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51. 发明授权

US06614091B1 Semiconductor device having a wire bond pad and method therefor 有权
标题翻译：具有引线接合焊盘的半导体器件及其方法
公开(公告)号：US06614091B1
公开(公告)日：2003-09-02
申请号：US10097059
申请日：2002-03-13
申请人： Susan H. Downey , James W. Miller , Geoffrey B. Hall
发明人： Susan H. Downey , James W. Miller , Geoffrey B. Hall
IPC分类号： H01L2900
CPC分类号： H01L24/05 , H01L24/03 , H01L2224/04042 , H01L2224/05 , H01L2224/05073 , H01L2224/05166 , H01L2224/05184 , H01L2224/05187 , H01L2224/05558 , H01L2224/05568 , H01L2224/05624 , H01L2224/05647 , H01L2224/06135 , H01L2224/45124 , H01L2224/45139 , H01L2224/48724 , H01L2224/48747 , H01L2224/48824 , H01L2224/48847 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01061 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/00 , H01L2224/48 , H01L2924/01004
摘要： An integrated circuit (50) has a wire bond pad (53). The wire bond pad (53) is formed on a passivation layer (18) over active circuitry (26) and/or electrical interconnect layers (24) of the integrated circuit (50). The wire bond pad (53) is connected to a plurality of final metal layer portions (51, 52). The plurality of final metal layer portions (51, 52) are formed in a final interconnect layer of the interconnect layers (24). In one embodiment, the bond pad (53) is formed from aluminum and the final metal layer pads are formed from copper. The wire bond pad (53) allows routing of conductors in a final metal layer (21) directly underlying the bond pad (53), thus allowing the surface area of the semiconductor die to be reduced.
摘要翻译：集成电路（50）具有引线接合焊盘（53）。引线接合焊盘（53）在集成电路（50）的有源电路（26）和/或电互连层（24）之上的钝化层（18）上形成。引线接合焊盘（53）连接到多个最终金属层部分（51,52）。多个最终金属层部分（51,52）形成在互连层（24）的最终互连层中。在一个实施例中，接合焊盘（53）由铝形成，并且最终的金属层焊盘由铜形成。引线接合焊盘（53）允许在直接位于接合焊盘（53）下方的最终金属层（21）中导体导体，从而允许半导体管芯的表面积减小。

52. 发明授权

US5223872A Surveillance device with eyeball assembly and pivotably mountable carriage assembly 失效
标题翻译：带眼球组件和可枢转安装的支架组件的监控装置
公开(公告)号：US5223872A
公开(公告)日：1993-06-29
申请号：US803085
申请日：1991-12-04
申请人： Norbert M. Stiepel , Luis Anderson , Steve Uhl , James W. Miller , Michael Smith
发明人： Norbert M. Stiepel , Luis Anderson , Steve Uhl , James W. Miller , Michael Smith
IPC分类号： G08B13/196 , G08B15/00 , H04N7/18
CPC分类号： G08B13/19632 , G08B13/19619 , G08B13/1963 , H04N7/183
摘要： A surveillance assembly in which a camera and lens assembly is surrounded by a shroud to form an eyeball assembly which is rotatable about first and second axes and which is enclosed within a housing. A carriage assembly for mounting the eyeball assembly to the housing is provided in the surveillance assembly and includes pivot and engagement parts which allow the carriage assembly to be pivoted into position. Additionally disclosed is a camera/lens mounting with a resilient annular member for permitting adjustment of the mounting along the lens axis and a cable support assembly for an electrical cable connected between a camera lens assembly and another part of a surveillance assembly in which the cable support assembly permits the cable to be wound about the pivot axis of the camera and lens assembly. Further disclosed is the use of a spherical shroud and a circular aperture in the shroud for viewing outward of the shroud and the further use of a lens member occupying the area of the circular aperture and having in the area of the aperture an outer spherical surface which follows the spherical surface of the shroud so as to complete the surface.
摘要翻译：一种监视组件，其中相机和透镜组件被护罩包围以形成可围绕第一和第二轴线旋转并且被封装在壳体内的眼球组件。在监视组件中设置有用于将眼球组件安装到壳体的托架组件，并且包括允许托架组件枢转到位的枢转和接合部件。另外公开了一种具有弹性环形构件的相机/透镜，用于允许沿着透镜轴线调整安装件，以及连接在相机透镜组件和监视组件的另一部分之间的电缆的电缆支撑组件，其中电缆支撑组件允许电缆围绕照相机和透镜组件的枢转轴线缠绕。进一步公开的是在护罩中使用球形护罩和圆形孔以便观察护罩的外侧，并且进一步使用占据圆形孔的区域的透镜构件，并且在孔的区域中具有外球面遵循护罩的球形表面，以便完成表面。

53. 发明授权

US4707281A Drilling fluid additive containing high pyruvate xanthan 失效
标题翻译：含高丙酮酸黄原胶的钻井液添加剂
公开(公告)号：US4707281A
公开(公告)日：1987-11-17
申请号：US740658
申请日：1985-06-03
申请人： James W. Miller , John J. O'Neill
发明人： James W. Miller , John J. O'Neill
IPC分类号： C09K8/20 , C09K7/02
CPC分类号： C09K8/206
摘要： A drilling fluid additive comprises high pyruvate xanthan and locust bean gum in a weight ratio of about 40:60 to 80:20. The additive increases the viscosity of the drilling fluid at low shear, has improved thermal stability, and increases the capacity of the fluid to suspend high density weighting materials.
摘要翻译：钻井液添加剂包括重量比为约40:60至80:20的高丙酮酸黄原胶和刺槐豆胶。添加剂在低剪切下增加了钻井液的粘度，提高了热稳定性，并且增加了流体悬浮高密度加重材料的能力。

54. 发明授权

US4013438A Apparatus for manufacture of float glass 失效
标题翻译：浮法玻璃制造装置
公开(公告)号：US4013438A
公开(公告)日：1977-03-22
申请号：US619570
申请日：1975-10-06
申请人： Norman K. Gladieux , James W. Miller
发明人： Norman K. Gladieux , James W. Miller
IPC分类号： C03B18/06 , C03B18/02
CPC分类号： C03B18/06
摘要： A float glass facility which is readily adaptable to the production of float glass ribbons of different thicknesses and particularly to so-called thick or heavy float glass, that is, thicknesses greater than 0.250 inch (6mm). Longitudinally extending fenders are installed to limit the ultimate lateral flow of the glass, and the splay of extension tiles pivotally connected to the restrictor tiles is adjusted to suitably limit the initial spread of the molten glass on the molten bath before it is delivered between the fenders. The adjacent ends of the extension and restrictor tiles meet in an enclosed joint which permits angular adjustment between the members without interference by the molten glass and bath of molten metal.
摘要翻译：一种浮法玻璃设备，其容易适应于生产不同厚度的浮法玻璃带，特别是所谓厚或重的浮法玻璃，即厚度大于0.250英寸（6mm）。安装纵向延伸的挡泥板以限制玻璃的最终横向流动，并且调节枢转连接到限流砖的延伸砖的展开，以适当地限制熔融玻璃在其在挡泥板之间的传送之前的初始扩展。。延伸和限流砖的相邻端在封闭的接头中相遇，这允许在构件之间进行角度调节而不受熔融玻璃和熔融金属熔池的干扰。

55. 发明授权

US09064938B2 I/O cell ESD system 有权
标题翻译： I / O单元ESD系统
公开(公告)号：US09064938B2
公开(公告)日：2015-06-23
申请号：US13905275
申请日：2013-05-30
申请人： Melanie Etherton , Alexey Gilgur , James W. Miller , Jonathan M. Phillippe , Robert S. Ruth
发明人： Melanie Etherton , Alexey Gilgur , James W. Miller , Jonathan M. Phillippe , Robert S. Ruth
IPC分类号： H01L21/768 , H01L23/535 , H01L27/02
CPC分类号： H01L21/76895 , H01L27/0296 , H01L2224/05554
摘要： An integrated circuit including an ESD network including a portion located in ESD subareas of a plurality of I/O cells where the ESD subareas are arranged in a row traversing the plurality of I/O cells. The ESD network includes ESD clamp cells and ESD trigger circuit cells wherein a portion of the network is located in the row. In some examples, the row includes an ESD trigger circuit cell with a portion in one subarea of one ESD subarea of one I/O cell and a second portion in a second ESD subarea of another I/O cell. Also described herein is a method for producing an integrated circuit layout with an ESD network.
摘要翻译：一种包括ESD网络的集成电路，其包括位于多个I / O单元的ESD子区域中的部分，其中ESD子区域布置成穿过多个I / O单元的行。 ESD网络包括ESD钳位单元和ESD触发电路单元，其中网络的一部分位于该行中。在一些示例中，行包括ESD触发电路单元，其具有一个I / O单元的一个ESD子区域的一个子区域中的一部分，以及另一个I / O单元的第二ESD子区域中的第二部分。本文还描述了一种用于产生具有ESD网络的集成电路布局的方法。

56. 发明申请

US20100165522A1 DISTRIBUTION OF ELECTROSTATIC DISCHARGE (ESD) CIRCUITRY WITHIN AN INTEGRATED CIRCUIT 有权
标题翻译：集成电路中静电放电（ESD）电路的分布
公开(公告)号：US20100165522A1
公开(公告)日：2010-07-01
申请号：US12345507
申请日：2008-12-29
申请人： Michael A. Stockinger , Anthony G. Dunne , Alex P. Gerdemann , James W. Miller , Daniel J. O'Hare , Paul J. Sheridan , Jeannie Han Millaway
发明人： Michael A. Stockinger , Anthony G. Dunne , Alex P. Gerdemann , James W. Miller , Daniel J. O'Hare , Paul J. Sheridan , Jeannie Han Millaway
IPC分类号： H02H9/04 , G06F17/50
CPC分类号： G06F17/5068 , H01L23/60 , H01L24/14 , H01L27/0251 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/00
摘要： Embodiments of the present disclosure provide an integrated circuit (IC) or semiconductor device. This semiconductor device includes a number of I/O pads or bumps on an outer surface of the semiconductor device, a number of electrostatic discharge (ESD) protection cells and functional modules. Individual ESD protection cells couple to and are downstream of individual I/O pads. Functional modules coupled to and are downstream of individual ESD protection cells. The ESD protection cells protect circuitry within the functional module from electrostatic discharge events. A rail clamp may provide an ESD discharge path between a first power supply bus and a second power supply bus. The ESD protection cells may be collected in groups to form clusters (with linear or irregular placement patterns). These clusters may be distributed autarchically across the semiconductor device overlapping one or more functional modules or within spaces or gaps between the functional modules.
摘要翻译：本公开的实施例提供集成电路（IC）或半导体器件。该半导体器件包括在半导体器件的外表面上的多个I / O焊盘或凸块，多个静电放电（ESD）保护电池和功能模块。单独的ESD保护电池耦合到各个I / O焊盘并且位于各个I / O焊盘的下游功能模块耦合到单个ESD保护单元的下游。 ESD保护单元保护功能模块内的电路免受静电放电事件的影响。导轨夹可以在第一电源总线和第二电源总线之间提供ESD放电路径。 ESD保护电池可以以组形式收集以形成簇（具有线性或不规则布置图案）。这些集群可以跨越跨越半导体器件的一个或多个功能模块或者在功能模块之间的空间或间隙中自发地分布。

57. 发明授权

US07673576B2 Aerodynamic lift enhancement gate valve 失效
标题翻译：气动升力增强闸阀
公开(公告)号：US07673576B2
公开(公告)日：2010-03-09
申请号：US11471928
申请日：2006-06-21
申请人： James W. Miller
发明人： James W. Miller
IPC分类号： B63H9/04 , B63H9/06 , B63B35/79
CPC分类号： B63H9/06 , B63H9/0607
摘要： An aerodynamic lift enhancing gate valve assembly comprising an airfoil blade disposed at a leading edge of a sail, forming a gate between the trailing edge of the airfoil blade and the leading edge of the sail. The airfoil blade captures wind and redirects it over the cambered surface of the sail to enhance the aerodynamic lift of the sail. The pressure of the wind captured by the airfoil blade is regulated by springs or elastic bands. In operation, the chord of the airfoil blade remains substantially parallel to the chord of the sail.
摘要翻译：一种气动升力增强闸阀组件，包括设置在帆的前缘的翼型叶片，在翼型叶片的后缘和帆的前缘之间形成门。翼型叶片捕获风并将其重定向在帆的弧形表面上，以增强帆的空气动力学提升。由翼型叶片捕获的风的压力由弹簧或弹性带限制。在操作中，翼型叶片的翼弦大致平行于帆的弦。

58. 发明申请

US20090294970A1 HIGH FREQUENCY INTERCONNECT PAD STRUCTURE 有权
标题翻译：高频互连接头结构
公开(公告)号：US20090294970A1
公开(公告)日：2009-12-03
申请号：US12130579
申请日：2008-05-30
申请人： Michael A. Stockinger , Kevin J. Hess , James W. Miller
发明人： Michael A. Stockinger , Kevin J. Hess , James W. Miller
IPC分类号： H01L23/538
CPC分类号： H01L23/66 , H01L23/522 , H01L23/5222 , H01L23/60 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05095 , H01L2224/05624 , H01L2224/05647 , H01L2224/16 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48647 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/30105 , H01L2924/00014 , H01L2924/00
摘要： An integrated circuit includes a high speed circuit, an interconnect pad, a passivation layer under the interconnect pad, a first patterned metal layer, and a first via. The high speed circuit is for a high speed signal at a terminal of the high speed circuit. The interconnect pad is on a top surface of the integrated circuit structure. The first patterned metal layer is under the passivation layer having a first portion and a second portion. The first portion of the first patterned metal layer is connected to the terminal of the high speed circuit. The second portion of the first patterned metal layer is under the interconnect pad and is electrically floating when the high frequency signal is present on the interconnect pad portion. The result is reduced capacitive loading on the high speed signal which improves performance.
摘要翻译：集成电路包括高速电路，互连焊盘，互连焊盘下方的钝化层，第一图案化金属层和第一通孔。高速电路用于在高速电路的端子处的高速信号。互连焊盘位于集成电路结构的顶表面上。第一图案化金属层在钝化层下方具有第一部分和第二部分。第一图案化金属层的第一部分连接到高速电路的端子。第一图案化金属层的第二部分在互连焊盘下方并且当高频信号存在于互连焊盘部分上时电浮置。结果是降低了高速信号的电容负载，从而提高了性能。

59. 发明授权

US07446990B2 I/O cell ESD system 有权
标题翻译： I / O单元ESD系统
公开(公告)号：US07446990B2
公开(公告)日：2008-11-04
申请号：US11056617
申请日：2005-02-11
申请人： James W. Miller , Michael G. Khazhinsky , Michael Stockinger , James C. Weldon
发明人： James W. Miller , Michael G. Khazhinsky , Michael Stockinger , James C. Weldon
IPC分类号： H02H9/00
CPC分类号： H01L27/0251 , H01L27/0292
摘要： An ESD protection system for I/O cells of an integrated circuit. The I/O cells of a bank of cells include a first type of I/O cells having ESD trigger circuits and a second type of I/O cells having ESD clamp devices. In one embodiment, the ESD trigger circuits of the first type are located at the same area of an active circuitry floor plan as the area in the floor plan for the ESD clamp devices of the I/O cells of the second type.
摘要翻译：集成电路的I / O单元的ESD保护系统。一组单元的I / O单元包括具有ESD触发电路的第一类型的I / O单元和具有ESD钳位装置的第二类型的I / O单元。在一个实施例中，第一类型的ESD触发电路位于与第二类型的I / O单元的ESD钳位装置的平面图中的区域有关的电路平面图的相同区域。

60. 发明申请

US20080246165A1 Novel interconnect for chip level power distribution 有权
标题翻译：用于芯片级配电的新型互连
公开(公告)号：US20080246165A1
公开(公告)日：2008-10-09
申请号：US11732594
申请日：2007-04-04
申请人： Kevin J. Hess , Chu-Chung Lee , James W. Miller
发明人： Kevin J. Hess , Chu-Chung Lee , James W. Miller
IPC分类号： H01L23/50
CPC分类号： H01L23/50 , H01L23/3121 , H01L24/05 , H01L24/06 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/91 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/0603 , H01L2224/32225 , H01L2224/371 , H01L2224/4007 , H01L2224/40095 , H01L2224/40225 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/4903 , H01L2224/4917 , H01L2224/49175 , H01L2224/49433 , H01L2224/73221 , H01L2224/73265 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01077 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A semiconductor device (601) is provided which comprises a substrate (603); a semiconductor device (605) disposed on said substrate and having a first major surface; a first metal strap (615) which is in electrical contact with said substrate and which is adapted to provide power to a first region (608) of said semiconductor device; and a second metal strap (616) which is in electrical contact with said substrate and which is adapted to provide ground to a second region (609) of said semiconductor device.
摘要翻译：提供了一种半导体器件（601），其包括衬底（603）; 设置在所述基板上并具有第一主表面的半导体器件（605）第一金属带（615），其与所述基板电接触并且适于向所述半导体器件的第一区域（608）供电; 以及第二金属带（616），其与所述衬底电接触并适于提供到所述半导体器件的第二区域（609）的接地。

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