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51. 发明授权

US5528135A Sheet ceramic package having electrically independent products units 失效
标题翻译：具有电气独立产品单元的片状陶瓷封装
公开(公告)号：US5528135A
公开(公告)日：1996-06-18
申请号：US108395
申请日：1993-08-18
申请人： Sigeki Kawamura , Kazuhiko Ito
发明人： Sigeki Kawamura , Kazuhiko Ito
IPC分类号： H01L21/66 , G01R1/04 , G01R31/28 , H01L23/08 , H01L23/13
CPC分类号： G01R1/0408 , H01L23/13 , G01R31/2886 , H01L2924/0002
摘要： A sheet ceramic package includes a plurality of product units, such as ceramic substrates and circuit substrates for semiconductor devices. The individual product units can be separated from the sheet ceramic package by breaking them apart along snap lines. Each product unit has inner layer conductors for providing external connections to a semiconductor to be packaged therein. A dummy part, with conductor patterns for evaluating the electrical characteristics of corresponding units, surrounds at least partially the periphery of each product unit. Exposed conductors of the product units and the dummy parts are plated by means of electroless plating allowing the product units to be electrically independent of each other because of the absence of the need to apply a uniform plating potential. Semiconductors are packaged into the individual product units and are hermetically sealed. The entire sheet ceramic package of the present invention is then tested, prior to the physical separation of product units, to determine the electrical characteristics of each individual product unit, using the evaluating patterns described above. The electrically independent product units make it unnecessary to break the sheet up into individual product units to test their electrical characteristics. Thus, the present invention eliminates the troublesome process of breaking the sheet into individual units and arranging them on a jig set for individual testing as required by the conventional sheet package. The efficiency of testing the product units thus improves dramatically.
摘要翻译：片状陶瓷封装包括多个产品单元，例如陶瓷基板和用于半导体器件的电路基板。单个产品单元可以通过沿着划线分开而与片状陶瓷封装分离。每个产品单元具有内层导体，用于提供与待包装的半导体的外部连接。具有用于评估相应单元的电特性的导体图案的虚拟部分至少部分地围绕每个产品单元的周边。由于不需要施加均匀的电镀电位，产品单元和虚设部件的裸露导体通过无电镀电镀，使得产品单元彼此电独立。半导体封装在各个产品单元中，并被密封。然后在产品单元的物理分离之前测试本发明的整个片状陶瓷封装，以使用上述评估图案确定每个单独产品单元的电特性。电独立的产品单元不需要将片材分解成单个产品单元以测试其电特性。因此，本发明消除了将片材分解成单独的单元并将它们布置在用于单独测试的夹具的繁琐过程中，如常规片材包装所要求的。因此，产品单元的测试效率显着提高。

52. 发明授权

US5440205A Fluorescent lamp starter having a transistor base control means 失效
标题翻译：具有晶体管基极控制装置的荧光灯启动器
公开(公告)号：US5440205A
公开(公告)日：1995-08-08
申请号：US128851
申请日：1993-09-28
申请人： Tetsuya Tahara , Kazushige Sugita , Kazuhiko Ito , Nobuhisa Yoshikawa
发明人： Tetsuya Tahara , Kazushige Sugita , Kazuhiko Ito , Nobuhisa Yoshikawa
IPC分类号： H05B41/04 , H05B39/00
CPC分类号： H05B41/046 , Y10S315/02 , Y10S315/05
摘要： A fluorescent lamp starter which includes: a series circuit to be connected to a power source for supplying an AC voltage, including a ballast and a fluorescent lamp equipped with electrodes; a transistor having a collector and an emitter connected through a diode between the electrodes on an opposite side of the fluorescent lamp in which the power source is not connected; a control voltage supply means having a resistance means and a capacitor, which are operated by a voltage between the collector and the emitter of the transistor; and a transistor base control means for switching the transistor by a total voltage of a part of a voltage generated in the resistance means of the control voltage supply means and a voltage generated in the capacitor thereof.
摘要翻译：一种荧光灯起动器，包括：串联电路，连接到用于提供AC电压的电源，包括镇流器和配备有电极的荧光灯; 晶体管，其具有集电极和发射极，所述集电极和发射极通过二极管连接在所述电极之间，所述二极管位于所述电源未连接的所述荧光灯的相反侧; 具有由晶体管的集电极和发射极之间的电压操作的电阻装置和电容器的控制电压供给装置; 以及晶体管基极控制装置，用于通过在控制电压供给装置的电阻装置中产生的一部分电压的总电压和在其电容器中产生的电压来切换晶体管。

53. 发明授权

US5384766A LAN management system in electronic switching apparatus 失效
标题翻译：电子开关设备的LAN管理系统
公开(公告)号：US5384766A
公开(公告)日：1995-01-24
申请号：US125028
申请日：1993-09-21
申请人： Kouji Yamato , Kazuhiko Ito
发明人： Kouji Yamato , Kazuhiko Ito
IPC分类号： H04M3/22 , H04L12/24 , H04L12/44 , H04L12/64 , H04M11/00 , H04Q11/04 , H04J3/14
CPC分类号： H04L41/24 , H04L12/44 , H04L12/6402 , H04L41/26 , H04M3/42161 , Y10S370/908
摘要： A switching apparatus for constructing a system integrating a telephone switching network and a LAN includes: line interface sections, each connected to a transmission line for transmitting a signal on which low-speed data and high-speed data are multiplexed; a low-speed data switch for switching low-speed data demultiplexed in each line interface section; a high-speed data switch for switching high-speed data demultiplexed in each line interface section; and a processor for monitoring and controlling the data traffic passing through the low-speed data switch and high-speed data switch. An address in a designated position in the high-speed data demultiplexed in each line interface section is read out, whereby the association between the low-speed data terminal and high-speed data terminal is identified and stored. By referring to this association, management of LAN terminals can be performed using the maintenance operation procedures used in a conventional electronic switching apparatus.
摘要翻译：一种用于构建集成电话交换网络和LAN的系统的交换装置包括：线路接口部分，每个线路接口部分连接到用于发送低速数据和高速数据被复用的信号的传输线; 低速数据开关，用于切换在每个线路接口部分解复用的低速数据; 用于切换在每个线路接口部分中解复用的高速数据的高速数据开关; 以及用于监控和控制通过低速数据交换机和高速数据交换机的数据业务的处理器。读取在每个行接口部分解复用的高速数据中的指定位置的地址，由此识别并存储低速数据终端与高速数据终端之间的关联。通过参照该关联，可以使用常规电子开关装置中使用的维护操作程序来执行LAN终端的管理。

54. 发明授权

US5063197A Heat-sensitive recording material 失效
标题翻译：热敏记录材料
公开(公告)号：US5063197A
公开(公告)日：1991-11-05
申请号：US576969
申请日：1990-09-04
申请人： Atsuo Goto , Fumio Okumura , Kazuhiko Ito
发明人： Atsuo Goto , Fumio Okumura , Kazuhiko Ito
IPC分类号： B41M5/337
CPC分类号： B41M5/3375
摘要： A heat-sensitive recording material comprising a support and a heat-sensitive recording layer provided on the support, said heat-sensitive recording layer comprising an electron-donating, colorless or pale-colored dye precursor, an electron-accepting developer which reacts with the dye precursor to form images upon heating, a binder, and a specific aromatic compound. The heat-sensitive recording material has an excellent heat responsiveness, and hence recorded images having a sufficient optical density can be printed even with low energy.
摘要翻译：一种热敏记录材料，包括载体和设置在载体上的热敏记录层，所述热敏记录层包含给电子，无色或浅色染料前体，受电子显影剂与染料前体，在加热时形成图像，粘合剂和特定的芳族化合物。热敏记录材料具有优异的热响应性，因此即使以低能量也能印刷具有足够光密度的记录图像。

55. 外观设计

USD301612S Table top for massaging and chiropractic therapy 失效
公开(公告)号：USD301612S
公开(公告)日：1989-06-13
申请号：US147914
申请日：1988-01-25
申请人： Teruo Masuda , Kazuyuki Yamaguchi , Kazuhiko Ito
设计人： Teruo Masuda , Kazuyuki Yamaguchi , Kazuhiko Ito

56. 发明授权

US4717975A Erasing device 失效
标题翻译：擦除设备
公开(公告)号：US4717975A
公开(公告)日：1988-01-05
申请号：US701421
申请日：1985-02-14
申请人： Tokihiko Ogura , Tsuguhide Sakata , Kazuhiko Ito , Masahiko Ogawa
发明人： Tokihiko Ogura , Tsuguhide Sakata , Kazuhiko Ito , Masahiko Ogawa
IPC分类号： G11B5/008 , G11B5/012 , G11B5/024 , G11B5/03
CPC分类号： G11B5/0086 , G11B5/012 , G11B5/024
摘要： An erasing device includes a magnetic head, a drive motor for rotating a magnetic disc relative to the magnetic head, an erase signal source for producing an erase signal which varies periodically, and apparatus for causing the head to generate magnetic fields with the erase signal, wherein the frequency f.sub.V of rotation of the magnetic disc and the frequency f.sub.E of the erase signal together satisfy the following condition so that no nodes of the erasing fields are fixed at any point on a track of the magnetic disc during a plurality of rotations of the magnetic disc:f.sub.E .noteq.(k/2)f.sub.Vwhere k is a positive integer.
摘要翻译：擦除装置包括磁头，用于使磁盘相对于磁头旋转的驱动马达，用于产生周期性变化的擦除信号的擦除信号源，以及使磁头产生具有擦除信号的磁场的装置，其中磁盘的旋转频率fV和擦除信号的频率fE一起满足以下条件，使得在多次旋转期间，在磁盘的轨道上的任何点处，擦除场的任何点都不固定磁盘：fE NOTEQUAL（k / 2）fV其中k是正整数。

57. 发明授权

US4251242A Mist eliminator 失效
标题翻译：除雾器
公开(公告)号：US4251242A
公开(公告)日：1981-02-17
申请号：US11764
申请日：1979-02-12
申请人： Kazuhiko Ito
发明人： Kazuhiko Ito
IPC分类号： B01D45/16 , B01D45/18
CPC分类号： B01D45/16
摘要： A mist eliminator comprises a plurality of blades spaced apart in parallel with each other. Each blade has a step-like portion which curves smoothly up to a single plateau. An elimination chamber is located on the plateau. The length from the eliminating chambers to gas outlets is less than that from gas inlets to the eliminating chambers and the parts of the blades from the eliminating chambers to the gas outlets is substantially parallel with a direction in which a gas enters the eliminator. The eliminator is provided at least in the rear of the blades with washing water nozzles for spraying washing water against the gas outlets. The eliminator is capable of effectively collecting fine mist and removing solid particles adhered to the blades by washing water with ease and therefore has no risk of clogging of gas passages.
摘要翻译：除雾器包括彼此间隔开的多个叶片。每个叶片具有平滑弯曲到单个平台的阶梯状部分。消除室位于高原。从消除室到气体出口的长度小于从排气室进入的气体入口的长度，并且从消除室到气体出口的叶片部分基本上平行于气体进入消除器的方向。消除器至少在叶片的后部设置有用于喷射洗涤水抵靠气体出口的洗涤水喷嘴。消除器能够有效地收集细雾，并且通过轻轻地洗涤水来除去附着在叶片上的固体颗粒，因此没有气体通道堵塞的风险。

58. 发明授权

US09318401B2 Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device 有权
标题翻译：用于保护半导体结的玻璃组合物，半导体器件和半导体器件的制造方法
公开(公告)号：US09318401B2
公开(公告)日：2016-04-19
申请号：US14369732
申请日：2012-05-08
申请人： Koya Muyari , Koji Ito , Atsushi Ogasawara , Kazuhiko Ito
发明人： Koya Muyari , Koji Ito , Atsushi Ogasawara , Kazuhiko Ito
IPC分类号： C03C3/076 , B32B17/00 , H01L21/00 , H01L23/29 , H01L29/66 , H01L29/861 , H01L21/02 , H01L21/762 , C03C8/04 , H01L21/56 , C03C3/093 , H01L23/31
CPC分类号： H01L23/291 , C03C3/093 , C03C8/04 , C03C8/24 , C03C2207/00 , H01L21/02112 , H01L21/02164 , H01L21/02175 , H01L21/02178 , H01L21/02192 , H01L21/02345 , H01L21/56 , H01L21/761 , H01L21/76224 , H01L21/76232 , H01L23/3171 , H01L23/3185 , H01L29/66136 , H01L29/8611 , H01L29/8613 , H01L2924/0002 , H01L2924/00
摘要： Provided is a glass composition for protecting a semiconductor junction which contains at least SiO2, B2O3, Al2O3, ZnO and at least two oxides of alkaline earth metals selected from a group consisting of CaO, MgO and BaO, and substantially contains none of Pb, As, Sb, Li, Na and K, wherein an average linear expansion coefficient within a temperature range of 50° C. to 550° C. falls within a range of 3.33×10−6 to 4.13×10−6. A semiconductor device having high breakdown strength can be manufactured using such a glass material containing no lead in the same manner as a conventional case where “a glass material containing lead silicate as a main component” is used.
摘要翻译：本发明提供一种用于保护半导体结的玻璃组合物，其至少含有SiO 2，B 2 O 3，Al 2 O 3，ZnO和至少两种选自CaO，MgO和BaO的碱土金属的氧化物，并且基本上不含有Pb，As ，Sb，Li，Na和K，其中在50℃至550℃的温度范围内的平均线膨胀系数在3.33×10 -6至4.13×10 -6的范围内。与使用“含有硅酸铅作为主要成分的玻璃材料”的常规情况相同的方式，可以使用不含铅的玻璃材料制造具有高击穿强度的半导体器件。

59. 发明申请

US20140361416A1 RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING RESIN-SEALED SEMICONDUCTOR DEVICE 有权
标题翻译：树脂密封半导体器件及制造树脂密封半导体器件的方法
公开(公告)号：US20140361416A1
公开(公告)日：2014-12-11
申请号：US14369729
申请日：2012-05-08
申请人： Atsushi Ogasawara , Koji Ito , Kazuhiko Ito , Koya Muyari
发明人： Atsushi Ogasawara , Koji Ito , Kazuhiko Ito , Koya Muyari
IPC分类号： H01L23/00 , H01L29/861 , C03C8/04 , H01L21/02 , C03C8/02 , H01L23/29 , H01L23/31
CPC分类号： H01L23/564 , C03C3/085 , C03C3/087 , C03C3/093 , C03C8/02 , C03C8/04 , C03C8/24 , C03C2207/00 , H01L21/02112 , H01L21/02161 , H01L21/02318 , H01L21/56 , H01L23/291 , H01L23/3107 , H01L23/3171 , H01L23/3178 , H01L23/4952 , H01L23/49551 , H01L24/73 , H01L29/0615 , H01L29/0661 , H01L29/66136 , H01L29/861 , H01L29/8613 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： A resin-sealed semiconductor device 10 of the present invention includes: a mesa-type semiconductor element 100 which includes a mesa-type semiconductor base body having a pn-junction exposure portion in an outer peripheral tapered region which surrounds a mesa region, and a glass layer which covers at least the outer peripheral tapered region; and a molding resin 40 which seals the mesa-type semiconductor element 100, wherein the mesa-type semiconductor element 100 includes a glass layer which substantially contains no Pb as the glass layer. The resin-sealed semiconductor device of the present invention can acquire higher resistance to a reverse bias at a high temperature than a conventional resin-sealed semiconductor device, although the resin-sealed semiconductor device of the present invention has the structure where the mesa-type semiconductor element is molded with a resin in the same manner as the conventional resin-sealed semiconductor device.
摘要翻译：本发明的树脂密封型半导体装置10包括：台面型半导体元件100，其包括在包围台面区域的外周锥形区域中具有pn结曝光部的台面型半导体基体，至少覆盖外周锥形区域的玻璃层; 以及密封台面型半导体元件100的模制树脂40，其中台面型半导体元件100包括基本上不含Pb作为玻璃层的玻璃层。本发明的树脂密封型半导体装置虽然能够比现有的树脂密封型半导体装置在高温下的反偏压性能更高，但是本发明的树脂密封型半导体装置具有台面型半导体元件以与传统的树脂密封半导体器件相同的方式用树脂模制。

60. 发明申请

US20130075873A1 GLASS COMPOSITION FOR PROTECTING SEMICONDUCTOR JUNCTION, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE 有权
标题翻译：用于保护半导体结的玻璃组合物，制造半导体器件和半导体器件的方法
公开(公告)号：US20130075873A1
公开(公告)日：2013-03-28
申请号：US13582215
申请日：2011-05-26
申请人： Atsushi Ogasawara , Kazuhiko Ito , Koji Ito
发明人： Atsushi Ogasawara , Kazuhiko Ito , Koji Ito
IPC分类号： H01L21/02 , C03C3/093 , C03C3/066 , H01L23/29
CPC分类号： H01L21/022 , C03C3/066 , C03C3/093 , C03C8/04 , C03C8/24 , H01L21/02123 , H01L21/02172 , H01L21/02318 , H01L21/76232 , H01L23/291 , H01L23/3178 , H01L23/564 , H01L29/0661 , H01L29/8611 , H01L29/8613 , H01L2924/0002 , H01L2924/00
摘要： Provided is a glass composition for protecting a semiconductor junction which contains at least SiO2, Al2O3, ZnO, CaO and 3 mol % to 10 mol % of B2O3, and substantially contains none of Pb, P, As, Sb, Li, Na and K. It is preferable that a content of SiO2 falls within a range of 32 mol % to 48 mol %, a content of Al2O3 falls within a range of 9 mol % to 13 mol %, a content of ZnO falls within a range of 18 mol % to 28 mol %, a content of CaO falls within a range of 15 mol % to 23 mol %, and a content of B2O3 falls within a range of 3 mol % to 10 mol %.
摘要翻译：本发明提供一种用于保护半导体结的玻璃组合物，其至少包含SiO 2，Al 2 O 3，ZnO，CaO和3mol％至10mol％的B 2 O 3，并且基本上不含Pb，P，As，Sb，Li，Na和K 优选SiO 2的含量在32摩尔％〜48摩尔％的范围内，Al 2 O 3的含量在9摩尔％〜13摩尔％的范围内，ZnO的含量在18摩尔的范围内〜28摩尔％，CaO的含量在15摩尔％〜23摩尔％的范围内，B 2 O 3的含量在3摩尔％〜10摩尔％的范围内。

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