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    • 57. 发明申请
    • THERMOELECTRIC MODULE
    • 热电模块
    • US20120279544A1
    • 2012-11-08
    • US13412126
    • 2012-03-05
    • Dong Hyeok CHOIYong Suk KimSung Ho Lee
    • Dong Hyeok CHOIYong Suk KimSung Ho Lee
    • H01L35/32
    • H01L35/32
    • Disclosed herein is a thermoelectric module using a thermoelectric element capable of showing a spin Seebeck effect. The present invention provides a new thermoelectric module including: an upper substrate on which a plurality of upper metal electrodes are arranged; a lower substrate on which a plurality of lower metal electrodes are arranged; p-type semiconductor devices and n-type semiconductor devices that are disposed between the upper substrate and the lower substrate and are electrically bonded alternately to each other by the plurality of upper metal electrodes and the plurality of lower metal electrodes; and ferrite elements that are disposed between the p-type semiconductor devices and the n-type semiconductor devices, top ends and bottom ends of the ferrite elements being bonded to the upper metal electrodes and the lower metal electrodes.
    • 本文公开了一种使用能够显示旋转塞贝克效应的热电元件的热电模块。 本发明提供一种新的热电模块,包括:上基板,多个上金属电极布置在其上; 其上布置有多个下部金属电极的下部基板; p型半导体器件和n型半导体器件,其设置在上基板和下基板之间,并且通过多个上金属电极和多个下金属电极彼此交替电接合; 以及设置在p型半导体器件和n型半导体器件之间的铁氧体元件,铁氧体元件的顶端和底端被接合到上金属电极和下金属电极。
    • 59. 发明申请
    • BACK-LIGHT UNIT
    • 背光单元
    • US20110134629A1
    • 2011-06-09
    • US13003056
    • 2008-11-18
    • Yong Suk Kim
    • Yong Suk Kim
    • G02F1/13357
    • G02F1/133608G02F2201/54
    • A back-light unit is disclosed. An object of the present invention is to provide a back-light unit that is able to improve structural stability and mass-production efficiency. The back-light unit includes a circuit substrate comprising a plurality of light sources arranged thereon, an optical sheet positioned on the circuit substrate, a plurality of supporting parts arranged between the circuit substrate and the optical sheet to support the optical sheet, which are installed to the circuit substrate by using surface-mount technology (SMT).
    • 公开了背光单元。 本发明的目的是提供能够提高结构稳定性和批量生产效率的背光单元。 背光单元包括:电路基板,包括布置在其上的多个光源;位于电路基板上的光学片;布置在电路基板和光学片之间的多个支撑部件,用于支撑光学片, 通过使用表面贴装技术(SMT)到电路基板。