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    • 53. 发明申请
    • PARTIALLY DEPLETED SOI FIELD EFFECT TRANSISTOR HAVING A METALLIZED SOURCE SIDE HALO REGION
    • 具有金属化源侧HALO区域的部分沉积SOI场效应晶体管
    • US20090321831A1
    • 2009-12-31
    • US12554344
    • 2009-09-04
    • Jin CaiWilfried HaenschAmlan Majumdar
    • Jin CaiWilfried HaenschAmlan Majumdar
    • H01L29/786
    • H01L29/78696H01L29/458H01L29/66772H01L29/78612H01L29/78624
    • Source and drain extension regions and source side halo region and drain side halo region are formed in a top semiconductor layer aligned with a gate stack on an SOI substrate. A deep source region and a deep drain region are formed asymmetrically in the top semiconductor layer by an angled ion implantation. The deep source region is offset away from one of the outer edges of the at least spacer to expose the source extension region on the surface of the semiconductor substrate. A source metal semiconductor alloy is formed by reacting a metal layer with portions of the deep source region, the source extension region, and the source side halo region. The source metal semiconductor alloy abuts the remaining portion of the source side halo region, providing a body contact tied to the deep source region to the partially depleted SOI MOSFET.
    • 源极和漏极延伸区域和源极侧卤素区域和漏极侧晕圈形成在与SOI衬底上的栅极堆叠对准的顶部半导体层中。 通过成角度的离子注入,在顶部半导体层中不均匀地形成深源区和深漏区。 深源区域远离至少间隔物的外缘之一偏离以暴露半导体衬底的表面上的源延伸区域。 源金属半导体合金通过使金属层与深源区,源极延伸区和源极侧晕区的一部分反应而形成。 源极金属半导体合金与源极侧光晕区域的剩余部分相邻,从而将与源极区域连接的体接触部分连接到部分耗尽的SOI MOSFET。
    • 56. 发明授权
    • Thin film power MOS transistor, apparatus, and method
    • 薄膜功率MOS晶体管,装置和方法
    • US07514714B2
    • 2009-04-07
    • US11355937
    • 2006-02-16
    • Ming FangFuchao Wang
    • Ming FangFuchao Wang
    • H01L27/108H01L29/04H01L29/12H01L29/76H01L31/036H01L31/112
    • H01L29/78624H01L29/086H01L29/42368H01L29/7824
    • A thin film power transistor includes a plurality of first doped regions over a substrate and a second doped region forming a body. At least a portion of the body is disposed between the plurality of first doped regions. The thin film power transistor also includes a gate over the substrate. The thin film power transistor further includes a dielectric layer, at least a portion of which is disposed between (i) the gate and (ii) the first and second doped regions. In addition, the thin film power transistor includes a plurality of contacts contacting the plurality of first doped regions, where the plurality of first doped regions forms a source and a drain of the thin film power transistor. The first doped regions could represent n-type regions (such as N− regions), and the second doped region could represent a p-type region (such as a P− region). The first doped regions could also represent p-type regions, and the second doped region could represent an n-type region.
    • 薄膜功率晶体管包括在衬底上的多个第一掺杂区域和形成主体的第二掺杂区域。 身体的至少一部分设置在多个第一掺杂区域之间。 薄膜功率晶体管还包括在衬底上的栅极。 薄膜功率晶体管还包括介电层,其至少一部分设置在(i)栅极和(ii)第一和第二掺杂区域之间。 此外,薄膜功率晶体管包括接触多个第一掺杂区域的多个触点,其中多个第一掺杂区域形成薄膜功率晶体管的源极和漏极。 第一掺杂区域可以表示n型区域(例如N区域),并且第二掺杂区域可以表示p型区域(例如P-区域)。 第一掺杂区域也可以表示p型区域,第二掺杂区域可以表示n型区域。
    • 58. 发明授权
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US07470956B2
    • 2008-12-30
    • US11395772
    • 2006-03-31
    • Tetsuya Takahashi
    • Tetsuya Takahashi
    • H01L29/72
    • H01L29/861H01L29/0649H01L29/0653H01L29/0878H01L29/7394H01L29/7824H01L29/78624H01L29/868
    • A semiconductor device has a semiconductor base, an anode electrode, and a cathode electrode. The semiconductor base includes a P type semiconductor substrate, an insulating film, an N− type semiconductor region formed on the insulating film, an N+ type semiconductor region, and a P+ type semiconductor region facing the N+ type semiconductor region via the N− type semiconductor region. The semiconductor device further has an N type diffusion layer which is formed, in the N− type semiconductor region at the interface between the insulating film and the N− type semiconductor region, so as to have a concentration gradient such that the N type impurity concentration increases from the side of the anode electrode to the side of the cathode electrode.
    • 半导体器件具有半导体基底,阳极电极和阴极电极。 半导体基底包括P型半导体衬底,绝缘膜,形成在绝缘膜上的N-型半导体区域,N +型半导体区域和经由N型半导体面向N +型半导体区域的P +型半导体区域 地区。 半导体器件还具有N型扩散层,其在绝缘膜和N-型半导体区域之间的界面处的N型半导体区域中形成为具有使N型杂质浓度 从阳极侧到阴极侧增加。
    • 60. 发明申请
    • ASYMMETRIC FIELD EFFECT TRANSISTORS (FETs)
    • 非对称场效应晶体管(FET)
    • US20080290422A1
    • 2008-11-27
    • US12169068
    • 2008-07-08
    • Edward J. Nowak
    • Edward J. Nowak
    • H01L29/78
    • H01L29/7391H01L29/785H01L29/7856H01L29/78624
    • A semiconductor structure. The structure includes (a) a semiconductor channel region, (b) a semiconductor source block in direct physical contact with the semiconductor channel region; (c) a source contact region in direct physical contact with the semiconductor source block, wherein the source contact region comprises a first electrically conducting material, and wherein the semiconductor source block physically isolates the source contact region from the semiconductor channel region, and (d) a drain contact region in direct physical contact with the semiconductor channel region, wherein the semiconductor channel region is disposed between the semiconductor source block and the drain contact region, and wherein the drain contact region comprises a second electrically conducting material; and (e) a gate stack in direct physical contact with the semiconductor channel region.
    • 半导体结构。 该结构包括(a)半导体沟道区,(b)与半导体沟道区直接物理接触的半导体源块; (c)与半导体源极块直接物理接触的源极接触区域,其中源极接触区域包括第一导电材料,并且其中半导体源极块将源极接触区域与半导体沟道区域物理隔离,并且(d )与所述半导体沟道区域直接物理接触的漏极接触区域,其中所述半导体沟道区域设置在所述半导体源极块和所述漏极接触区域之间,并且其中所述漏极接触区域包括第二导电材料; 和(e)与半导体沟道区直接物理接触的栅叠层。