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    • 55. 发明授权
    • Near single-crystalline, high-carrier-mobility silicon thin film on a polycrystalline/amorphous substrate
    • 在多晶/非晶衬底上的单晶,高载流子迁移率硅薄膜附近
    • US07608335B2
    • 2009-10-27
    • US11001461
    • 2004-11-30
    • Alp T. FindikogluQuanxi JiaPaul N. ArendtVladimir MatiasWoong Choi
    • Alp T. FindikogluQuanxi JiaPaul N. ArendtVladimir MatiasWoong Choi
    • B32B9/00B32B9/04B32B13/04
    • C30B29/06C30B25/18H01L21/0237H01L21/0242H01L21/02488H01L21/02505H01L21/02521H01L21/02532H01L21/02587H01L21/02658
    • A template article including a base substrate including: (i) a base material selected from the group consisting of polycrystalline substrates and amorphous substrates, and (ii) at least one layer of a differing material upon the surface of the base material; and, a buffer material layer upon the base substrate, the buffer material layer characterized by: (a) low chemical reactivity with the base substrate, (b) stability at temperatures up to at least about 800° C. under low vacuum conditions, and (c) a lattice crystal structure adapted for subsequent deposition of a semiconductor material; is provided, together with a semiconductor article including a base substrate including: (i) a base material selected from the group consisting of polycrystalline substrates and amorphous substrates, and (ii) at least one layer of a differing material upon the surface of the base material; and, a buffer material layer upon the base substrate, the buffer material layer characterized by: (a) low chemical reactivity with the base substrate, (b) stability at temperatures up to at least about 800° C. under low vacuum conditions, and (c) a lattice crystal structure adapted for subsequent deposition of a semiconductor material, and, a top-layer of semiconductor material upon the buffer material layer.
    • 一种模板制品,包括基底,其包括:(i)选自多晶基底和非晶基底的基材,和(ii)在所述基材表面上的至少一层不同材料; 以及在所述基底基板上的缓冲材料层,所述缓冲材料层的特征在于:(a)与所述基底基板的化学反应性低,(b)在低真空条件下在至少约800℃的温度下的稳定性;以及 (c)适于随后沉积半导体材料的晶格结构; 与包括基底基板的半导体产品一起提供,所述半导体产品包括:(i)选自多晶基底和非晶基底的基材,和(ii)在基底表面上的至少一层不同材料 材料; 以及在所述基底基板上的缓冲材料层,所述缓冲材料层的特征在于:(a)与所述基底基板的化学反应性低,(b)在低真空条件下在至少约800℃的温度下的稳定性,以及 (c)适于随后沉积半导体材料的晶格结构结构,以及半导体材料的顶层在缓冲材料层上。