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51. 发明授权

US07642114B2 Micro electro mechanical device and manufacturing method thereof 有权
标题翻译：微机电装置及其制造方法
公开(公告)号：US07642114B2
公开(公告)日：2010-01-05
申请号：US11777409
申请日：2007-07-13
申请人： Mayumi Yamaguchi , Konami Izumi
发明人： Mayumi Yamaguchi , Konami Izumi
IPC分类号： H01L21/00
CPC分类号： H01L29/84 , B81B2201/034 , B81C1/00246 , B81C2203/0742
摘要： To manufacture a micro structure and an electric circuit included in a micro electro mechanical device over the same insulating surface in the same step. In the micro electro mechanical device, an electric circuit including a transistor and a micro structure are integrated over a substrate having an insulating surface. The micro structure includes a structural layer having the same stacked-layer structure as a layered product of a gate insulating layer of the transistor and a semiconductor layer provided over the gate insulating layer. That is, the structural layer includes a layer formed of the same insulating film as the gate insulating layer and a layer formed of the same semiconductor film as the semiconductor layer of the transistor. Further, the micro structure is manufactured by using each of conductive layers used for a gate electrode, a source electrode, and a drain electrode of the transistor as a sacrificial layer.
摘要翻译：在相同的步骤中，在相同的绝缘表面上制造包括在微机电装置中的微结构和电路。在微机电装置中，包括晶体管和微结构的电路集成在具有绝缘表面的基板上。微结构包括具有与晶体管的栅极绝缘层的层叠体和设置在栅极绝缘层上的半导体层相同的层叠结构的结构层。也就是说，结构层包括由与绝缘层相同的绝缘膜形成的层和由与晶体管的半导体层相同的半导体膜形成的层。此外，通过使用用作晶体管的栅电极，源电极和漏电极的导电层作为牺牲层来制造微结构。

52. 发明授权

US07610794B2 Particle detection sensor, method for manufacturing particle detection sensor, and method for detecting particle using particle detection sensor 有权
标题翻译：粒子检测传感器，粒子检测传感器的制造方法以及使用粒子检测传感器检测粒子的方法
公开(公告)号：US07610794B2
公开(公告)日：2009-11-03
申请号：US11467320
申请日：2006-08-25
申请人： Mayumi Yamaguchi , Konami Izumi , Fuminori Tateishi
发明人： Mayumi Yamaguchi , Konami Izumi , Fuminori Tateishi
IPC分类号： G01N27/04 , G01N15/02
CPC分类号： G01N15/1031 , G01N15/1056
摘要： A compact sensor with which particles floating in the air can be easily detected. A sensor having a microstructure which detects a detection object by contact is used. A microstructure has an opening to be a detection hole corresponding to the size of a detection object, and a pair of electrodes having a bridge structure are provided thereabove or thereunder so as to partially contact with each other.
摘要翻译：可以容易地检测到一种紧凑的传感器，可以很容易地检测到悬浮在空气中的颗粒。使用具有通过接触检测检测对象的微结构的传感器。微结构具有对应于检测对象尺寸的检测孔的开口，并且在其上方或其下方设置具有桥接结构的一对电极，以便彼此部分接触。

53. 发明申请

US20070254455A1 Semiconductor integrated circuit, manufacturing method thereof, and semiconductor device using semiconductor integrated circuit 有权
标题翻译：半导体集成电路及其制造方法以及使用半导体集成电路的半导体器件
公开(公告)号：US20070254455A1
公开(公告)日：2007-11-01
申请号：US11785149
申请日：2007-04-16
申请人： Mayumi Yamaguchi , Konami Izumi
发明人： Mayumi Yamaguchi , Konami Izumi
IPC分类号： H01L21/30 , H01L21/46
CPC分类号： H01L27/1266 , H01L21/6835 , H01L21/8221 , H01L21/84 , H01L23/4985 , H01L23/49855 , H01L23/5389 , H01L25/105 , H01L27/0688 , H01L27/12 , H01L27/124 , H01L2224/24145 , H01L2224/76155 , H01L2924/01019 , H01L2924/07811 , H01L2924/12032 , H01L2924/12044 , H01L2924/1305 , H01L2924/13091 , H01L2924/00
摘要： A step of forming a through hole in a semiconductor substrate, or a step of polishing the semiconductor substrate from its back surface requires a very long time and causes decrease of productivity. In addition, when semiconductor substrates are stacked, a semiconductor integrated circuit which is formed of the stack is thick and has poor mechanical flexibility. A release layer is formed over each of a plurality of substrates, layers each having a semiconductor element and an opening for forming a through wiring are formed over each of the release layers. Then, layers each having the semiconductor element are peeled off from the substrates, and then overlapped and stacked, a conductive layer is formed in the opening, and the through wiring is formed; thus, a semiconductor integrated circuit is formed.
摘要翻译：在半导体衬底中形成通孔的步骤或从其背面抛光半导体衬底的步骤需要很长时间并且导致生产率降低。此外，当堆叠半导体衬底时，由堆叠形成的半导体集成电路厚并且机械灵活性差。在多个基板的每一个上形成剥离层，每个剥离层上形成有各自具有半导体元件的层和用于形成贯通布线的开口。然后，将具有半导体元件的层从基板剥离，然后重叠堆叠，在开口中形成导电层，形成贯通布线; 从而形成半导体集成电路。

54. 发明授权

US08692653B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08692653B2
公开(公告)日：2014-04-08
申请号：US11716693
申请日：2007-03-12
申请人： Yutaka Shionoiri , Konami Izumi , Jun Koyama , Yoshiyuki Kurokawa , Shunpei Yamazaki , Tomoaki Atsumi , Takeshi Osada , Takayuki Ikeda , Masato Ishii
发明人： Yutaka Shionoiri , Konami Izumi , Jun Koyama , Yoshiyuki Kurokawa , Shunpei Yamazaki , Tomoaki Atsumi , Takeshi Osada , Takayuki Ikeda , Masato Ishii
IPC分类号： H04Q5/22
CPC分类号： H01Q1/36 , G06K7/10178 , G06K19/0705 , G06K19/0707 , G06K19/0723 , H01Q1/2225 , H01Q1/38 , H01Q7/00 , H01Q9/285 , H02N2/186
摘要： Objects of the invention are to provide a semiconductor device including an RFID, which can transmit and receive individual information without a check of remaining capacity of the battery and a change of the battery in accordance with deterioration over time of the battery for a driving power supply; and which maintains a favorable communication state even when electric power, as a power supply for driving, from an external radio wave or electromagnetic wave (carrier wave) is not sufficient. A battery is provided as a power supply for supplying electric power in the RFID, and electric power obtained by a power generation element is charged in the battery.
摘要翻译：本发明的目的是提供一种包括RFID的半导体器件，其可以在不检查电池的剩余容量的情况下发送和接收各个信息，并且根据用于驱动电源的电池的时间的变化，提供电池的变化 ; 并且即使作为来自外部无线电波或电磁波（载波）的驱动用电源的电力不足，也保持良好的通信状态。提供电池作为用于在RFID中提供电力的电源，并且通过发电元件获得的电力被充电在电池中。

55. 发明申请

US20070229271A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20070229271A1
公开(公告)日：2007-10-04
申请号：US11716693
申请日：2007-03-12
申请人： Yutaka Shionoiri , Konami Izumi , Jun Koyama , Yoshiyuki Kurokawa , Shunpei Yamazaki , Tomoaki Atsumi , Takeshi Osada , Takayuki Ikeda , Masato Ishii
发明人： Yutaka Shionoiri , Konami Izumi , Jun Koyama , Yoshiyuki Kurokawa , Shunpei Yamazaki , Tomoaki Atsumi , Takeshi Osada , Takayuki Ikeda , Masato Ishii
IPC分类号： G08B13/14 , H04Q5/22
CPC分类号： H01Q1/36 , G06K7/10178 , G06K19/0705 , G06K19/0707 , G06K19/0723 , H01Q1/2225 , H01Q1/38 , H01Q7/00 , H01Q9/285 , H02N2/186
摘要： Objects of the invention are to provide a semiconductor device including an RFID, which can transmit and receive individual information without a check of remaining capacity of the battery and a change of the battery in accordance with deterioration over time of the battery for a driving power supply; and which maintains a favorable communication state even when electric power, as a power supply for driving, from an external radio wave or electromagnetic wave (carrier wave) is not sufficient. A battery is provided as a power supply for supplying electric power in the RFID, and electric power obtained by a power generation element is charged in the battery.
摘要翻译：本发明的目的是提供一种包括RFID的半导体器件，其可以在不检查电池的剩余容量的情况下发送和接收各个信息，并且根据用于驱动电源的电池的时间的变化，提供电池的变化 ; 并且即使作为来自外部无线电波或电磁波（载波）的驱动用电源的电力不足，也保持良好的通信状态。提供电池作为用于在RFID中提供电力的电源，并且通过发电元件获得的电力被充电在电池中。

56. 发明授权

US09188631B2 Element substrate, inspecting method, and manufacturing method of semiconductor device 有权
标题翻译：元件基板，检查方法和半导体器件的制造方法
公开(公告)号：US09188631B2
公开(公告)日：2015-11-17
申请号：US13446614
申请日：2012-04-13
申请人： Kiyoshi Kato , Konami Izumi , Masahiko Hayakawa , Koichiro Kamata
发明人： Kiyoshi Kato , Konami Izumi , Masahiko Hayakawa , Koichiro Kamata
IPC分类号： G01R31/02 , G01R31/28 , G01R31/302 , H01L27/13
CPC分类号： G01R31/2822 , G01R31/2886 , G01R31/3025 , H01L27/13
摘要： A substrate including a semiconductor layer, where characteristics of an element can be evaluated with high reliability, and an evaluating method thereof are provided. A substrate including a semiconductor layer of the invention has a closed-loop circuit in which an antenna coil and a semiconductor element are connected in series, and a surface of an area over which the circuit is formed is covered with an insulating film. By using such a circuit, a contactless inspection can be carried out. Further, a ring oscillator can be substituted for the closed-loop circuit.
摘要翻译：提供了包括可以以高可靠性评估元件的特性的半导体层的基板及其评价方法。包括本发明的半导体层的衬底具有一个闭环电路，其中天线线圈和半导体元件串联连接，并且形成有电路的区域的表面被绝缘膜覆盖。通过使用这样的电路，可以进行非接触检查。此外，环形振荡器可以代替闭环电路。

57. 发明授权

US08847916B2 Touch panel and electronic device 有权
标题翻译：触摸屏和电子设备
公开(公告)号：US08847916B2
公开(公告)日：2014-09-30
申请号：US12686564
申请日：2010-01-13
申请人： Yoshiyuki Kurokawa , Konami Izumi
发明人： Yoshiyuki Kurokawa , Konami Izumi
IPC分类号： G06F3/042 , G06F3/041 , G09G5/00 , G09G3/36 , G02F1/1333
CPC分类号： G06F3/0421 , B81B3/0021 , B81B2201/0264 , G02F1/13338 , G02F2201/44 , G06F3/0412 , G06F3/0416 , G06F3/042 , G09G3/3648 , H01L27/1225 , H01L27/1446
摘要： To provide a touch panel with reduced disturbance of display and with improved mechanical strength by suppressing variation in the space between a pair of substrates which form the touch panel even when in contact with an object to be detected. A pixel portion including a plurality of pixels is provided between a pair of substrates. Each pixel includes a photosensor portion which detects that the object to be detected is in contact with one of the pair of substrates, and a MEMS portion which generates a mechanical displacement in a direction perpendicular to the pair of substrates when a signal based on a detection result of the photosensor portion is input.
摘要翻译：通过抑制形成触摸面板的一对基板之间的空间的变化，即使在与被检测物接触的情况下，也能够提供具有降低的显示干扰和改善的机械强度的触摸面板。包括多个像素的像素部分设置在一对基板之间。每个像素包括光电传感器部分，其检测待检测对象与一对基板中的一个接触;以及MEMS部分，当基于检测的信号时，在垂直于该对基板的方向上产生机械位移的MEMS部分输入光电传感器部分的结果。

58. 发明授权

US08324694B2 MEMS switch 有权
标题翻译： MEMS开关
公开(公告)号：US08324694B2
公开(公告)日：2012-12-04
申请号：US12269146
申请日：2008-11-12
申请人： Mayumi Mikami , Konami Izumi
发明人： Mayumi Mikami , Konami Izumi
IPC分类号： H01L29/82
CPC分类号： H01H59/0009 , H01H2059/0072
摘要： An object is that contact between an upper switch electrode and a lower switch electrode is not hindered. The present invention relates to a MEMS switch including a substrate; a structural layer with a beam structure in which at least one end is fixed to the substrate; a lower drive electrode layer and a lower switch electrode layer which are provided below the structural layer and on a surface of the substrate; and an upper drive electrode layer and an upper switch electrode layer which are provided on a surface of the structural layer, which is opposite to the substrate, so as to face the lower drive electrode layer and the lower switch electrode layer, respectively, in which the upper switch electrode layer is larger than the lower switch electrode layer.
摘要翻译：目的是不妨碍上开关电极和下开关电极之间的接触。本发明涉及一种包括基板的MEMS开关; 具有梁结构的结构层，其中至少一个端部固定到所述基板; 下部驱动电极层和下部开关电极层，其设置在所述结构层的下方和所述基板的表面上; 以及设置在与基板相对的结构层的表面上的上驱动电极层和上开关电极层，以分别面向下驱动电极层和下开关电极层，其中上开关电极层大于下开关电极层。

59. 发明授权

US07999335B2 Micromachine and method for manufacturing the same 有权
标题翻译：微机械及其制造方法
公开(公告)号：US07999335B2
公开(公告)日：2011-08-16
申请号：US12327341
申请日：2008-12-03
申请人： Mayumi Mikami , Konami Izumi
发明人： Mayumi Mikami , Konami Izumi
IPC分类号： H01L29/84
CPC分类号： H01H59/0009 , B81B2201/018 , B81C1/00166 , H01H1/58 , H01H2001/0052 , H01H2001/0057 , Y10T29/49155
摘要： A structure which prevents thinning and disconnection of a wiring is provided, in a micromachine (MEMS structure body) formed with a surface micromachining technology. A wiring (upper auxiliary wiring) over a sacrificial layer is electrically connected to a different wiring (upper connection wiring) over the sacrificial layer, so that thinning, disconnection, and the like of the wiring formed over the sacrificial layer at a step portion generated due to the thickness of the sacrificial layer can be prevented. The wiring over the sacrificial layer is formed of the same conductive film as an upper driving electrode which is a movable electrode and is thus thin. However, the different wiring is formed over a structural layer, which is formed by a CVD method and has a rounded step, and has a thickness of 200 nm to 1 μm, whereby thinning, disconnection, and the like of the wiring can be further prevented.
摘要翻译：在形成有表面微机械加工技术的微型机械（MEMS机构）中，提供了防止配线断线和断线的结构。在牺牲层之上的布线（上辅助布线）在牺牲层上电连接到不同的布线（上连接布线），从而在生成的台阶部分上形成在牺牲层上的布线的变薄，断开等由于可以防止牺牲层的厚度。牺牲层上的布线由与作为可动电极的上驱动电极相同的导电膜形成，因此薄。然而，不同的布线形成在通过CVD法形成并具有圆形台阶的结构层上，并且具有200nm至1μm的厚度，从而可以进一步布线的变薄，断开等防止了

60. 发明申请

US20110089955A1 Element Substrate, Inspecting Method, and Manufacturing Method of Semiconductor Device 有权
标题翻译：元件基板，检测方法和半导体器件的制造方法
公开(公告)号：US20110089955A1
公开(公告)日：2011-04-21
申请号：US12910426
申请日：2010-10-22
申请人： Kiyoshi Kato , Konami Izumi , Masahiko Hayakawa , Koichiro Kamata
发明人： Kiyoshi Kato , Konami Izumi , Masahiko Hayakawa , Koichiro Kamata
IPC分类号： G01R27/04
CPC分类号： G01R31/2822 , G01R31/2886 , G01R31/3025 , H01L27/13
摘要： A substrate including a semiconductor layer, where characteristics of an element can be evaluated with high reliability, and an evaluating method thereof are provided. A substrate including a semiconductor layer of the invention has a closed-loop circuit in which an antenna coil and a semiconductor element are connected in series, and a surface of an area over which the circuit is formed is covered with an insulating film. By using such a circuit, a contactless inspection can be carried out. Further, a ring oscillator can be substituted for the closed-loop circuit.
摘要翻译：提供了包括可以以高可靠性评估元件的特性的半导体层的基板及其评价方法。包括本发明的半导体层的衬底具有一个闭环电路，其中天线线圈和半导体元件串联连接，并且形成有电路的区域的表面被绝缘膜覆盖。通过使用这样的电路，可以进行非接触检查。此外，环形振荡器可以代替闭环电路。

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