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    • 51. 发明申请
    • Hockey stick rack
    • 曲棍球架
    • US20070163975A1
    • 2007-07-19
    • US11334298
    • 2006-01-19
    • John Holland
    • John Holland
    • A47F7/00
    • A63B71/0036A63B71/0045A63B2102/22A63B2102/24
    • The invention is a rack holding hockey sticks and other sporting equipment. The base is comprised of a member to which is attached at right angles another two members on opposite sides and a post rising vertically from the point of attachment. A second vertical member slides over the first vertical member. Near the top of the second vertical member are attached two members. Attached to these two members are two additional members at right angles. To each of those members are attached a plurality of other members at right angles projecting outwards. There are two additional members attached lower on the second vertical member. Each of these members have an additional member attached at right angles and a plurality of members attached to such member at right angles, which members extend inwards towards the vertical member.
    • 本发明是一种搁置曲棍球棒和其他运动器材的机架。 底座由一个构件组成,在该构件上以直角连接两个相对侧的两个构件,以及从安装点垂直上升的柱。 第二垂直构件在第一垂直构件上滑动。 靠近第二垂直构件的顶部附有两个构件。 这两名成员的附属成员是两个成员。 对于这些构件中的每一个,以向外突出的直角附接多个其它构件。 在第二垂直构件上附加有两个附加构件。 这些构件中的每一个具有直角连接的附加构件,并且多个构件以直角附接到该构件,该构件向着垂直构件向内延伸。
    • 60. 发明授权
    • Stable plasma process for etching of films
    • 用于蚀刻膜的稳定等离子体工艺
    • US06399507B1
    • 2002-06-04
    • US09401603
    • 1999-09-22
    • Padmapani NallanJohn HollandValentin TodorovThorsten Lill
    • Padmapani NallanJohn HollandValentin TodorovThorsten Lill
    • H01L21302
    • H01J37/321
    • In accordance with the present invention, process parameters are controlled to provide a stable etch plasma. We have discovered that it is possible to operate a stable plasma with a portion of the power deposited to the plasma being a capacitive contribution and a portion of the power deposited being an inductive contribution. In particular, a stable plasma may be obtained within two process regions. In the first region, the gradient of the capacitive power to the power applied to the inductively coupled source for plasma generation [∂Pcap/∂PRF] is greater than 0. In the second region, plasma stability is controlled so that [∂Pcap/∂PRF] is less than 0 and so that Pcap
    • 根据本发明,控制工艺参数以提供稳定的蚀刻等离子体。 我们已经发现,可以操作稳定的等离子体,其中一部分功率沉积到等离子体是电容性的,并且所沉积的功率的一部分是感应贡献。 特别地,可以在两个工艺区域内获得稳定的等离子体。 在第一区域中,电容性功率对施加到用于等离子体产生的电感耦合源的功率的梯度大于0.在第二区域中,等离子体稳定性受到控制,使得[∂Pcap/ ∠PRF]小于0,因此Pcap << PRF。 通常,Pcap的幅度小于PRF大小的10%。 此外,在具有双功率控制的等离子体处理装置中,在给予对等离子体发生源的功率施加时,通过增加蚀刻处理室中的压力来延长等离子体的稳定性。 这使得能够使用较低功率应用进行等离子体生成的蚀刻工艺。 将稳定的等离子体操作状态覆盖在其它工艺参数上以获得所需的蚀刻结果,以提供可靠的制造工艺。 在稳定等离子体区域中的蚀刻工艺的操作使得能够使用定时蚀刻终点。 例如,在蚀刻含硅层期间,可以使用蚀刻剂等离子体,其在蚀刻工艺的第一定时蚀刻部分期间相对于相邻层提供快速蚀刻和蚀刻选择性,以及在蚀刻过程中的不同蚀刻剂等离子体 最终排放物监测到底层基板界面的蚀刻。 此外,稳定的等离子体以基本上相同的速率帮助蚀刻掺杂和未掺杂的硅和多晶硅衬底,同时提供干净的蚀刻工艺。