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61. 发明授权

US11557712B2 Vibration generating device and electronic equipment 有权
公开(公告)号：US11557712B2
公开(公告)日：2023-01-17
申请号：US16277783
申请日：2019-02-15
申请人： TAIYO YUDEN CO., LTD.
发明人： Hiroshi Hamada , Yukihiro Matsui , Fumihisa Ito , Takashi Tomita
IPC分类号： H01L41/09 , H01L41/27 , H01L41/047
摘要： A vibration generating device 10 includes: a diaphragm 11; and a first piezoelectric actuator 12 and a second piezoelectric actuator 13 attached on an upper surface 11a and a lower surface 11b of the diaphragm 11, respectively, so as to sandwich the diaphragm 11 therebetween in a vicinity of an end surface of the diaphragm 11, wherein, in a top view of the upper surface 11a of the diaphragm 11, the first piezoelectric actuator 12 is disposed at a position shifted with respect to the second piezoelectric actuator 13.

62. 发明授权

US11557433B2 Multilayer ceramic capacitor having certain thickness ratio of external electrode to cover layer 有权
公开(公告)号：US11557433B2
公开(公告)日：2023-01-17
申请号：US17227106
申请日：2021-04-09
申请人： TAIYO YUDEN CO., LTD.
发明人： Shohei Kitamura , Yukihiro Konishi , Kotaro Mizuno , Yoichi Kato , Yusuke Kowase , Toru Makino , Yoshinori Tanaka
IPC分类号： H01G4/232 , H01G4/30 , H01G4/12
摘要： A multilayer ceramic capacitor includes an element body of roughly rectangular solid shape which is constituted by dielectric layers alternately stacked with internal electrode layers having different polarities, with a pair of cover layers formed on it to cover the top and bottom faces in the direction of lamination of the foregoing, and which has a pair of principal faces, a pair of end faces, and a pair of side faces, wherein external electrodes are formed on the pair of end faces and at least one of the pair of principal faces of the element body, and Tt representing the thickness of the external electrode and Tc representing the thickness of the cover layer satisfy the relationship of 1/30≤Tt/Tc≤4/5, and the thickness of the cover layers, or Tc, is 10 μm or more but 30 μm or less.

63. 发明授权

US11557417B2 Coil component 有权
公开(公告)号：US11557417B2
公开(公告)日：2023-01-17
申请号：US17003158
申请日：2020-08-26
申请人： TAIYO YUDEN CO., LTD.
发明人： Takayuki Arai
IPC分类号： H01F17/00 , H01F5/00 , H01F27/28 , H01F27/29
摘要： A coil component according to one embodiment of the present invention includes: a base body having a plurality of magnetic layers; a first external electrode provided on the base body; a second external electrode provided on the base body and spaced from the first external electrode; a coil conductor provided in the base body; a first lead-out conductor including a first lead-out conductor first pattern and a first lead-out conductor second pattern; and a second lead-out conductor connecting a second end of the coil conductor and the second external electrode. The first lead-out conductor first pattern is provided between the magnetic layers so as to be connected to a first end of the coil conductor and the first external electrode. The first lead-out conductor second pattern is provided between the magnetic layers so as to be connected to the first lead-out conductor first pattern and the first external electrode.

64. 发明授权

US11532427B2 Coil component and electronic device 有权
公开(公告)号：US11532427B2
公开(公告)日：2022-12-20
申请号：US17404622
申请日：2021-08-17
申请人： TAIYO YUDEN CO., LTD.
发明人： Keizo Kawamura , Jun Ogasawara , Toshimasa Suzuki
IPC分类号： H01F27/24 , H01F27/29 , H01F17/04 , H01F41/076 , H01F27/28 , H05K1/18 , H05K3/34 , H01F27/32
摘要： A coil component, adopted to be mounted on an electronic device, includes: an element body part; a coil fixed to the element body part and constituted by a wound conductive wire; lead wires that are each extended from the conductive wire and led out from the coil, and whose tip parts are each disposed a bottom face, which is a mounting face, of the element body part; and terminal parts that are each constituted by the tip part and a metal member that is joined to the tip part on the bottom face, and also has an opening at a position overlapping the tip part in a direction intersecting the bottom face.

65. 发明授权

US11532424B2 Inductance element and electronic device 有权
公开(公告)号：US11532424B2
公开(公告)日：2022-12-20
申请号：US16685988
申请日：2019-11-15
申请人： TAIYO YUDEN CO., LTD.
发明人： Naoya Terauchi , Takayuki Arai
IPC分类号： H05K1/18 , H01F27/28 , H01F27/29
摘要： An inductance element includes: an insulative substrate body of a rectangular solid shape having length dimension L, height dimension H, and width dimension W, where 1.5≤W/H; at least one internal conductor built in the substrate body and capable of making an electrical current flow therethrough in one uniform direction orthogonal to a cross-section of the substrate body; and a pair of external electrodes provided on the surface of the substrate body in a manner respectively connected to both ends of the internal conductor, so that the internal conductor can make an electrical current flow therethrough in the one uniform direction; wherein, in the cross-section of the substrate body, a rectangular internal conductor region having height dimension Eh and width dimension Ew surrounds the internal conductor in a manner contacting the outermost positioned portions of the internal conductor in the height and width directions, wherein Ew/Eh>W/H.

66. 发明申请

US20220397555A1 GAS DETECTION DEVICE 有权
公开(公告)号：US20220397555A1
公开(公告)日：2022-12-15
申请号：US17893089
申请日：2022-08-22
申请人： TAIYO YUDEN CO., LTD.
发明人： Yasuhito HAGIWARA
IPC分类号： G01N29/02 , G01N33/00
摘要： A gas detection device according to an embodiment of the present invention includes a casing and a plurality of sensor elements. The casing includes a gas introducing port, a first chamber that communicates with the introducing port, a second chamber that communicates with the first chamber, a flow limiter that limits a flow of gas from the first chamber to the second chamber, and a gas exhausting portion that communicates with the second chamber. The plurality of sensor elements are disposed within the second chamber and have different detection sensitivities depending on a gas type.

67. 发明授权

US11527342B2 Coil component and electronic device 有权
公开(公告)号：US11527342B2
公开(公告)日：2022-12-13
申请号：US16421322
申请日：2019-05-23
申请人： TAIYO YUDEN CO., LTD.
发明人： Takayuki Arai , Naoya Terauchi , Shuichi Machida
IPC分类号： H01F5/04 , H01F17/04 , H01F27/24 , H01F27/29
摘要： In an exemplary embodiment, a coil component includes: a base part 10 containing a magnetic material; a flat coil 30 embedded in the base part 10, formed by a wound coil conductor 32 where an end part 34 and an end part 36 are located on the inner side and on the outer side of the windings, respectively; a lead conductor 50 and a lead conductor 52 connected to the end part 34 and the end part 36, respectively; an external electrode 60 and an external electrode 62 provided on the surface of the base part 10 and connected to the lead conductor 50 and the lead conductor 52, respectively. The lead conductor 50 is connected to the external electrode 60 in an area 42 on the inner side of the flat coil 30 as viewed from above in the axial direction of the flat coil 30.

68. 发明申请

US20220384109A1 CERAMIC ELECTRONIC DEVICE 有权
公开(公告)号：US20220384109A1
公开(公告)日：2022-12-01
申请号：US17728130
申请日：2022-04-25
申请人： TAIYO YUDEN CO., LTD.
发明人： Hidetoshi MASUDA , Minoru RYU , Teruo ATSUMI
IPC分类号： H01G4/008 , H01G4/30 , H01G4/12
摘要： A ceramic electronic device includes a multilayer chip in which a plurality of dielectric layers and a plurality of internal electrode layers are stacked. The plurality of internal electrode layers include Au. Each of the plurality of internal electrode layers includes an Au-containing layer of which an Au concentration with respect to all detected elements is 5 at % or more, on an interface between the each of the plurality of internal electrode layers and a dielectric layer next to the each of the plurality of internal electrode layers. A relationship of C≤500×t/T is satisfied when a thickness of the each of the plurality of internal electrode layers is T nm, a thickness of the Au-containing layer is t nm, and an Au concentration with respect to a total of Ni and Au in a whole of the each of the plurality of internal electrode layers is C at %.

69. 发明授权

US11515095B2 Multi-layer ceramic electronic component and circuit board 有权
公开(公告)号：US11515095B2
公开(公告)日：2022-11-29
申请号：US17170675
申请日：2021-02-08
申请人： TAIYO YUDEN CO., LTD.
发明人： Takashi Sasaki
IPC分类号： H01G4/005 , H01G4/12 , H01G4/232 , H01G4/30 , H05K1/18 , H05K3/34
摘要： A multi-layer ceramic electronic component includes: a ceramic body including first and second internal electrodes laminated in a first axis direction, first and second main surfaces facing in the first axis direction, and first and second end surfaces facing in a second axis direction orthogonal to the first axis, the first and second internal electrodes being drawn to those end surfaces; a first external electrode covering the first end surface and extending to the first main surface; and a second external electrode covering the second end surface and extending to the first main surface. Each external electrode includes a first region including a first outermost layer mainly containing tin and extending from the end surface to the first main surface, and a second region free from an outermost layer mainly containing tin and disposed adjacent to the first region in the first axis direction on the end surface.

70. 发明授权

US11515079B2 Laminated coil 有权
公开(公告)号：US11515079B2
公开(公告)日：2022-11-29
申请号：US15649228
申请日：2017-07-13
申请人： TAIYO YUDEN CO., LTD.
发明人： Takashi Nakajima , Keiko Shiroki
IPC分类号： H01F5/00 , H01F27/32 , H01F27/29 , H01F27/28 , H01F41/04
摘要： One object is to suppress thermal shrinkage of a cover resin layer at the time of thermal curing. A laminated coil according to one embodiment of the present invention is provided with a magnetic substrate formed of a sintered magnetic material, an insulation resin layer formed on the magnetic substrate, a cover resin layer formed on the insulation resin layer, and a coil conductor embedded in the insulation resin layer. In one embodiment of the present invention, said insulation resin layer includes a first resin and first filler particles, and said cover resin layer includes a second resin and second filler particles. A filling factor of the second filler particles in the cover resin layer is higher than a filling factor of the first filler particles in the insulation resin layer.

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