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    • 52. 发明授权
    • Permanent magnet electric motor
    • 永磁电动机
    • US08624457B2
    • 2014-01-07
    • US13130206
    • 2009-11-19
    • Kazuto SakaiYutaka HashibaNorio TakahashiKazuaki Yuuki
    • Kazuto SakaiYutaka HashibaNorio TakahashiKazuaki Yuuki
    • H02K21/12
    • H02K1/2766
    • An increase of the magnetization current can be prevented during demagnetization and magnetization, and a variable speed operation can be achieved at a high power output over a wide range of from a low speed to a high speed. A rotor (1) is configured by a rotor core (2), a variable magnetic force magnet (3) and a fixed magnetic force magnet (4). A variable magnetic force magnet (3) and a fixed magnetic force magnet (4a) are overlapped in the magnetization direction thereof to form a series of magnets. The series of magnets is located within the rotor core at a position where the magnetization direction is in the direction of a d-axis. On either side of the series of magnets of the variable magnetic force magnet (3) and the fixed magnetic force magnet (4a), fixed magnetic force magnets (4b, 4b) are located at a position where the magnetization direction is in the direction of the d-axis. When the flux linkage of the variable magnetic force magnet is reduced, a current of an armature coil allows a magnetic field to act in the reverse direction to the magnetization direction of the variable magnetic force magnet. When the flux linkage of the variable magnetic force magnet is increased, a current of the armature coil allows a magnetic field to act in the same direction as the magnetization direction of the variable magnetic force magnet.
    • 在退磁和磁化期间可以防止磁化电流的增加,并且可以在从低速到高速的宽范围内的高功率输出下实现可变速度操作。 转子(1)由转子铁芯(2),可变磁力磁铁(3)和固定磁力磁铁(4)构成。 可变磁力磁体(3)和固定磁力磁铁(4a)在其磁化方向上重叠以形成一系列磁体。 一系列磁体位于转子芯内的磁化方向为d轴方向的位置。 在可变磁力磁铁(3)和固定磁力磁铁(4a)的一系列磁铁的两侧,固定磁力磁铁(4b,4b)位于磁化方向为 d轴。 当可变磁力磁铁的磁链减小时,电枢线圈的电流允许磁场沿与可变磁力磁铁的磁化方向相反的方向作用。 当可变磁力磁铁的磁通增加时,电枢线圈的电流允许磁场沿与可变磁力磁铁的磁化方向相同的方向起作用。
    • 54. 发明申请
    • FOUR-WIRE ELECTROSTATIC ACTUATOR AND STATOR
    • 四线电动执行器和定子
    • US20130020904A1
    • 2013-01-24
    • US13639000
    • 2011-04-28
    • Norio Takahashi
    • Norio Takahashi
    • H02N1/00
    • H02N1/004
    • A four-wire electrostatic actuator including: a stator having a substrate with two surfaces and at least four main-movement linear electrodes separately provided on one surface of the substrate and arranged in parallel at regular intervals; and a movable element disposed on the stator. The first and third main-movement linear electrodes of the four main-movement linear electrodes are supplied with rectangular wave signals or sine wave signals with reversed phases. The second and fourth main-movement linear electrodes are supplied with rectangular wave signals or sine wave signals with reversed phases. The two signals inputted to the adjacent two electrodes are shifted from each other by a quarter of a period with identical strength. The stator further includes a plurality of one-side auxiliary-movement linear electrodes on one side of the four main-movement linear electrodes, the auxiliary-movement linear electrodes being extended perpendicularly to the four main-movement linear electrodes.
    • 一种四线静电致动器,包括:具有两个表面的基板的定子和分别设置在所述基板的一个表面上且以规则间隔平行排列的至少四个主运动线性电极; 以及设置在定子上的可动元件。 四个主运动线性电极的第一和第三主运动线性电极被提供有反相的矩形波信号或正弦波信号。 第二和第四主运动线性电极被提供有反相的矩形波信号或正弦波信号。 输入到相邻的两个电极的两个信号彼此相差四分之一的强度相同。 定子还包括在四个主运动线性电极的一侧上的多个一侧辅助运动线性电极,辅助运动线性电极垂直于四个主运动线性电极延伸。
    • 59. 发明授权
    • Semiconductor package
    • 半导体封装
    • US07388287B2
    • 2008-06-17
    • US11350745
    • 2006-02-10
    • Norio Takahashi
    • Norio Takahashi
    • H01L23/34
    • G01P1/023G01D11/245H01L25/16H01L2224/48137H01L2224/48145H01L2924/00012
    • A semiconductor package includes a base plate; a sidewall provided at a periphery of the base plate; a sensor chip retained in a chip accommodation space defined by the sidewall; and a chip installation hole provided in the base plate for installing the sensor chip. The sensor chip is disposed in the chip installation hole provided in the base plate of the case. Accordingly, it is possible to reduce a thickness of the semiconductor package without changing a thickness of the sensor chip. The base plate has a relatively large thickness except for the chip installation hole. Accordingly, even when the semiconductor package is made thinner, rigidity of the base plate is maintained, thereby minimizing a strain in the base plate.
    • 半导体封装包括基板; 设置在所述基板的周边的侧壁; 传感器芯片保持在由侧壁限定的芯片容纳空间中; 以及设置在基板上的用于安装传感器芯片的芯片安装孔。 传感器芯片设置在设置在壳体的基板中的芯片安装孔中。 因此,可以在不改变传感器芯片的厚度的情况下减小半导体封装的厚度。 除了芯片安装孔之外,基板具有相对较大的厚度。 因此,即使使半导体封装变薄,也能够维持基板的刚性,从而使基板的应变最小化。