pods according to the processing recipe and stores the pods within a storage location in the stocker. A computer arrangement then records information from the scanner and the sorter and assesses whether any of the reticles has degraded beyond an acceptable level of usage.
摘要翻译：选择基于晶片处理配方的晶片处理系统中使用的网格以及多次曝光到光和恒定物理处理之后由掩模版显示的劣化程度。在集成的标线分类器和储片器的示例性实施例中，扫描器识别标线并且收集每个掩模版上的尺寸数据。分拣机根据处理配方将掩模版分类在标线盒内，并将荚存储在储存器的存储位置内。然后，计算机装置从扫描仪和分拣机记录信息，并评估是否任何一个掩模版已经超过可接受的使用水平。

63. 发明授权

US06356804B1 Automated material handling system method and arrangement 有权
标题翻译：自动化材料处理系统的方法和布置
公开(公告)号：US06356804B1
公开(公告)日：2002-03-12
申请号：US09519836
申请日：2000-03-06
申请人： Michael R. Conboy , Patrick J. Ryan , Elfido Coss, Jr.
发明人： Michael R. Conboy , Patrick J. Ryan , Elfido Coss, Jr.
IPC分类号： G06F700
CPC分类号： G06Q10/08 , Y10S414/14
摘要： A computer controlled manufacturing arrangement and method for selecting between multiple paths for transporting cassettes between processing locations. The manufacturing arrangement includes a plurality of stockers interconnected with tracks on which cassettes are carried on vehicles. A first and second stocker are interconnected by at least a first path and a second path formed by the tracks, and a cassette can be transported from the first to the second stocker via either of the two paths. A plurality of robotic arrangements are configured to transfer cassettes between the stockers and the vehicles. A data processing system is coupled to the robotic arrangements and configured and arranged to maintain an historical record of codes indicative of periods of time expended in transporting cassettes from the first stocker to the second stocker via the first path and second path, respectively. When a cassette is to be transported from the first stocker to the second stocker, the data processing system determines, as a function of the historical record of codes associated with the paths, which of the first or second paths is more likely to result in a lesser period of time in transporting the cassette, and selects one of the first or second paths according to which path is more likely to result in a lesser period of time in transporting the cassette. The robotic arrangement is then instructed to load the cassette on the vehicle of the selected path.
摘要翻译：一种用于在多个路径之间选择用于在处理位置之间传送盒的计算机控制的制造布置和方法。制造装置包括与轨道相互连接的多个储料器，盒子上载有车辆。第一和第二储料器通过由轨道形成的至少第一路径和第二路径相互连接，并且盒可以通过两条路径中的任一条从第一储存器运送到第二储料架。多个机器人装置构造成在储料器和车辆之间传送盒带。数据处理系统耦合到机器人装置，并且被配置和布置为分别保持指示经由第一路径和第二路径将运送盒从第一储料器运送到第二储料器的时间段的代码的历史记录。当盒子要从第一储盘器运送到第二储料器时，数据处理系统根据与路径相关联的代码的历史记录确定哪个第一或第二路径更有可能导致较少的运送盒子的时间段，并且根据哪一个路径更可能导致运送盒式磁带的较短的时间段选择第一或第二路径之一。然后指示机器人布置将盒装载到所选路径的车辆上。

64. 发明授权

US06338005B1 Managing test material in an automated material handling system 失效
标题翻译：在自动化材料处理系统中管理测试材料
公开(公告)号：US06338005B1
公开(公告)日：2002-01-08
申请号：US09387613
申请日：1999-08-31
申请人： Michael R. Conboy , Patrick J. Ryan , Elfido Coss, Jr.
发明人： Michael R. Conboy , Patrick J. Ryan , Elfido Coss, Jr.
IPC分类号： G06F700
CPC分类号： G06Q10/06
摘要： Methods and systems for managing test wafers an automated material handling system are provided. Test material is classified into a plurality of classes. A time profile for each class of test material for a time period is determined and the test material is placed into cassettes based on the determined time profile for each class. When a request to pick up a particular group of a test material class is received, a cassette is identifying for picking up the particular group based on the contents of the cassette.
摘要翻译：提供了用于管理测试晶片的方法和系统，其中包括自动化材料处理系统。测试材料分为多个类别。确定一段时间内每类测试材料的时间表，并根据每个类的确定的时间概况将测试材料放入盒中。当接收到拾取特定组的测试材料类的请求时，盒式磁带正在识别以基于盒的内容拾取特定组。

65. 发明授权

US06304999B1 Method and apparatus for embedded process control framework in tool systems 有权
标题翻译：工具系统中嵌入式过程控制框架的方法和装置
公开(公告)号：US06304999B1
公开(公告)日：2001-10-16
申请号：US09694139
申请日：2000-10-23
申请人： Anthony John Toprac , Elfido Coss, Jr.
发明人： Anthony John Toprac , Elfido Coss, Jr.
IPC分类号： G06F1750
CPC分类号： H01L22/20 , G05B19/41865 , Y02P90/20 , Y02P90/22
摘要： The present invention provides for a method and an apparatus for implementing an embedded process control into a manufacturing tool system. At least one semiconductor device is processed. An embedded process control procedure is performed in response to the processing of the semiconductor device. A subsequent process of semiconductor device is performed in response to the embedded process control procedure. The apparatus of the present invention comprises: a computer system; and at least one manufacturing tool system interfaced with the computer, the manufacturing tool system comprising an embedded process control system capable of receiving commands from the computer system and control a manufacturing process performed by the manufacturing tool system.
摘要翻译：本发明提供了一种用于将嵌入式过程控制实现到制造工具系统中的方法和装置。至少一个半导体器件被处理。响应于半导体器件的处理执行嵌入式工艺控制程序。响应于嵌入式过程控制过程执行后续的半导体器件的处理。本发明的装置包括：计算机系统; 以及与计算机接口的至少一个制造工具系统，所述制造工具系统包括能够从计算机系统接收命令并控制由制造工具系统执行的制造过程的嵌入式过程控制系统。

66. 发明授权

US5924833A Automated wafer transfer system 失效
标题翻译：自动晶圆传输系统
公开(公告)号：US5924833A
公开(公告)日：1999-07-20
申请号：US878788
申请日：1997-06-19
申请人： Michael R. Conboy , Gerald L. Goff , Elfido Coss, Jr.
发明人： Michael R. Conboy , Gerald L. Goff , Elfido Coss, Jr.
IPC分类号： B65G49/07 , H01L21/00 , H01L21/677
CPC分类号： H01L21/67201 , H01L21/67276 , H01L21/67727 , Y10S414/139 , Y10S414/14
摘要： An automated system is presented for containerless transfer of semiconductor wafers through a wall separating a first fabrication area and a second fabrication area. The system includes multiple containers for transporting the wafers, one or more air lock chambers, mass transfer systems, robotic arms, stock areas, and a control system. The containers (e.g., wafer boats) are dispersed between the first and second fabrication areas. A portion of the containers contain at least one semiconductor wafer, and the remainder of the containers are empty. The air lock chambers are positioned in sealed openings in the wall. The air lock chambers provide isolation between the first and second fabrication areas while permitting the transfer of semiconductor wafers between the fabrication areas. A mass transfer system is positioned within each air lock chamber and allows for containerless transfer of wafers through the air lock chamber. The stock areas provide storage areas for containers adjacent to each air lock chamber. The robotic arms are used to move the containers between the stock areas and each air lock chamber. The control system governs the dispersal of containers and the operations of the air lock chambers, the mass transfer systems, the robotic arms, and the stock areas.
摘要翻译：提出了一种自动化系统，用于通过分隔第一制造区域和第二制造区域的壁进行无容器转移半导体晶片。该系统包括用于运输晶片的多个容器，一个或多个气锁室，传质系统，机器人手臂，库存区域和控制系统。容器（例如，晶片舟皿）分散在第一和第二制造区域之间。容器的一部分包含至少一个半导体晶片，其余的容器是空的。气锁室位于墙上的密封开口中。气锁室在第一和第二制造区域之间提供隔离，同时允许在制造区域之间传输半导体晶片。质量传递系统位于每个空气锁定室内，并且允许通过气锁室的无盘式传送晶片。库区为每个气锁室附近的集装箱提供储存区域。机器人手臂用于在储存区域和每个气锁室之间移动容器。控制系统控制容器的分散以及气锁室，传质系统，机器人手臂和库区的操作。

67. 发明授权

US5904487A Electrode reshaping in a semiconductor etching device 失效
标题翻译：电极在半导体蚀刻装置中重塑
公开(公告)号：US5904487A
公开(公告)日：1999-05-18
申请号：US731028
申请日：1996-10-08
申请人： Michael R. Conboy , Elfido Coss, Jr.
发明人： Michael R. Conboy , Elfido Coss, Jr.
IPC分类号： G01N19/08
CPC分类号： H01L21/3065 , H01J37/32091 , H01J37/32541
摘要： An electrode reshaping process and apparatus is provided for use in a semiconductor etching device. A wafer is place between upper and lower electrodes of the semiconductor etching device. The apparatus and method selectively adjusts the shape of an upper electrode in the semiconductor etching device to compensate for non-uniformities inherent in the etching device. One or more motors attached to the upper electrode provide the electrode shaping forces in accordance with information provided by etch rate variation models stored in a host computer. With the shape of the upper electrode adjusted, the wafer can be etched more uniformally.
摘要翻译：提供了一种在半导体蚀刻装置中使用的电极整形工艺和装置。晶片位于半导体蚀刻装置的上下电极之间。该装置和方法选择性地调节半导体蚀刻装置中的上电极的形状，以补偿蚀刻装置固有的不均匀性。附接到上电极的一个或多个电动机根据存储在主计算机中的蚀刻速率变化模型提供的信息提供电极成形力。随着上电极的形状调整，可以更均匀地蚀刻晶片。

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