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51. 发明申请

US20060289992A1 Stacked semiconductor component, fabrication method and fabrication system 有权
标题翻译：堆叠半导体元件，制造方法和制造系统
公开(公告)号：US20060289992A1
公开(公告)日：2006-12-28
申请号：US11167367
申请日：2005-06-27
申请人： Alan Wood
发明人： Alan Wood
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L25/50 , H01L2224/05001 , H01L2224/05009 , H01L2224/051 , H01L2224/0557 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2224/05684 , H01L2224/16 , H01L2225/06524 , H01L2225/06541 , H01L2225/06586 , H01L2225/06596 , H01L2924/15311 , H01L2924/00014
摘要： A semiconductor component includes a carrier and multiple semiconductor substrates stacked and interconnected on the carrier. The carrier includes conductive members bonded to corresponding conductive openings on the semiconductor substrates. The component can also include terminal contacts on the carrier in electrical communication with the conductive members, and an outer member for protecting the semiconductor substrates. A method for fabricating the component includes the steps of providing the carrier with the conductive members, and providing the semiconductor substrates with the conductive openings. The method also includes the step of aligning and placing the conductive openings on the conductive members, and then bonding the conductive members to the conductive openings. A system includes the carrier having the conductive members, the semiconductor substrates having the conductive openings, an aligning and placing system for aligning and placing the semiconductor substrates on the carrier, and a bonding system for bonding the conductive members to the conductive openings.
摘要翻译：半导体部件包括载体和在载体上堆叠和互连的多个半导体衬底。载体包括结合到半导体衬底上相应的导电开口的导电构件。该部件还可以包括与导电构件电连通的载体上的端子触点，以及用于保护半导体衬底的外部构件。一种用于制造该部件的方法包括以下步骤：为载体提供导电构件，并为半导体衬底提供导电孔。该方法还包括将导电开口对准和放置在导电构件上，然后将导电构件接合到导电开口的步骤。系统包括具有导电构件的载体，具有导电开口的半导体衬底，用于将半导体衬底对准和放置在载体上的对准和放置系统，以及用于将导电构件接合到导电开口的接合系统。

52. 发明申请

US20060261446A1 Backside method and system for fabricating semiconductor components with conductive interconnects 有权
标题翻译：用于制造具有导电互连的半导体部件的背面方法和系统
公开(公告)号：US20060261446A1
公开(公告)日：2006-11-23
申请号：US11133085
申请日：2005-05-19
申请人： Alan Wood , William Hiatt , David Hembree
发明人： Alan Wood , William Hiatt , David Hembree
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L21/76898 , H01L21/4885 , H01L21/6835 , H01L21/6836 , H01L23/3114 , H01L23/481 , H01L23/4951 , H01L23/4985 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/50 , H01L24/78 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2224/06102 , H01L2224/06136 , H01L2224/11003 , H01L2224/1131 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/114 , H01L2224/1147 , H01L2224/116 , H01L2224/13099 , H01L2224/131 , H01L2224/1319 , H01L2224/2518 , H01L2224/45015 , H01L2224/451 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4813 , H01L2224/4824 , H01L2224/4845 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/78301 , H01L2224/8121 , H01L2224/81815 , H01L2224/85001 , H01L2224/851 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2225/06513 , H01L2225/06541 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/14 , H01L2924/19042 , Y10T29/53187 , Y10T29/53209 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2224/83851 , H01L2224/05552
摘要： A backside method for fabricating a semiconductor component with a conductive interconnect includes the step of providing a semiconductor substrate having a circuit side, a backside, and a substrate contact on the circuit side. The method also includes the steps of forming a substrate opening from the backside to the substrate contact, and then bonding the conductive interconnect to an inner surface of the substrate contact. A system for performing the method includes the semiconductor substrate, a thinning system for thinning the semiconductor substrate, an etching system for forming the substrate opening, and a bonding system for bonding the conductive interconnect to the substrate contact. The semiconductor component can be used to form module components, underfilled components, stacked components, and image sensor semiconductor components.
摘要翻译：用于制造具有导电互连的半导体部件的背面方法包括在电路侧提供具有电路侧，背面和基板接触的半导体衬底的步骤。该方法还包括以下步骤：从背面形成衬底开口到衬底触点，然后将导电互连件接合到衬底触点的内表面。用于执行该方法的系统包括半导体衬底，用于使半导体衬底变薄的变薄系统，用于形成衬底开口的蚀刻系统，以及用于将导电互连件接合到衬底接触件的接合系统。半导体元件可用于形成模块组件，底部填充组件，堆叠组件和图像传感器半导体组件。

53. 发明申请

US20060244475A1 Compliant contact pin test assembly and methods thereof 有权
标题翻译：符合接触针测试组件及其方法
公开(公告)号：US20060244475A1
公开(公告)日：2006-11-02
申请号：US11477217
申请日：2006-06-29
申请人： Kyle Kirby , Warren Farnworth , James Wark , William Hiatt , David Hembree , Alan Wood
发明人： Kyle Kirby , Warren Farnworth , James Wark , William Hiatt , David Hembree , Alan Wood
IPC分类号： G01R31/26
CPC分类号： G01R1/0735 , G01R1/07314 , H01L23/13 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/3511 , H01R12/714 , H01R13/24 , H01R2201/20 , H05K3/326 , H05K7/1069 , H05K2201/0314 , H05K2201/09036 , H05K2201/10378 , Y10T29/49165 , Y10T29/49174 , Y10T29/49204 , Y10T29/49222 , H01L2224/05599
摘要： A compliant contact pin assembly and a contactor card and methods for testing therewith are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.
摘要翻译：提供了一种柔性接触销组件和接触器卡以及用于测试的方法。柔性接触销组件包括由基板的一部分形成的接触销，其中触头销顺从地保持通过柔性联接结构悬挂在基板内。衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。

54. 发明申请

US20060118953A1 Semiconductor component having thinned die with conductive vias 有权
标题翻译：半导体元件具有导电通孔的薄模
公开(公告)号：US20060118953A1
公开(公告)日：2006-06-08
申请号：US11339177
申请日：2006-01-20
申请人： Warren Farnworth , Alan Wood , Trung Doan
发明人： Warren Farnworth , Alan Wood , Trung Doan
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L23/48 , B33Y70/00 , B33Y80/00 , H01L21/304 , H01L21/3043 , H01L21/56 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L21/6836 , H01L21/76802 , H01L21/76898 , H01L21/78 , H01L23/24 , H01L23/3114 , H01L23/36 , H01L23/3672 , H01L23/481 , H01L23/49531 , H01L23/49575 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/27 , H01L24/94 , H01L24/96 , H01L25/105 , H01L25/50 , H01L29/0657 , H01L2221/68327 , H01L2221/68331 , H01L2221/68372 , H01L2224/0401 , H01L2224/05599 , H01L2224/11849 , H01L2224/11901 , H01L2224/12105 , H01L2224/13009 , H01L2224/13022 , H01L2224/13025 , H01L2224/13099 , H01L2224/16 , H01L2224/16235 , H01L2224/274 , H01L2224/73104 , H01L2224/73253 , H01L2224/94 , H01L2225/06541 , H01L2225/1035 , H01L2225/1058 , H01L2225/107 , H01L2225/1094 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/05042 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H01L2924/19042 , H01L2924/3512 , H01L2924/00 , H01L2224/29099 , H01L2224/27
摘要： A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.
摘要翻译：半导体部件包括在六个表面上具有保护性聚合物层的变薄的半导体管芯。该组件还包括嵌入在电路侧聚合物层中的裸片上的接触凸块，并且密集区域阵列中接触凸块上的端子接触。一种用于制造该部件的方法包括以下步骤：提供包含多个骰子的基底，在基底上邻近骰子的周边边缘形成沟槽，以及将聚合物材料沉积到沟槽中。此外，该方法包括以下步骤：平坦化衬底的背面以接触聚合物填充的沟槽，并切割穿过聚合物沟槽以从衬底中分离组分。在分离步骤之前，组分可以在它们保留在基材上时被测试和燃烧。

55. 发明申请

US20060115926A1 Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials 有权
标题翻译：使用有机金属层和可流动的可固化导电材料形成导电元件的方法
公开(公告)号：US20060115926A1
公开(公告)日：2006-06-01
申请号：US11336540
申请日：2006-01-20
申请人： Alan Wood , Warren Farnworth , Charles Watkins , Peter Benson
发明人： Alan Wood , Warren Farnworth , Charles Watkins , Peter Benson
IPC分类号： H01L21/50
CPC分类号： H01L27/14685 , B33Y10/00 , B33Y80/00 , H01L21/56 , H01L23/3128 , H01L27/14618 , H01L27/14627 , H01L2224/04105 , H01L2224/20 , H01L2924/01005 , H01L2924/01027 , H01L2924/01046 , H01L2924/12041
摘要： A conductive element is formed on a substrate by forming an organometallic layer on at least a portion of a surface of the substrate, heating a portion of the organometallic layer, and removing an unheated portion of the organometallic layer. In other methods, a flowable, uncured conductive material may be deposited on a surface of the substrate, the flowable, uncured conductive material may be selectively cured over at least a portion of the surface of the substrate, and a portion of the cured conductive material may be removed. A conductive via is formed by forming a hole at least partially through a thickness of a substrate, depositing an organometallic material within at least a portion of the hole, and selectively heating at least a portion of the organometallic material.
摘要翻译：通过在基板表面的至少一部分上形成有机金属层，加热部分有机金属层，去除有机金属层的未加热部分，在基板上形成导电元件。在其他方法中，可流动的未固化的导电材料可以沉积在基底的表面上，可流动的未固化的导电材料可以选择性地固化在基底表面的至少一部分上，并且一部分固化的导电材料可能被删除。通过至少部分地穿过衬底的厚度形成孔，在孔的至少一部分内沉积有机金属材料并选择性地加热至少一部分有机金属材料来形成导电通孔。

56. 发明申请

US20060115925A1 Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material 有权
标题翻译：制造微透镜的方法包括选择性固化可流动的未固化光学透射材料
公开(公告)号：US20060115925A1
公开(公告)日：2006-06-01
申请号：US11336228
申请日：2006-01-20
申请人： Alan Wood , Warren Farnworth , Charles Watkins , Peter Benson
发明人： Alan Wood , Warren Farnworth , Charles Watkins , Peter Benson
IPC分类号： H01L21/50
CPC分类号： H01L27/14685 , B33Y10/00 , B33Y80/00 , H01L21/56 , H01L23/3128 , H01L27/14618 , H01L27/14627 , H01L2224/04105 , H01L2224/20 , H01L2924/01005 , H01L2924/01027 , H01L2924/01046 , H01L2924/12041
摘要： A microlens for use in an imaging device may be fabricated by disposing a flowable, uncured optically transmissive material in at least one layer onto a surface of a substrate, selectively curing at least a portion of the flowable, uncured optically transmissive material, and removing the flowable, uncured optically transmissive material from the surface of the substrate.
摘要翻译：用于成像装置的微透镜可以通过将至少一层中的可流动的未固化的光学透射材料设置在基板的表面上来选择性地固化可流动的未固化的光学透射材料的至少一部分，可流动的，未固化的光学透射材料。

57. 发明申请

US20060040421A1 Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers 有权
公开(公告)号：US20060040421A1
公开(公告)日：2006-02-23
申请号：US10922192
申请日：2004-08-19
申请人： Warren Farnworth , Alan Wood , James Wark , David Hembree , Rickie Lake
发明人： Warren Farnworth , Alan Wood , James Wark , David Hembree , Rickie Lake
IPC分类号： H01L21/50
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L27/14634 , H01L27/14683 , H01L2224/48227 , H01L2224/48091 , H01L2924/00014
摘要： Methods of packaging microelectronic imagers and packaged microelectronic imagers. An embodiment of such a method can include providing an imager workpiece having a plurality of imager dies arranged in a die pattern and providing a cover substrate through which a desired radiation can propagate. The imager dies include image sensors and integrated circuitry coupled to the image sensors. The method further includes providing a spacer having a web that includes an adhesive and has openings arranged to be aligned with the image sensors. For example, the web can be a film having an adhesive coating, or the web itself can be a layer of adhesive. The method continues by assembling the imager workpiece with the cover substrate such that (a) the spacer is between the imager workpiece and the cover substrate, and (b) the openings are aligned with the image sensors. The attached web is not cured after the imager workpiece and the cover substrate have both been adhered to the web. As such, the web does not outgas contaminants into the compartments in which the image sensors are housed.

58. 发明申请

US20060017451A1 Substrates including alignment fences 审中-公开
标题翻译：基材包括对准栅栏
公开(公告)号：US20060017451A1
公开(公告)日：2006-01-26
申请号：US11233721
申请日：2005-09-23
申请人： Salman Akram , Alan Wood , Warren Farnworth
发明人： Salman Akram , Alan Wood , Warren Farnworth
IPC分类号： G01R31/02
CPC分类号： H05K7/1061 , B33Y10/00 , B33Y30/00 , B33Y80/00 , G01R1/0408 , G01R1/0433 , G01R1/0466 , G01R1/0483 , G01R1/07378 , G01R3/00 , H01L23/32 , H01L23/49827 , H01L2224/16111 , H01L2224/16237 , H01L2224/8114 , H01L2224/81385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01049 , H01L2924/01082 , H01L2924/12042 , H01L2924/12044 , H01L2924/15787 , H01L2924/351 , H05K1/112 , H05K1/141 , H05K3/3436 , H05K2201/049 , H05K2201/09472 , H05K2201/10378 , H05K2201/10734 , H05K2201/2018 , H05K2203/167 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49147 , Y10T29/49156 , Y10T29/49165 , Y10T29/49204 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A substrate includes a fence that receives and aligns a semiconductor device, such as a flip-chip type semiconductor device, therewith. The fence may include a plurality of adjacent, mutually adhered regions, which may comprise layers. One or more laterally recessed regions may be located at one or more corners of a receptacle formed by the fence to facilitate rough alignment of a semiconductor device with the substrate. The receptacle of the fence may include edges that are configured to progressively align a semiconductor device with the substrate.
摘要翻译：衬底包括接收和对准诸如倒装芯片型半导体器件的半导体器件的栅栏。栅栏可以包括多个相邻的相互粘合的区域，其可以包括层。一个或多个横向凹陷区域可以位于由栅栏形成的容器的一个或多个拐角处，以便半导体器件与衬底的粗略对准。栅栏的插座可以包括被配置为使半导体器件与衬底逐渐对准的边缘。

59. 发明申请

US20060011809A1 Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers 有权
公开(公告)号：US20060011809A1
公开(公告)日：2006-01-19
申请号：US10894262
申请日：2004-07-19
申请人： Warren Farnworth , Sidney Rigg , William Hiatt , Alan Wood , Peter Benson , James Wark , David Hembree , Kyle Kirby , Charles Watkins , Salman Akram
发明人： Warren Farnworth , Sidney Rigg , William Hiatt , Alan Wood , Peter Benson , James Wark , David Hembree , Kyle Kirby , Charles Watkins , Salman Akram
IPC分类号： H01L27/00
CPC分类号： H01L27/00 , B33Y80/00 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L27/14687 , H01L2224/48091 , H01L2224/48227 , H01L2924/01077 , H01L2924/01078 , H01L2924/00014
摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

60. 发明申请

US20050278056A1 Machine vision systems for use with programmable material consolidation system and associated methods and structures 有权
标题翻译：机器视觉系统用于可编程材料合并系统及相关方法和结构
公开(公告)号：US20050278056A1
公开(公告)日：2005-12-15
申请号：US10867258
申请日：2004-06-14
申请人： Warren Farnworth , Alan Wood
发明人： Warren Farnworth , Alan Wood
IPC分类号： B29C67/00 , G03F7/20 , G06F19/00 , H01L21/60 , H01L51/00
CPC分类号： H01L24/76 , B29C64/112 , B29C64/129 , B33Y40/00 , G03F7/70416 , H01L24/82 , H01L51/0005 , H01L2924/01033 , H01L2924/01049 , H01L2924/0106 , H01L2924/01077 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： Programmable material consolidation systems employing a machine vision system for in combination with a 3-D printing system for accurately locating a position over a support element and optionally on a substrate on the support element, and forming structural features thereon. By use of the machine vision system, the precise location on a substrate or support element may be determined and communicated to the dispense element of the 3-D printing system such that a flowable material may be deposited and consolidated at a desired location to form a structural feature. Methods for forming various features and structures on a substrate employing the systems of the present invention are also disclosed.
摘要翻译：可编程材料固结系统采用机器视觉系统，与3-D打印系统组合，用于精确地定位支撑元件上的位置，并可选地在支撑元件上的基板上，并在其上形成结构特征。通过使用机器视觉系统，可以确定基板或支撑元件上的精确位置并将其传送到3-D打印系统的分配元件，使得可流动的材料可以在期望的位置被沉积和固结以形成结构特征。还公开了使用本发明的系统在基板上形成各种特征和结构的方法。

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