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51. 发明申请

US20120026492A1 DETECTION OF LAYER CLEARING USING SPECTRAL MONITORING 有权
标题翻译：使用光谱监测检测层清除
公开(公告)号：US20120026492A1
公开(公告)日：2012-02-02
申请号：US13189277
申请日：2011-07-22
申请人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
发明人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
IPC分类号： G01J3/00
CPC分类号： B24B37/013 , B24B37/042 , G01B11/0633 , G01B11/0683 , H01L21/3212 , H01L22/12 , H01L22/26
摘要： A method of polishing includes polishing a substrate having a second layer overlying a first layer, measuring a sequence of groups of spectra of light from the substrate while the substrate is being polished, each group of the groups of spectra including spectra from different locations on the substrate, for each group, calculating a value for a dispersion parameter of the spectra in the group to generate a sequence of dispersion values, and detecting exposure of the first layer based on the sequence of dispersion values.
摘要翻译：抛光方法包括抛光具有覆盖在第一层上的第二层的衬底，在衬底被抛光时测量来自衬底的光的光谱组序列，每组光谱组包括来自不同位置的光谱基板，对于每个组，计算组中的光谱的色散参数的值以产生色散值序列，并且基于色散值序列来检测第一层的曝光。

52. 发明申请

US20110294400A1 Determining Physical Property of Substrate 审中-公开
标题翻译：确定基材的物理性质
公开(公告)号：US20110294400A1
公开(公告)日：2011-12-01
申请号：US13193011
申请日：2011-07-28
申请人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
发明人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
IPC分类号： B24B51/00
CPC分类号： G01B11/0683 , G01B11/0625 , Y10S707/99936
摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
摘要翻译：确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。数据库中的每个光谱具有与之相关联的物理属性值。该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

53. 发明申请

US20110104987A1 ENDPOINT METHOD USING PEAK LOCATION OF SPECTRA CONTOUR PLOTS VERSUS TIME 有权
标题翻译：使用峰值位置的端点方法维持时间的端点方法
公开(公告)号：US20110104987A1
公开(公告)日：2011-05-05
申请号：US12938240
申请日：2010-11-02
申请人： Jeffrey Drue David , Harry Q. Lee , Dominic J. Benvegnu , Boguslaw A. Swedek
发明人： Jeffrey Drue David , Harry Q. Lee , Dominic J. Benvegnu , Boguslaw A. Swedek
IPC分类号： B24B51/00
CPC分类号： G05B19/418 , B24B37/013 , B24B37/042 , B24B37/205 , B24B49/12 , G05B2219/45232
摘要： In one aspect, a method of polishing includes polishing a substrate, and receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing. The method includes measuring a sequence of spectra of light reflected from the substrate while the substrate is being polished, where at least some of the spectra of the sequence differ due to material being removed during the polishing. The method of polishing includes determining a value of a characteristic of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of values for the characteristic, fitting a function to the sequence of values, and determining either a polishing endpoint or an adjustment for a polishing rate based on the function.
摘要翻译：在一个方面，抛光方法包括抛光衬底，以及接收所选择的光谱特征的识别和所选择的光谱特征的特征以在抛光期间进行监测。该方法包括测量在衬底被抛光时从衬底反射的光的光谱序列，其中序列的至少一些光谱由于在抛光期间被去除的材料而不同。抛光方法包括确定光谱序列中的每个光谱的所选光谱特征的特征值，以产生特征值的序列，将功能拟合到值序列，以及确定抛光端点或基于该功能的抛光速率的调整。

54. 发明申请

US20100297916A1 METHODS OF USING OPTICAL METROLOGY FOR FEED BACK AND FEED FORWARD PROCESS CONTROL 有权
标题翻译：使用光学计量学方法进行回馈和进给前进过程控制
公开(公告)号：US20100297916A1
公开(公告)日：2010-11-25
申请号：US12625345
申请日：2009-11-24
申请人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
发明人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
IPC分类号： B24B49/04 , B24B49/12
CPC分类号： B24B37/013 , B24B49/12 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method includes polishing a substrate on a first platen using a first set of parameters, obtaining a plurality of measured spectra from at least two zones, comparing the plurality of measured spectra with a reference spectrum to evaluate the thickness of each of the at least two zones of the substrate, comparing a thickness of a first zone with a thickness of a second zone, determining whether the thickness of the first zone falls within a predetermined range of the thickness of the second zone, and if the thickness does not fall within the predetermined range, at least one of a) adjusting at least one parameter of the first set and polishing a second substrate on the first platen using the adjusted parameters, or b) adjusting at least one parameter of a second set and polishing the substrate on a second platen using the adjusted parameters.
摘要翻译：一种方法包括使用第一组参数来抛光第一台板上的基板，从至少两个区域获得多个测量光谱，将多个测量光谱与参考光谱进行比较，以评估至少两个区域，比较第一区域的厚度和第二区域的厚度，确定第一区域的厚度是否落在第二区域的厚度的预定范围内，并且如果厚度不在第二区域的厚度内预定范围，以下至少一个：a）调整第一组的至少一个参数并使用经调整的参数来研磨第一台上的第二基板，或b）调整第二组的至少一个参数并在一个第二个压盘使用调整参数。

55. 发明授权

US07746485B2 Determining physical property of substrate 有权
标题翻译：确定底物的物理性质
公开(公告)号：US07746485B2
公开(公告)日：2010-06-29
申请号：US12253160
申请日：2008-10-16
申请人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
发明人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
IPC分类号： G01B11/28
CPC分类号： G01B11/0683 , G01B11/0625 , Y10S707/99936
摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
摘要翻译：确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。数据库中的每个光谱具有与之相关联的物理属性值。该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

56. 发明申请

US20100130100A1 USING OPTICAL METROLOGY FOR WAFER TO WAFER FEED BACK PROCESS CONTROL 有权
标题翻译：使用光学方程进行波形回馈过程控制
公开(公告)号：US20100130100A1
公开(公告)日：2010-05-27
申请号：US12625480
申请日：2009-11-24
申请人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
发明人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
IPC分类号： B24B49/02 , B24B49/12
CPC分类号： B24B37/013 , B24B49/12 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method of controlling the polishing of a substrate includes polishing a substrate on a first platen using a first set of parameters, obtaining first and second sequences of measured spectra from first and second regions of the substrate with an in-situ optical monitoring system, generating first and second sequences of values from the first and second sequences of measured spectra, fitting first and second linear functions to the first and second sequences of values, determining a difference between the first linear function and the second linear function, adjusting at least one parameter of the first set of parameters based on the difference, and polishing the second substrate on the first platen using the adjusted parameter.
摘要翻译：控制衬底抛光的方法包括使用第一组参数在第一压板上抛光衬底，用原位光学监测系统从衬底的第一和第二区域获得测量光谱的第一和第二序列，产生来自第一和第二测量光谱序列的第一和第二序列值，将第一和第二线性函数拟合到第一和第二序列序列，确定第一线性函数和第二线性函数之间的差异，调整至少一个参数基于所述差异的所述第一组参数，并且使用所述调整参数来研磨所述第一台板上的所述第二基板。

57. 发明申请

US20100129939A1 USING OPTICAL METROLOGY FOR WITHIN WAFER FEED FORWARD PROCESS CONTROL 有权
标题翻译：在波形进给前进过程控制中使用光学方程
公开(公告)号：US20100129939A1
公开(公告)日：2010-05-27
申请号：US12625489
申请日：2009-11-24
申请人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
发明人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
IPC分类号： H01L21/66 , G06F17/00
CPC分类号： B24B37/013 , B24B49/12 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method of controlling the polishing of a substrate includes polishing a substrate on a first platen using a first set of parameters, obtaining first and second sequences of measured spectra from first and second regions of the substrate with an in-situ optical monitoring system, generating first and second sequences of values from the first and second sequences of measured spectra, fitting first and second linear functions to the first and second sequences of values, determining a difference between the first linear function and the second linear function, adjusting at least one parameter of a second set of parameters based on the difference, and polishing the substrate on a second platen using the adjusted parameter.
摘要翻译：控制衬底抛光的方法包括使用第一组参数在第一压板上抛光衬底，用原位光学监测系统从衬底的第一和第二区域获得测量光谱的第一和第二序列，产生来自第一和第二测量光谱序列的第一和第二序列值，将第一和第二线性函数拟合到第一和第二序列序列，确定第一线性函数和第二线性函数之间的差异，调整至少一个参数基于所述差异的第二组参数，以及使用所述调整参数在所述第二压板上抛光所述衬底。

58. 发明申请

US20100114532A1 WEIGHTED SPECTROGRAPHIC MONITORING OF A SUBSTRATE DURING PROCESSING 审中-公开
标题翻译：加工过程中基体的加权光谱监测
公开(公告)号：US20100114532A1
公开(公告)日：2010-05-06
申请号：US12264094
申请日：2008-11-03
申请人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu
发明人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu
IPC分类号： G01N21/25
CPC分类号： H01L22/12 , H01L22/20
摘要： A substrate having an outermost layer undergoing polishing and at least one underlying layer is irradiated with light. A sequence of current spectra is obtained with an in-situ optical monitoring system, a current spectrum from the sequence of current spectra being a spectrum of the light reflected from the substrate, wherein the current spectrum includes a range of wavelengths and, for all wavelengths in the range of wavelengths, a value corresponding to a wavelength. Further, a value of the current spectrum corresponding to a wavelength is modified with at least one value in a gain factor spectrum, wherein the gain factor spectrum includes a first range of wavelengths and, for all wavelengths in the first range of wavelengths, a value corresponding to a wavelength. The polishing of the outermost layer of the substrate is then changed based upon the modified value of the current spectrum.
摘要翻译：用光照射具有进行抛光的最外层和至少一个下层的基板。利用原位光学监测系统获得电流光谱序列，来自当前光谱序列的当前光谱是从衬底反射的光的光谱，其中当前光谱包括波长范围，并且对于所有波长在波长范围内，对应于波长的值。此外，对应于波长的当前光谱的值用增益因子光谱中的至少一个值进行修正，其中增益因子光谱包括第一波长范围，并且对于第一波长范围内的所有波长，值对应于波长。然后基于当前光谱的修改值改变衬底的最外层的抛光。

59. 发明申请

US20100056023A1 Adjusting Polishing Rates by Using Spectrographic Monitoring of a Substrate During Processing 有权
标题翻译：通过在处理过程中使用基板的光谱监测来调整抛光速率
公开(公告)号：US20100056023A1
公开(公告)日：2010-03-04
申请号：US12553870
申请日：2009-09-03
申请人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek
发明人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek
IPC分类号： B24B49/06 , B24B49/12
CPC分类号： B24B37/005 , B24B37/013 , B24B49/12 , H01L21/302
摘要： A computer-implemented method includes receiving a sequence of current spectra of reflected light from a substrate; comparing each current spectrum from the sequence of current spectra to a plurality of reference spectra from a reference spectra library to generate a sequence of best-match reference spectra; determining a goodness of fit for the sequence of best-match reference spectra; and determining at least one of whether to adjust a polishing rate or an adjustment for the polishing rate, based on the goodness of fit.
摘要翻译：计算机实现的方法包括从基板接收反射光的当前光谱序列; 将来自当前光谱序列的每个当前光谱与来自参考光谱库的多个参考光谱进行比较，以生成最佳匹配参考光谱的序列; 确定最佳匹配参考光谱序列的拟合优度; 以及基于拟合优度确定是否调整抛光速率或抛光速率的调整中的至少一个。

60. 发明授权

US07657342B2 Substrate thickness measuring during polishing 有权
公开(公告)号：US07657342B2
公开(公告)日：2010-02-02
申请号：US12185719
申请日：2008-08-04
申请人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
发明人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
IPC分类号： G06F19/00 , H01L21/00 , B24B49/00
摘要： A computer program product that determines a polishing endpoint includes obtaining spectra from different zones on a substrate during different times in a polishing sequence, matches the spectra with indexes in a library and uses the indexes to determining a polishing rate for each of the different zones from the indexes. An adjusted polishing rate can be determined for one of the zones, which causes the substrate to have a desired profile when the polishing end time is reached.

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