专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明授权

US06860731B2 Mold for encapsulating a semiconductor chip 有权
标题翻译：用于封装半导体芯片的模具
公开(公告)号：US06860731B2
公开(公告)日：2005-03-01
申请号：US09901517
申请日：2001-07-09
申请人： Shu Chuen Ho , Teng Hock Kuah , Man Ho Hui , Srikanth Narasimulau , Murali Sarangapani
发明人： Shu Chuen Ho , Teng Hock Kuah , Man Ho Hui , Srikanth Narasimulau , Murali Sarangapani
IPC分类号： H01L21/56 , B29C45/14
CPC分类号： H01L21/565 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , H01L2924/00014
摘要： A mold has two mold halves (6, 7). One of the mold halves (6) includes a contact section (8) which is adapted to contact a surface (5) of a semiconductor chip (1) mounted in the mold, in use.
摘要翻译：模具具有两个半模（6,7）。半模（6）中的一个包括接触部分（8），该接触部分适于在使用中接触安装在模具中的半导体芯片（1）的表面（5）。

52. 发明申请

US20040232203A1 Clamping device 有权
标题翻译：夹紧装置
公开(公告)号：US20040232203A1
公开(公告)日：2004-11-25
申请号：US10441859
申请日：2003-05-19
申请人： ASM Technology Singapore Pte Ltd
发明人： Ajit S. Gaunekar , Gary Peter Widdowson
IPC分类号： B23K037/04
CPC分类号： H01L24/78 , B23K20/004 , B23K37/0435 , B25B5/04 , B25B5/06 , H01L2224/786 , H01L2224/851 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2224/48 , H01L2224/45099
摘要： A clamping device is provided for clamping an object, such as bonding wire for a wire bonding machine. The device comprises a pair of clamping arms arranged in pivotal relationship with each other about a pivot point, the clamping arms having clamping ends movable between an open position and a closed position. An attraction device is operative to provide an attraction force between the clamping arms about the pivot point. The device includes biasing means that is operative to provide a biasing force in opposition to the attraction force about the pivot point, such that the biasing force is operative to bias the clamping ends towards the closed position. In a preferred embodiment, the biasing means comprises a flexure bearing.
摘要翻译：提供夹紧装置用于夹紧物体，例如用于引线接合机的接合线。该装置包括一对夹紧臂，其相对于枢转点彼此枢转地布置，夹紧臂具有可在打开位置和关闭位置之间移动的夹紧端。吸引装置可操作以在夹持臂围绕枢转点提供吸引力。该装置包括偏压装置，其可操作地提供与围绕枢转点的吸引力相反的偏压力，使得偏压力可操作以将夹持端朝向关闭位置偏置。在优选实施例中，偏置装置包括挠曲轴承。

53. 发明申请

US20040217656A1 Cooling system for motors 有权
标题翻译：电机冷却系统
公开(公告)号：US20040217656A1
公开(公告)日：2004-11-04
申请号：US10426081
申请日：2003-04-29
申请人： ASM Technology Singapore Pte Ltd
发明人： Wen Chen , Huai Xin Niu
IPC分类号： H02K041/00 , H02K009/00
CPC分类号： H02K41/03 , H02K3/24 , H02K9/00
摘要： The invention provides a cooling system and method for a motor having a movable component, which may be a moving coil bracket of a linear motor. The system comprises a fluid transmission tube extending adjacent to a heat-emitting surface of the movable component to direct a cooling fluid over the heat-emitting surface, wherein the fluid transmission tube is adapted to move in conjunction with the movable component of the motor.
摘要翻译：本发明提供一种用于具有可移动部件的电动机的冷却系统和方法，所述可移动部件可以是线性电动机的移动线圈支架。该系统包括与可移动部件的发热表面相邻延伸的流体传输管，以将冷却流体引导到发热表面上，其中流体传输管适合与马达的可移动部件一起移动。

54. 发明申请

US20040189101A1 Active vibration attenuation 有权
标题翻译：主动振动衰减
公开(公告)号：US20040189101A1
公开(公告)日：2004-09-30
申请号：US10402184
申请日：2003-03-26
申请人： ASM Technology Singapore Pte Ltd
发明人： Bao Nian Zhai , Ka Shing Kenny Kwan , Wen Chen , Gang Ou , You Yong Liao
IPC分类号： H02K041/00
CPC分类号： H01L24/78 , H01L2224/78 , H01L2224/78301 , H01L2924/00014 , H01L2924/01033 , H01L2924/01039 , H02K41/0356 , H01L2224/48 , H01L2224/45099 , H01L2924/00
摘要： An apparatus and method are provided for attenuating vibration when driving an object. The apparatus includes a driving device for generating a driving force to drive the object and an attenuation actuator mounted in reciprocal relationship with the driving device for generating an attenuation force substantially concurrently with the generation of the driving force. The attenuation force is generated so as to oppose and at least partially cancel a reaction force exerted by the object in response to the driving force.
摘要翻译：提供一种用于在驱动物体时衰减振动的装置和方法。该装置包括用于产生用于驱动物体的驱动力的驱动装置和与驱动装置成互相关系地安装的衰减致动器，用于与产生驱动力大致同时产生衰减力。产生衰减力，以便响应于驱动力而反对并且至少部分地抵消由对象施加的反作用力。

55. 发明申请

US20040178327A1 Determination of a movable gantry position 有权
标题翻译：确定可移动的龙门架位置
公开(公告)号：US20040178327A1
公开(公告)日：2004-09-16
申请号：US10387210
申请日：2003-03-10
申请人： ASM Technology Singapore Pte Ltd
发明人： Gary Peter Widdowson , Sun Kuen Wong , Ajit Gaunekar
IPC分类号： H01J040/14
CPC分类号： G05B19/401 , G05B2219/45029 , G05B2219/50077 , G05B2219/50389
摘要： The position of a working point relative to a working space, such as a working point of a carriage on a gantry beam of an XY positioning table, is determined by measuring at least two sets of displacements. A first set of displacements, of the working point relative to an intermediate component, such as the gantry beam, includes a relatively large displacement (X) in a first linear degree of freedom and relatively small displacements (Y1null, Y2null), in at least two of the five degrees of freedom other than the first. The second set of displacements, of the intermediate component relative to the working space, includes a relatively large displacement (Y1, Y2), in a second linear degree of freedom, and relatively small displacements (X1null, X2null), in at least two of the five degrees of freedom other than the second.
摘要翻译：通过测量至少两组位移来确定工作点相对于工作空间的位置，例如XY定位台的台架梁上的托架的工作点。工作点相对于诸如台架梁的中间部件的第一组位移包括在第一线性自由度和相对小的位移（Y1'，Y2'）中的相对大的位移（X），在除了第一个以外的五个自由度中的至少两个。中间部件相对于工作空间的第二组位移包括在第二线性自由度中相对较大的位移（Y1，Y2）和相对小的位移（X1'，X2'），至少五个自由度中的两个除了第二个。

56. 发明申请

US20030107142A1 Methods and apparatus for cleaning an IC encapsulation system 有权
标题翻译：用于清洁IC封装系统的方法和设备
公开(公告)号：US20030107142A1
公开(公告)日：2003-06-12
申请号：US10013079
申请日：2001-12-11
申请人： ASM Technology Singapore Pte Ltd.
发明人： See Yap Ong , Kock Hien Wee , Shu Chuen Ho , Teng Hock Kuah , Jian Wu
IPC分类号： B29C070/72 , B29C070/88
CPC分类号： B29C45/14655 , B29C45/1701 , B29C45/18 , B29C70/72 , B29C2045/14868
摘要： A system is proposed for encapsulating in plastics material leadframe items comprising an IC wired to a leadframe. Dust of the plastics material is removed from the encapsulation system, and in particular from those items where dust principally accumulates, such as the surfaces of the moulds. To reduce the level of dust which enters the moulding region, the path along which the leadframe items are conveyed to the moulding region is closed at times when the leadframe items are not being transported there. Additionally, the leadframe items are conveyed to the moulding region under a cover including a vacuum source, so that the dust is continually sucked away from them.
摘要翻译：提出一种用于封装在塑料材料引线框架中的系统，其包括连接到引线框的IC。塑料材料的粉尘从包封系统中除去，特别是从灰尘主要积聚的物品（如模具表面）中除去。为了降低进入模制区域的灰尘的水平，引导框架物品被输送到模制区域的路径在引导框架物品未被运送到那里时被关闭。此外，引线框架物品被输送到包括真空源的盖子下方的模制区域，使得灰尘被连续地从它们中吸出。

57. 发明申请

US20030079448A1 Compartment for maintaining a clean production environment 有权
公开(公告)号：US20030079448A1
公开(公告)日：2003-05-01
申请号：US10029096
申请日：2001-10-25
申请人： ASM Technology Singapore Pte Ltd
发明人： Wee Kiun How , Jian Zhang , Lian Hok Tan
IPC分类号： B01D046/00
CPC分类号： B01D46/10 , B01D2273/30 , B01D2279/51 , Y10S55/18 , Y10S55/46
摘要： The invention relates to a compartment 10 having a space 32 segregated from air outside the compartment and capable of housing a product apparatus for assembly of, for example, semiconductor devices and integrated circuit packages in a nullcleannull environment. The compartment 10 includes panels 16 to segregate the air inside the compartment 10 from the surrounding environment. At the front of the compartment 10, there is a top access panel 12 and a bottom access panel 14 to access a production apparatus (not shown) which is houseable or storable within a space 32 for such apparatus defined within the compartment 10. Where it is desired to place a plurality of similar compartments 10 adjacent to one another to provide a production line, an opening 18 can be included in one or both of the side panels 16 for transfer of processed material, such as leadframes for assembling integrated circuit packages, from one production apparatus to another, housed in respective adjacent compartments 10. Thus the or each compartment 10 provides an individual clean space for carrying out a particular step of a production process. It is not therefore necessary to provide a single, massive, clean room.

58. 发明申请

US20020109001A1 Force sensing apparatus 有权
标题翻译：力感测装置
公开(公告)号：US20020109001A1
公开(公告)日：2002-08-15
申请号：US10118488
申请日：2002-04-05
申请人： ASM Technology Singapore Pte Ltd
发明人： Gang Ou , Gary Peter Widdowson , Ka Shing Kenny Kwan
IPC分类号： B23K031/02
CPC分类号： H01L24/78 , B23K20/10 , B23K20/106 , H01L2224/78 , H01L2224/78301 , H01L2224/859 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2224/48 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： Force sensing apparatus is provided for sensing deflection of a transducer in an ultrasonic welding machine. The apparatus includes a body member, a transducer holder and a force sensor. The transducer holder is adapted to hold an ultrasonic transducer and the transducer holder is fixed to the body member. The force sensor is located between adjacent surfaces of the body member and the transducer holder to sense a force applied between the surfaces.
摘要翻译：力传感装置用于感测超声波焊接机中的换能器的偏转。该装置包括主体部件，换能器支架和力传感器。换能器保持器适于容纳超声换能器，并且换能器支架固定到主体部件上。力传感器位于主体构件和换能器支架的相邻表面之间，以感测施加在表面之间的力。

59. 发明授权

US11289446B2 Multiple actuator wire bonding apparatus 有权
公开(公告)号：US11289446B2
公开(公告)日：2022-03-29
申请号：US15937972
申请日：2018-03-28
申请人： ASM Technology Singapore Pte Ltd
发明人： Keng Yew Song , Yue Zhang , Xiao Liang Chen , Zheng Yu Lin
IPC分类号： B23K20/00 , H01L23/00
摘要： According to a first aspect of the present invention, there is provided a bond apparatus for bonding a wire to a bonding surface, comprising: a bond head body movably retained by a mounting portion; a first actuator; and a second actuator, wherein the bond head body has a tool portion configured to receive a bonding tool for receiving and bonding the wire and an actuator portion coupled with the first actuator and the second actuator, the first actuator and the second actuator being operative to act on the actuator portion for moving the bond head body with respect to the mounting portion to move the bonding tool with respect to the bonding surface.

60. 发明授权

US11276614B2 Testing of LED devices during pick and place operations 有权
公开(公告)号：US11276614B2
公开(公告)日：2022-03-15
申请号：US16944206
申请日：2020-07-31
申请人： ASM Technology Singapore Pte Ltd
发明人： Shun Yan Lee , Sai Kit Wong , Chi Wah Yuen , Ka Yee Mak , Gary Peter Widdowson
IPC分类号： H01L21/66 , H01L33/00 , G01R31/26
摘要： A pick and place LED testing apparatus, comprising: a test station operative in use to power a group of LEDs; a bondhead operative in use to pick said group of LEDs from a source wafer and place said group of LEDs on said test station for testing; and an optical sensor operative in use to measure an optical characteristic of said group of LEDs when tested, wherein at least a portion of said bondhead is translucent to provide an optical path from said group of LEDs to said optical sensor.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式