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    • 51. 发明授权
    • Passive cooling systems and methods for electronics
    • 被动冷却系统和电子方法
    • US08953318B1
    • 2015-02-10
    • US13231771
    • 2011-09-13
    • James E. SmithWilliam Bishop
    • James E. SmithWilliam Bishop
    • H05K7/20
    • H05K7/2029H01L23/427H01L2924/0002H01L2924/00
    • Embodiments of the present disclosure generally pertain to passive cooling systems and methods for electronics. An exemplary passive cooling system for electronics has a circuit package and dielectric liquid. The circuit package has a cover positioned over a circuit element coupled to a substrate. The cover is attached to the substrate and creates a water-tight seal around the circuit element. The circuit package further has a porous media. The dielectric liquid directly contacts the circuit element, and heat from the circuit element is transferred to the dielectric liquid. As the liquid reaches its boiling point, vapor from the liquid is passed through the porous media for further cooling.
    • 本公开的实施例通常涉及用于电子设备的被动冷却系统和方法。 用于电子器件的示例性被动冷却系统具有电路封装和电介质液体。 电路封装具有位于耦合到衬底的电路元件上的盖。 盖子连接到基板上,并在电路元件周围产生防水密封。 电路封装还具有多孔介质。 电介质液体直接接触电路元件,并且来自电路元件的热量传递到电介质液体。 当液体达到其沸点时,来自液体的蒸气通过多孔介质进一步冷却。