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51. 发明授权

US4635693A Pneumatic tire base-cap tread 失效
标题翻译：气动轮胎底盖胎面
公开(公告)号：US4635693A
公开(公告)日：1987-01-13
申请号：US673348
申请日：1984-11-20
申请人： Asahiro Ahagon , Toshio Kobayashi , Kazuhiro Yamada , Seiichi Doi , Makoto Misawa
发明人： Asahiro Ahagon , Toshio Kobayashi , Kazuhiro Yamada , Seiichi Doi , Makoto Misawa
IPC分类号： C08L7/00 , B60C1/00 , B60C11/00 , C08K3/00 , C08K3/04 , C08K5/00 , C08K5/01 , C08K5/04 , C08L9/00 , C08L9/06 , C08L21/00
CPC分类号： C08L7/00 , B60C1/0016 , C08L9/00 , C08L9/06
摘要： A pnuematic tire having a cap tread and a base tread is defined in way of material as follows:(1) said cap tread is made of a rubber material in which 100 pts. wt. of rubber component comprising at least 50 pts. wt. of natural rubber and/or polyisoprene rubber, at most 50 pts. wt. of polybutadiene rubber containing at most 20% of 1,2-bonding units and at most 50 pts. wt. of styrene-butadiene copolymer rubber containing at most 30 wt % of bonded styrene is incorporated with 50 to 100 pts. wt. of carbon black and with a softener in an amount satisfying the inequality;1.1X-44
摘要翻译：具有盖胎面和底部胎面的轮胎轮胎由如下材料限定：（1）所述胎面胎面由其中100个点的橡胶材料制成。重量的橡胶组分包含至少50个点。重量的天然橡胶和/或聚异戊二烯橡胶，最多50点。重量的聚丁二烯橡胶，其含有至多20％的1,2-键合单元和至多50个点。重量含有至多30重量％结合苯乙烯的苯乙烯 - 丁二烯共聚物橡胶加入50至100个点。重量的碳黑和柔软剂，其数量满足不等式; 1.1X-44

52. 发明授权

US4588930A Device for correcting an image on a picture tube having in-line electron guns and a coil assembly for the device 失效
标题翻译：用于校正具有直列电子枪的显像管上的图像和用于该装置的线圈组件的装置
公开(公告)号：US4588930A
公开(公告)日：1986-05-13
申请号：US735353
申请日：1985-05-17
申请人： Toshio Kobayashi , Hideo Hishiki
发明人： Toshio Kobayashi , Hideo Hishiki
IPC分类号： H01J29/70
CPC分类号： H01J29/701
摘要： In a deflecting yoke of an in-line type color picture tube, a pair of saturable reactors responsive to vertical deflection is connected to the horizontal deflecting coils so that horizontal deflection currents respectively flowing in two horizontal deflecting coils are controlled differentially in accordance with the degree of the vertical deflection, thereby minimizing raster distortion. Each of the saturable reactors may comprise a series connection of two coils connected to the vertical deflecting coils, and another series connection of two coils connected to the horizontal deflecting coils. The first-mentioned series connection may be omitted by positioning the second-mentioned series connection so that leakage flux from the vertical deflecting coils can be picked up. The core or cores of each of the saturable reactors are magnetically biased by a permanent magnet. A single disk-like magnet may be rotatably held to be in contact with two parallel cores so that rotation of the magnet results in change in impedance of the reactor.
摘要翻译：在直列式彩色显象管的偏转磁轭中，一对响应于垂直偏转的可饱和电抗器连接到水平偏转线圈，使得分别在两个水平偏转线圈中流动的水平偏转电流根据程度的垂直偏转，从而最小化光栅失真。每个饱和电抗器可以包括连接到垂直偏转线圈的两个线圈的串联连接，以及连接到水平偏转线圈的两个线圈的另一串联连接。可以通过定位第二次串联连接来省略首先提到的串联连接，从而可以拾取来自垂直偏转线圈的漏磁通。每个可饱和电抗器的核心或磁芯由永磁体磁力偏置。单个盘状磁体可以可旋转地保持以与两个平行的芯接触，使得磁体的旋转导致反应器的阻抗的变化。

53. 发明授权

US4552036A Automatic transmission for automotive vehicles 失效
标题翻译：汽车自动变速器
公开(公告)号：US4552036A
公开(公告)日：1985-11-12
申请号：US171771
申请日：1980-07-24
申请人： Toshio Takano , Toshio Kobayashi
发明人： Toshio Takano , Toshio Kobayashi
IPC分类号： B60K17/348 , B60K23/08 , F16H37/06 , F01N1/00 , F16D23/10
CPC分类号： B60K23/08 , Y10T477/613 , Y10T477/6425 , Y10T477/69395 , Y10T74/19084
摘要： An automatic transmission for four-wheel drive automotive vehicles comprising a torque converter, an automatic transmission connected to a turbine shaft of the torque converter for transmitting the output of the engine to the front-wheel, a fluid operated clutch for transmitting the output to the rear-wheel, and a pressure oil control for operating the automatic transmission. The pressure oil control includes a pressure regulator valve to produce a line pressure according to the operational condition of the engine and a changeover valve for operating the clutch. The pressure oil control is so arranged that the line pressure is raised with increase of load of the engine, and the changeover valve is adapted to be manually operated actuated to operate the clutch by the raised line pressure and such that the automatic transmission is automatically changed to the four-wheel drive in accordance with the driving condition.
摘要翻译：一种用于四轮驱动机动车辆的自动变速器，包括变矩器，连接到变矩器的涡轮轴的自动变速器，用于将发动机的输出传递到前轮;流体操作的离合器，用于将输出传递到后轮和用于操作自动变速器的压力油控制。压力油控制包括压力调节阀，以根据发动机的操作状态产生管路压力，以及用于操作离合器的转换阀。压力油控制被布置成使得线路压力随着发动机的负载的增加而升高，并且转换阀适于被手动操作致动以通过升高的线路压力操作离合器，并且自动变速器被自动地改变按照驾驶条件到四轮驱动。

54. 发明授权

US4095234A Recording apparatus for providing lustrous printing 失效
标题翻译：用于提供LUSTROUS打印的记录装置
公开(公告)号：US4095234A
公开(公告)日：1978-06-13
申请号：US813329
申请日：1977-07-05
申请人： Sanai Mito , Shinji Kinpara , Yuji Sumitomo , Toshio Kobayashi
发明人： Sanai Mito , Shinji Kinpara , Yuji Sumitomo , Toshio Kobayashi
IPC分类号： B41J2/01 , B41J11/00 , B41J29/00 , B41M5/00 , G06K15/10 , H04N1/23 , G01D15/18
CPC分类号： B41J11/002
摘要： In a recording apparatus which prints desired symbols on a record receiving member with heat ray absorbing colored material, a heat ray source is provided for heating a printed surface. A roller assembly including a roller impregnated with luster is disposed in such a manner that the printed and heated surface is brought into contact with the impregnated roller. The printed symbols are glossed by the luster since the printed symbols are pre-heated.

55. 发明授权

US09103114B2 Vacuum heat insulation material and manufacturing method therefor 有权
标题翻译：真空隔热材料及其制造方法
公开(公告)号：US09103114B2
公开(公告)日：2015-08-11
申请号：US13063048
申请日：2009-09-09
申请人： Shinya Kojima , Fumie Horibata , Tomohisa Tenra , Toshio Kobayashi
发明人： Shinya Kojima , Fumie Horibata , Tomohisa Tenra , Toshio Kobayashi
IPC分类号： B32B1/06 , B32B3/02 , B32B37/12 , E04B1/80 , F16L59/065
CPC分类号： E04B1/803 , F16L59/065 , Y02A30/242 , Y02B80/12 , Y10T428/231
摘要： A plurality of thin-wall parts (9a) of a sealant layer (7) are formed in a portion continuously changed in the interval of one sealing part (8) and a gas barrier layer (6) of other laminate film (4). At the inner circumferential side between the adjacent thin-wall parts (9a) and the thin-wall part (9a) at the innermost circumferential side and at the outer circumferential side of the thin-wall part (9a) of the outermost circumferential side, a thick-wall part (9b) of the sealant layer (7) is formed. All of the opposing sealant layers (7) between the two adjacent thin-wall parts (9a) are mutually heated and fused, so that an excellent adiabatic performance is maintained for a long period.
摘要翻译：密封剂层（7）的多个薄壁部分（9a）形成在一个密封部分（8）和另一层压薄膜（4）的阻气层（6）的间隔中连续变化的部分。在相邻的薄壁部（9a）与最外周侧的薄壁部（9a）的最内周侧和外周侧的薄壁部（9a）之间的内周侧，形成密封剂层（7）的厚壁部（9b）。两个相邻薄壁部分（9a）之间的所有相对的密封剂层（7）相互加热和熔合，从而长期保持优异的绝热性能。

56. 发明授权

US08823097B2 Protection device with a thin-film resistance connected to plural drain regions 有权
标题翻译：具有连接到多个漏极区域的薄膜电阻的保护装置
公开(公告)号：US08823097B2
公开(公告)日：2014-09-02
申请号：US12621164
申请日：2009-11-18
申请人： Tsutomu Imoto , Toshio Kobayashi
发明人： Tsutomu Imoto , Toshio Kobayashi
IPC分类号： H01L27/06 , H01L29/8605 , H01L29/78 , H01L29/735 , H01L27/02 , H01L29/66 , H01L29/73 , H01L29/08
CPC分类号： H01L29/8605 , H01L27/0277 , H01L29/0821 , H01L29/0847 , H01L29/66659 , H01L29/7304 , H01L29/735 , H01L29/7835 , H01L2924/0002 , H01L2924/00
摘要： A transistor-type protection device includes: a semiconductor substrate; a well of a first-conductivity-type formed in the semiconductor substrate; a source region of a second-conductivity-type formed in the well; a gate electrode formed on the well via a gate insulating film at one side of the source region; plural drain regions of a second-conductivity-type formed apart from each other and respectively separated at a predetermined distance from a well part immediately below the gate electrode film; and a resistive connection part connecting between the plural drain regions with a predetermined electric resistance.
摘要翻译：晶体管型保护器件包括：半导体衬底; 在半导体衬底中形成的第一导电型阱的阱; 在井中形成的第二导电型源极区; 在源极区域的一侧经由栅极绝缘膜在阱上形成的栅电极; 第二导电类型的多个漏极区彼此分开形成，并且分别与栅电极膜正下方的阱部分预定距离分离; 以及电阻连接部，其以预定的电阻连接在所述多个漏极区之间。

57. 发明授权

US07985619B2 Manufacturing method for semiconductor device embedded substrate 有权
标题翻译：半导体器件嵌入式衬底的制造方法
公开(公告)号：US07985619B2
公开(公告)日：2011-07-26
申请号：US12608383
申请日：2009-10-29
申请人： Toshio Kobayashi , Tadashi Arai , Takaharu Yamano
发明人： Toshio Kobayashi , Tadashi Arai , Takaharu Yamano
IPC分类号： H01L21/00
CPC分类号： H01L23/3128 , H01L21/568 , H01L21/6835 , H01L21/78 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2224/02333 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/32225 , H01L2224/73267 , H01L2224/82039 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/18162 , H01L2224/82
摘要： A manufacturing method for a semiconductor device embedded substrate, includes: a first step of preparing a semiconductor device having a first insulating layer; a second step of preparing a support body, and arranging the semiconductor device on one surface of the support body; a third step of forming a second insulating layer on the one surface of the support body; a fourth step of removing the support body; a fifth step of forming a first wiring pattern on a surface of each of the first insulating layer and the second insulating layer; a sixth step of forming a via-hole from which the first wiring pattern is exposed on the second insulating layer; and a seventh step of forming a second wiring pattern electrically connected on a surface of the second insulating layer.
摘要翻译：一种半导体器件嵌入式衬底的制造方法，包括：准备具有第一绝缘层的半导体器件的第一工序; 制备支撑体的第二步骤，以及将半导体器件布置在支撑体的一个表面上; 在所述支撑体的一个表面上形成第二绝缘层的第三步骤; 去除支撑体的第四步骤; 在第一绝缘层和第二绝缘层的表面上形成第一布线图案的第五步骤; 在所述第二绝缘层上形成从所述第一布线图案露出的通孔的第六步骤; 以及形成电连接在第二绝缘层的表面上的第二布线图案的第七步骤。

58. 发明授权

US07754535B2 Method of manufacturing chip integrated substrate 有权
标题翻译：芯片集成基板的制造方法
公开(公告)号：US07754535B2
公开(公告)日：2010-07-13
申请号：US12123673
申请日：2008-05-20
申请人： Toshio Kobayashi
发明人： Toshio Kobayashi
IPC分类号： H01L23/488
CPC分类号： H05K1/144 , H01L24/16 , H01L24/45 , H01L24/48 , H01L25/105 , H01L25/16 , H01L25/50 , H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/01047 , H01L2924/01079 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K3/284 , H05K3/3436 , H05K2201/10234 , H05K2201/10977 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01005 , H01L2924/01033
摘要： There are provided the steps of connecting a chip component 13 to a first substrate 10 through wire bonding, providing, on a second substrate 20, an electrode 21 having a solder coat 23 with a copper core 22, polishing a portion of the electrode 21 which is to be bonded to the connecting pad 12, thereby exposing the copper core 22 from the solder coat 23, bonding the exposed portion of the copper core 22 to the bump connecting pad 12 by using a flux non-containing conductive paste 30, thereby bonding the substrates 10 and 20 to each other, and filling a sealing resin 40 in a clearance portion between the substrates 10 and 20.
摘要翻译：提供了通过引线接合将芯片部件13连接到第一基板10的步骤，在第二基板20上提供具有铜芯22的具有焊料涂层23的电极21，抛光电极21的一部分要连接到连接焊盘12，从而将铜芯22从焊料涂层23暴露出来，通过使用焊剂不含导电浆料30将铜芯22的露出部分接合到焊盘连接焊盘12上，从而结合基板10和20彼此之间，并且将密封树脂40填充在基板10和20之间的间隙部分中。

59. 发明申请

US20100155992A1 MOLD RESIN MOLDING METHOD AND MOLD RESIN MOLDING APPARATUS 审中-公开
标题翻译：模具树脂模具和模具树脂成型设备
公开(公告)号：US20100155992A1
公开(公告)日：2010-06-24
申请号：US12644399
申请日：2009-12-22
申请人： Nobuyuki Kurashima , Toshio Kobayashi
发明人： Nobuyuki Kurashima , Toshio Kobayashi
IPC分类号： B29C45/14
CPC分类号： B29C45/14655 , B29C45/0025 , B29C45/02 , B29C45/56 , B29C45/77 , B29C2945/76498 , B29C2945/76735 , B29C2945/76765 , B29C2945/76859 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014
摘要： A mold resin molding method is provided with: providing a semiconductor device including a first wiring board and a second wiring board electrically connected to the first wiring board through a solder ball; providing a metal mold including a die plate which is independently provided to enable an approach/separation to/from the second wiring board; inserting the semiconductor device into a cavity of the metal mold; abutting the die plate on a surface side of the second wiring board through a release film; injecting a mold resin in a void between the first wiring board and the second wiring board while applying a first pressure from the die plate to the second wiring board; and further injecting the mold resin in the void while applying a second pressure which is higher than the first pressure from the die plate to the second wiring board.
摘要翻译：模具树脂成型方法具有：提供包括第一布线板和第二布线板的半导体器件，所述第一布线板和第二布线板通过焊球与第一布线板电连接; 提供包括模板的金属模具，所述模具板独立地设置成能够进入/离开所述第二布线板; 将半导体器件插入到金属模具的空腔中; 通过脱模膜将模板抵靠在第二配线基板的表面侧; 在第一配线板和第二配线板之间的空隙中注入模塑树脂，同时从模板施加第一压力到第二配线板; 并且在将来自模板的第一压力高于第二压接力的第二压力施加到第二配线基板的同时，将模具树脂进一步注入到空隙中。

60. 发明申请

US20100025081A1 WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE 审中-公开
标题翻译：接线基板和电子部件装置
公开(公告)号：US20100025081A1
公开(公告)日：2010-02-04
申请号：US12492560
申请日：2009-06-26
申请人： Tadashi Arai , Toshio Kobayashi
发明人： Tadashi Arai , Toshio Kobayashi
IPC分类号： H05K1/16 , H05K1/11 , H05K1/09
CPC分类号： H01L23/49822 , H01L21/4857 , H01L23/49816 , H01L23/49833 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2224/0401
摘要： A wiring substrate includes a frame-shaped reinforcing plate in which an opening portion is provided in a center portion, an interposer arranged in the opening portion of the reinforcing plate and having such a structure that a wiring layer connected mutually via a through electrode is formed on both surface sides of a substrate respectively, a resin portion filled between a side surface of the interposer and a side surface of the opening portion of the reinforcing plate, and coupling the interposer and the reinforcing plate, and an n-layered (n is an integer of 1 or more) lower wiring layer connected the wiring layer on the lower surface side of the interposer to extend from the interposer to an outer area.
摘要翻译：布线基板包括在中心部分设置有开口部的框状加强板，布置在加强板的开口部中的内插件，并且具有通过贯通电极相互连接的布线层的结构在衬底的两个表面侧分别填充有插入件的侧表面和加强板的开口部分的侧表面之间的树脂部分，并且连接插入件和加强板，并且n层（n是 1个以上的整数）下布线层，其连接在插入件的下表面侧上的布线层，以从插入件延伸到外部区域。

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