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51. 发明申请

US20150349490A1 SEMICONDUCTOR LASER DIODE 有权
标题翻译：半导体激光二极管
公开(公告)号：US20150349490A1
公开(公告)日：2015-12-03
申请号：US14727426
申请日：2015-06-01
申请人： Sumitomo Electric Device Innovations, Inc.
发明人： Toshiyuki TAGUCHI
IPC分类号： H01S5/062 , H01S5/042 , H01S5/22 , H01S5/343 , H01S5/20
CPC分类号： H01S5/062 , H01S5/02276 , H01S5/0422 , H01S5/0425 , H01S5/0427 , H01S5/06213 , H01S5/2031 , H01S5/22 , H01S5/3434
摘要： A semiconductor laser diode is disclosed. The semiconductor laser diode including a primary surface constituted by two short sides and two long sides, comprises: an active layer; an electrode provided above the active layer; a first pad connected to the electrode; a second pad connected to the first pad; an inner interconnection configured to connect the electrode to the first pad electrically, the inner interconnection being provided along the long sides; and an outer interconnection configured to connect the first pad to the second pad electrically, the outer interconnection being provided along the long sides, the outer interconnection having a width along the short sides narrower than a width of the first pad along the short sides and a width of the second pad along the short sides. The active layer, the first pad, and the second pad are arranged along the long sides.
摘要翻译：公开了半导体激光二极管。包括由两个短边和两个长边构成的主表面的半导体激光二极管包括：有源层; 设置在有源层上方的电极; 连接到电极的第一焊盘; 连接到第一垫的第二垫; 内部互连，其被配置为将电极与第一焊盘电连接，内部互连沿着长边设置; 以及外部互连，其被配置为将所述第一焊盘电连接到所述第二焊盘，所述外部互连沿着所述长边设置，所述外部互连具有沿着所述短边窄于所述第一焊盘的宽度的短边的宽度，以及第二垫沿着短边的宽度。有源层，第一焊盘和第二焊盘沿着长边布置。

52. 发明授权

US09203523B2 Modular chip layout for active optical links 有权
标题翻译：主动光链路的模块化芯片布局
公开(公告)号：US09203523B2
公开(公告)日：2015-12-01
申请号：US13460276
申请日：2012-04-30
申请人： Steen Bak Christensen , Thorkild Franck
发明人： Steen Bak Christensen , Thorkild Franck
IPC分类号： G02B6/12 , H04B10/80 , H01S5/022 , H01S5/42
CPC分类号： H04B10/801 , H01L2224/16225 , H01S5/02276 , H01S5/423
摘要： The present invention relates to a flexible method of provide chips for optical interconnect with different number of channels.
摘要翻译：本发明涉及提供具有不同数量信道的光互连的芯片的灵活方法。

53. 发明申请

US20150280400A1 DIRECTLY MODULATED LASER FOR PON APPLICATION 有权
标题翻译：用于PON应用的直接调制激光
公开(公告)号：US20150280400A1
公开(公告)日：2015-10-01
申请号：US14737026
申请日：2015-06-11
申请人： Finisar Corporation
发明人： Yasuhiro Matsui
IPC分类号： H01S5/062 , H01S5/0625 , H04B10/50 , H01S5/20 , H01S5/343 , H01S5/026 , H01S5/12
CPC分类号： H01S5/0085 , B82Y20/00 , H01S5/0035 , H01S5/02276 , H01S5/026 , H01S5/0265 , H01S5/06226 , H01S5/06256 , H01S5/1221 , H01S5/20 , H01S5/34 , H01S5/3415 , H01S5/3416 , H01S5/34306 , H01S5/34313 , H01S5/3434 , H04B10/504
摘要： In an embodiment, a laser includes a gain section. The gain section includes an active region, an upper separate confinement heterostructure (SCH), and a lower SCH. The upper SCH is above the active region and has a thickness of at least 60 nanometers (nm). The lower SCH is below the active region and has a thickness of at least 60 nm.
摘要翻译：在一个实施例中，激光器包括增益部分。增益部分包括有源区，上分离限制异质结构（SCH）和下SCH。上层SCH高于有源区，其厚度至少为60纳米（nm）。较低的SCH低于有源区，并具有至少60nm的厚度。

54. 发明申请

US20150211724A1 LASER PACKAGE HAVING MULTIPLE EMITTERS CONFIGURED ON A SUPPORT MEMBER 审中-公开
标题翻译：具有配置在支持会员上的多个发射器的激光包装
公开(公告)号：US20150211724A1
公开(公告)日：2015-07-30
申请号：US14684240
申请日：2015-04-10
申请人： Soraa Laser Diode, Inc.
发明人： Eric Goutain , James W. Raring , Paul Rudy , Hua Huang
IPC分类号： F21V29/71 , F21K99/00 , H01S5/024 , F21V29/83 , F21V8/00 , H01S5/00 , F21V9/16 , F21V23/06
CPC分类号： F21K9/60 , B82Y20/00 , F21K9/62 , F21K9/64 , F21V9/30 , F21V23/06 , F21V29/713 , F21V29/83 , F21Y2101/00 , F21Y2115/10 , F21Y2115/30 , G02B6/0005 , G02B6/26 , G02B6/27 , G02B6/4214 , G02B6/4249 , H01L2224/45124 , H01L2224/48091 , H01L2924/00014 , H01S5/0021 , H01S5/005 , H01S5/0085 , H01S5/0092 , H01S5/02208 , H01S5/02224 , H01S5/02236 , H01S5/02252 , H01S5/02276 , H01S5/02284 , H01S5/02292 , H01S5/02469 , H01S5/02476 , H01S5/0287 , H01S5/0425 , H01S5/2201 , H01S5/32341 , H01S5/3235 , H01S5/34333 , H01S5/4012 , H01S5/4025 , H01S5/4031 , H01S5/4056 , H01S2301/14 , H01S2304/04
摘要： A method and device for emitting electromagnetic radiation at high power using nonpolar or semipolar gallium containing substrates such as GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, is provided. In various embodiments, the laser device includes plural laser emitters emitting green or blue laser light, integrated a substrate.
摘要翻译：提供了一种使用非极性或半极性含镓衬底如GaN，AlN，InN，InGaN，AlGaN和AlInGaN发射高功率电磁辐射的方法和装置。在各种实施例中，激光装置包括发射绿色或蓝色激光的多个激光发射器，集成了一个衬底。

55. 发明授权

US09059569B2 Nitride semiconductor light-emitting system 有权
标题翻译：氮化物半导体发光系统
公开(公告)号：US09059569B2
公开(公告)日：2015-06-16
申请号：US14273496
申请日：2014-05-08
申请人： PANASONIC CORPORATION
发明人： Kazuhiko Yamanaka , Shinji Yoshida
IPC分类号： H01L33/62 , H01L23/12 , H01S5/022 , H01S5/30 , H01L33/48 , H01L23/045 , H01S5/22 , H01S5/00 , H01S5/024 , H01S5/323 , H01S5/40 , H01S5/02
CPC分类号： H01S5/30 , H01L23/045 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2924/12044 , H01S5/005 , H01S5/02 , H01S5/02212 , H01S5/02224 , H01S5/02276 , H01S5/02296 , H01S5/024 , H01S5/02469 , H01S5/02492 , H01S5/2224 , H01S5/32341 , H01S5/4018 , H01L2924/00014 , H01L2924/00
摘要： A nitride semiconductor light-emitting system includes a nitride semiconductor light-emitting device, a base mount holding the nitride semiconductor light-emitting device, having an opening, and containing first metal as a main component, a cap adhered to the base mount, and a lead pin penetrating the opening. The lead pin is fixed to an inner wall of the opening with an insulating member and a buffer member interposed therebetween, the buffer member and the insulating member being stacked on the inner wall in this order. The insulating member contains silicon oxide as a component. The buffer member is made of second metal having a smaller standard oxidation-reduction potential than the first metal, or an alloy containing the second metal.
摘要翻译：氮化物半导体发光系统包括氮化物半导体发光器件，保持氮化物半导体发光器件的基座，具有开口，并且包含第一金属作为主要部件，附接到基座的帽，以及一个引脚穿过开口。引导销固定在开口的内壁上，绝缘构件和缓冲构件插入其间，缓冲构件和绝缘构件依次堆叠在内壁上。绝缘构件包含氧化硅作为组分。缓冲部件由具有比第一金属更小的标准氧化还原电位的第二金属或含有第二金属的合金制成。

56. 发明授权

US09058971B2 Electro-optical module 有权
标题翻译：电光模块
公开(公告)号：US09058971B2
公开(公告)日：2015-06-16
申请号：US13905703
申请日：2013-05-30
申请人： Siliconware Precision Industries Co., Ltd.
发明人： Chih-Yuan Shih , Shih-Liang Peng , Jung-Pin Huang , Chin-Yu Ku , Hsien-Wen Chen
IPC分类号： H01L27/15 , H01L29/26 , H01L31/12 , H01L33/00 , H01L25/00 , H01S5/022 , H01S5/024 , H01S5/062 , H01S5/42
CPC分类号： H01L25/00 , H01L2224/48091 , H01S5/02252 , H01S5/0226 , H01S5/02276 , H01S5/02288 , H01S5/02469 , H01S5/06226 , H01S5/423 , H01L2924/00014
摘要： An electro-optical module is provided, which includes: a substrate having a first surface with a groove and an opposite second surface; a plurality of support members disposed on the first surface of the substrate; at least an electro-optical element having opposite active and non-active surfaces and disposed in the groove of the substrate via the non-active surface thereof; an interposer disposed on the first surface of the substrate and the electro-optical element for electrically connecting the electro-optical element to the substrate, wherein the interposer has a through hole corresponding in position to the active surface of the electro-optical element; and a transparent plate disposed over the first surface of the substrate and the interposer through the support members and having a lens portion corresponding in position to the through hole of the interposer, thereby reducing signal losses, improving alignment precision, and achieving preferred thermal dissipation and EMI shielding effects.
摘要翻译：提供了一种电光模块，其包括：具有第一表面和第二表面的基板; 设置在所述基板的第一表面上的多个支撑构件; 至少一个电光元件具有相对的有源和非有源表面，并经由其非有效表面设置在衬底的沟槽中; 设置在基板的第一表面上的插入器和用于将电光元件电连接到基板的电光元件，其中插入器具有与电光元件的有源表面相对应的通孔; 以及设置在基板的第一表面上的透明板和穿过支撑构件的中介层，并且具有与插入件的通孔对应的透镜部分，从而减少信号损失，提高对准精度，并实现优选的散热和 EMI屏蔽效果。

57. 发明授权

US09049797B2 Electrically bonded arrays of transfer printed active components 有权
标题翻译：转印印刷活性组件的电子结合阵列
公开(公告)号：US09049797B2
公开(公告)日：2015-06-02
申请号：US13638040
申请日：2011-03-22
申请人： Etienne Menard , Christopher Bower , Matthew Meitl , Philip Garrou
发明人： Etienne Menard , Christopher Bower , Matthew Meitl , Philip Garrou
IPC分类号： H05K7/00 , H05K1/16 , B23K31/00 , H05K1/18 , H01L21/683 , H01L21/768 , H01L23/48 , H01L27/12 , H01L27/146 , H01L31/0203 , H01L31/048 , H05K13/04 , H01L23/00 , H01S5/022
CPC分类号： H05K7/06 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L24/02 , H01L24/05 , H01L24/08 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/83 , H01L24/92 , H01L27/1214 , H01L27/1266 , H01L27/14618 , H01L31/0203 , H01L31/048 , H01L2221/6835 , H01L2221/68372 , H01L2221/68381 , H01L2224/02371 , H01L2224/02372 , H01L2224/0239 , H01L2224/04026 , H01L2224/05548 , H01L2224/056 , H01L2224/08238 , H01L2224/24011 , H01L2224/24137 , H01L2224/24147 , H01L2224/24226 , H01L2224/245 , H01L2224/24998 , H01L2224/2731 , H01L2224/29078 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29344 , H01L2224/3012 , H01L2224/32104 , H01L2224/32146 , H01L2224/32227 , H01L2224/73267 , H01L2224/76155 , H01L2224/80203 , H01L2224/80224 , H01L2224/81192 , H01L2224/82007 , H01L2224/821 , H01L2224/82102 , H01L2224/82106 , H01L2224/83093 , H01L2224/83121 , H01L2224/83191 , H01L2224/83192 , H01L2224/83805 , H01L2224/83815 , H01L2224/8384 , H01L2224/83851 , H01L2224/83855 , H01L2224/83859 , H01L2224/83862 , H01L2224/83868 , H01L2224/83871 , H01L2224/83874 , H01L2224/92143 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15787 , H01S5/02236 , H01S5/02276 , H05K1/18 , H05K3/0058 , H05K3/10 , H05K13/04 , H05K13/046 , Y02E10/50 , Y10T29/41 , Y10T29/4913 , Y10T29/49139 , H01L2924/00014 , H01L2924/00 , H01L2224/13111
摘要： An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.
摘要翻译：有源元件阵列包括具有形成在目标基板一侧上的一个或多个触点的目标基板和分布在目标基板上的一个或多个可印刷的有源元件。每个有源部件包括有源层，其具有形成在有源层的顶侧上或其中的上侧和相对的底侧以及一个或多个有源元件。有源元件电连接到触点，并且底侧粘附到目标基板。还讨论了相关的制造方法。

58. 发明授权

US09025635B2 Laser package having multiple emitters configured on a support member 有权
标题翻译：具有配置在支撑构件上的多个发射器的激光器组件
公开(公告)号：US09025635B2
公开(公告)日：2015-05-05
申请号：US13732233
申请日：2012-12-31
申请人： Soraa, Inc.
发明人： Eric Goutain , James W. Raring , Paul Rudy , Hua Huang
IPC分类号： H01S5/22 , G02B6/27 , H01S5/343 , B82Y20/00 , G02B6/42 , H01S5/00 , H01S5/022 , H01S5/024 , H01S5/028 , H01S5/40 , H01S5/042
CPC分类号： F21K9/60 , B82Y20/00 , F21K9/62 , F21K9/64 , F21V9/30 , F21V23/06 , F21V29/713 , F21V29/83 , F21Y2101/00 , F21Y2115/10 , F21Y2115/30 , G02B6/0005 , G02B6/26 , G02B6/27 , G02B6/4214 , G02B6/4249 , H01L2224/45124 , H01L2224/48091 , H01L2924/00014 , H01S5/0021 , H01S5/005 , H01S5/0085 , H01S5/0092 , H01S5/02208 , H01S5/02224 , H01S5/02236 , H01S5/02252 , H01S5/02276 , H01S5/02284 , H01S5/02292 , H01S5/02469 , H01S5/02476 , H01S5/0287 , H01S5/0425 , H01S5/2201 , H01S5/32341 , H01S5/3235 , H01S5/34333 , H01S5/4012 , H01S5/4025 , H01S5/4031 , H01S5/4056 , H01S2301/14 , H01S2304/04
摘要： A method and device for emitting electromagnetic radiation at high power using nonpolar or semipolar gallium containing substrates such as GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, is provided. In various embodiments, the laser device includes plural laser emitters emitting green or blue laser light, integrated a substrate.
摘要翻译：提供了一种使用非极性或半极性含镓衬底如GaN，AlN，InN，InGaN，AlGaN和AlInGaN发射高功率电磁辐射的方法和装置。在各种实施例中，激光装置包括发射绿色或蓝色激光的多个激光发射器，集成了一个衬底。

59. 发明申请

US20150069113A1 VCSEL Packaging 有权
标题翻译： VCSEL包装
公开(公告)号：US20150069113A1
公开(公告)日：2015-03-12
申请号：US14479325
申请日：2014-09-07
申请人： PRINCETON OPTRONICS INC.
发明人： Qing Wang , Jean-Francois Seurin , Chuni Lal Ghosh , Laurence Watkins
IPC分类号： H01S5/022 , B23K1/00 , H01S5/00
CPC分类号： H01S5/02272 , B23K1/0016 , B23K1/012 , B23K2101/42 , H01L2224/16225 , H01L2224/48091 , H01L2224/49175 , H01S5/0042 , H01S5/02276 , H01S5/423 , H05K1/0206 , H05K3/3436 , H05K3/3494 , H05K2201/10121 , H05K2201/10727 , H05K2203/085 , Y02P70/613 , H01L2924/00014
摘要： A process to bond VCSEL arrays to submounts and printed circuit boards is provided. The process is particularly suited to large area thin and ultra-thin VCSEL arrays susceptible to bending and warping. The process integrates a flatness measurement step and applying appropriate combination of pressure prior to bonding the VCSEL array to the submount or a printed circuit using a vacuum flux-less bonding process. The process is very promising in making very good quality bonding between the VCSEL array and a submount or a printed circuit board. The process is applied to construct optical modules with improved flatness that may be integrated with other electronic components in constructing optoelectronic systems.
摘要翻译：提供了将VCSEL阵列绑定到底座和印刷电路板的过程。该工艺特别适用于容易弯曲和翘曲的大面积薄型和超薄型VCSEL阵列。该过程集成了平坦度测量步骤，并且在使用真空无焊接接合工艺将VCSEL阵列与基座或印刷电路结合之前应用适当的压力组合。该过程非常有希望在VCSEL阵列与底座或印刷电路板之间进行非常好的质量接合。该方法应用于构建具有改进的平坦度的光学模块，其可以与构建光电子系统的其它电子部件集成。

60. 发明申请

US20150036107A1 LIGHT SOURCE UNIT AND OPTICAL ENGINE 有权
标题翻译：光源单元和光学发动机
公开(公告)号：US20150036107A1
公开(公告)日：2015-02-05
申请号：US14449085
申请日：2014-07-31
申请人： Nichia Corporation
发明人： Seiji NAGAHARA , Takashi Sasamuro , Eiichiro Okahisa
IPC分类号： G03B21/20 , F21V14/08 , H04N9/31 , F21V13/14 , F21V8/00 , F21K99/00 , H01S5/022
CPC分类号： G03B21/204 , G02B6/0096 , G02B26/008 , G02B27/102 , G03B21/208 , G03B33/08 , H01S5/005 , H01S5/0071 , H01S5/02248 , H01S5/02276 , H01S5/4012 , H01S5/4018 , H01S5/4025 , H01S5/4056 , H04N9/3114 , H04N9/3158 , H04N9/3161
摘要： Provided is a light source unit that includes: one or more kinds of phosphor; a substrate, on which the one or more kinds of phosphor is applied; a plurality of semiconductor laser elements arrayed at a predetermined interval in a package, wherein each of the semiconductor laser elements emits a laser light beam through a light emission region; and a first optical system that comprises a first lens system, a multiplexing optical member having a light entering surface and a light exiting surface, and a second lens system, wherein the first optical system directs the laser light beams emitted from the respective semiconductor laser elements toward the substrate, the first lens system receives the laser light beams emitted from the respective semiconductor laser elements directly without substantial parallelization of the respective received laser light beams, and condenses the received laser light beams on the light entering surface of the multiplexing optical member, the multiplexing optical member multiplexes the laser light beams condensed by the first lens system, into a multiplexed laser light beam having a spatially-uniform intensity distribution, and the second lens system condenses the multiplexed laser light beam that has exited from the light exiting surface of the multiplexing optical member onto the one or more kinds of phosphor.
摘要翻译：提供一种光源单元，其包括：一种或多种荧光体; 在其上施加一种或多种荧光体的基板; 多个半导体激光元件以预定间隔排列在封装中，其中每个半导体激光元件通过发光区域发射激光束; 以及第一光学系统，其包括第一透镜系统，具有光入射表面的多路复用光学构件和光出射表面，以及第二透镜系统，其中所述第一光学系统引导从各个半导体激光元件发射的激光束朝向基板，第一透镜系统直接接收从各个半导体激光元件发射的激光束，而不会使各个接收的激光束基本上平行化，并将接收的激光光束聚光在多路复用光学部件的光入射表面上，所述多路复用光学部件将由所述第一透镜系统聚光的激光束复用为具有空间均匀强度分布的复用激光束，并且所述第二透镜系统使从所述第一透镜系统的光出射面退出的多路复用激光束所述复用光学部件在所述一种或多种类型上的磷光体。

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