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    • 56. 发明授权
    • Oxetane compounds containing cinnamyl functionality
    • 含有肉桂基官能团的氧杂环丁烷化合物
    • US06753434B1
    • 2004-06-22
    • US10430114
    • 2003-05-06
    • Osama M. Musa
    • Osama M. Musa
    • C07D30506
    • C07D305/06
    • These compounds contain an oxetane functionality and a cinnamyl functionality. The oxetane functionality is homopolymerizable in reactions that can undergo cationic or anionic ring opening, and the cinnamyl functionality is polymerizable with compounds such as electron acceptor compounds. The dual functionality allows for dual cure processing. The generic structure of such compounds is in which R is a methyl or ethyl group, X and Y independently are a direct bond, or an ether, ester, or carbamate group, and Q is a divalent hydrocarbon (which may contain heteroatoms of N, O, or S), provided that X and Y will not both be direct bonds in the same molecule.
    • 这些化合物含有氧杂环丁烷官能团和肉桂基官能团。 氧杂环丁烷官能度可以在可以经历阳离子或阴离子开环的反应中是均聚的,并且肉桂基官能团可用化合物如电子受体化合物聚合。 双重功能允许双重固化处理。 这种化合物的通式结构是其中R是甲基或乙基,X和Y独立地是直接键,或醚,酯或氨基甲酸酯基,Q是二价烃(其可以含有N,O的杂原子 或S),条件是X和Y两者都不会同一分子中的直接键。
    • 58. 发明授权
    • Curable compositions containing benzoxazine
    • 含有苯并恶嗪的固化组合物
    • US06620905B1
    • 2003-09-16
    • US10080738
    • 2002-02-23
    • Osama M. Musa
    • Osama M. Musa
    • C08G7306
    • C07D265/16C08G73/06
    • Curable compositions comprise a benzoxazine compound or resin in combination with at least one additional curable compound or resin. Optionally, the composition will further comprise a curing agent and/or a filler. These compositions have utility as adhesives, coatings and encapsulants, especially for use within the semiconductor fabrication industry, with particular utility as die attach adhesives, films, and underfill materials, such as no-flow underfills, capillary flow underfills, wafer level underfills, and as lead free solders.
    • 可固化组合物包含与至少一种另外的可固化化合物或树脂组合的苯并恶嗪化合物或树脂。 任选地,组合物还将包含固化剂和/或填料。 这些组合物具有作为粘合剂,涂料和密封剂的用途,特别是在半导体制造工业中使用,特别用作管芯附着粘合剂,薄膜和底部填充材料,例如无流动底部填充物,毛细管流动底部填充物,晶片级底层填充物和 作为无铅焊料。