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    • 52. 发明授权
    • Laminated film for head applications
    • 用于头部应用的层压膜
    • US07773341B2
    • 2010-08-10
    • US11825034
    • 2007-07-03
    • Kunliang ZhangMin ZhengMin LiChen-Jung ChienCherng-Chyi Han
    • Kunliang ZhangMin ZhengMin LiChen-Jung ChienCherng-Chyi Han
    • G11B5/33
    • G11B5/3116G11B5/1278
    • A laminated main pole layer is disclosed in which a non-AFC scheme is used to break the magnetic coupling between adjacent high moment layers and reduce remanence in a hard axis direction while maintaining a high magnetic moment and achieving low values for Hch, Hce, and Hk. An amorphous material layer with a thickness of 3 to 20 Angstroms and made of an oxide, nitride, or oxynitride of one or more of Hf, Zr, Ta, Al, Mg, Zn, or Si is inserted between adjacent high moment stacks. The laminated structure also includes an alignment layer below each high moment layer within each stack. In one embodiment, a Ru coupling layer is inserted between two high moment layers in each stack to introduce an AFC scheme. An uppermost Ru layer is used as a CMP stop layer. A post annealing process may be employed to further reduce the anisotropy field (Hk).
    • 公开了一种层叠主极层,其中使用非AFC方案来破坏相邻的高力矩层之间的磁耦合,并且在保持高磁矩的同时降低硬轴方向的剩磁,并实现Hch,Hce和 Hk。 由Hf,Zr,Ta,Al,Mg,Zn或Si中的一种或多种的氧化物,氮化物或氧氮化物形成的厚度为3〜20埃的无定形材料层插入相邻的高强度叠层之间。 层叠结构还包括在每个堆叠内的每个高力矩层下面的对准层。 在一个实施例中,Ru耦合层插入每个堆叠中的两个高矩层之间以引入AFC方案。 使用最上层的Ru层作为CMP停止层。 可以采用后退火工艺来进一步降低各向异性场(Hk)。
    • 54. 发明授权
    • Heat dissipation device having a clip assembly
    • 具有夹子组件的散热装置
    • US07697297B2
    • 2010-04-13
    • US11947091
    • 2007-11-29
    • Chun-Chi ChenMin LiHong-Cheng Yang
    • Chun-Chi ChenMin LiHong-Cheng Yang
    • H05K7/20
    • H01L23/4093H01L2924/0002H01L2924/00
    • A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, includes a heat sink and a clip attaching the heat sink onto the printed circuit board. The heat sink has a rectangular base and a plurality of fins extending upwardly from the base. The fins define a receiving channel therein, which is slantwise to two opposite sides of the heat sink. The clip includes a main body placed in the receiving channel and two latching legs extending obliquely and oppositely from two opposite ends of the main body. The two latching legs are located in front of and in rear of the two opposite sides of the heat sink, respectively, and are parallel thereto.
    • 一种用于从安装在印刷电路板上的电子部件移除热量的散热装置,包括将散热器和将散热器安装到印刷电路板上的夹子。 散热器具有矩形基部和从基部向上延伸的多个翅片。 散热片限定了其中的接收通道,其倾斜于散热器的两个相对侧。 夹子包括放置在接收通道中的主体和从主体的两个相对端倾斜地相对延伸的两个闩锁腿。 两个锁定腿分别位于散热器的两个相对侧的前面和后面,并且与其平行。
    • 56. 发明授权
    • Heat sink assembly for multiple electronic components
    • 用于多个电子元件的散热器组件
    • US07667970B2
    • 2010-02-23
    • US11964888
    • 2007-12-27
    • Wu-Jiang MaMin Li
    • Wu-Jiang MaMin Li
    • H05K7/20
    • H01L23/467H01L23/3672H01L23/4006H01L2924/0002H01L2924/00
    • A heat sink assembly for removing heat from two heat generating-components mounted on a printed circuit board, includes a first heat sink, a second heat sink, a plurality of poles each having a head at a top end and a double-layer spring. The first heat sink includes a base and a plurality of fins arranged on the base. The second heat sink has a first shoulder extending from a lateral side thereof. The first shoulder is disposed on the base. The double-layer spring includes an outer spring and an inner spring having a top end connected to a top end of the outer spring. One of the poles wearing the double-layer spring extends through the first shoulder and the base. The outer spring is compressed between the head of the pole and the first shoulder. The inner spring is compressed between the head of the pole and the base.
    • 一种用于从安装在印刷电路板上的两个发热元件去除热量的散热器组件,包括第一散热器,第二散热器,多个磁极,每个磁极各自具有位于顶端的磁头和双层弹簧。 第一散热器包括基部和布置在基部上的多个翅片。 第二散热器具有从其侧面延伸的第一肩部。 第一个肩膀放在基座上。 双层弹簧包括外弹簧和内弹簧,其具有连接到外弹簧顶端的顶端。 穿着双层弹簧的一个极板延伸穿过第一个肩部和底部。 外部弹簧在杆的头部和第一肩部之间被压缩。 内部弹簧在杆的头部和底座之间被压缩。
    • 57. 发明申请
    • Ta/W film as heating device for dynamic fly height adjustment
    • Ta / W薄膜作为动态飞行高度调节的加热装置
    • US20090323227A1
    • 2009-12-31
    • US12215825
    • 2008-06-30
    • Min ZhengMin LiChen-Jung ChienKowang LiuSung Chung
    • Min ZhengMin LiChen-Jung ChienKowang LiuSung Chung
    • G11B5/33
    • G11B5/314G11B5/6064
    • A dynamic fly heater (DFH) for improved lifetime and better film uniformity is disclosed for a magnetic head. The heater has a lower amorphous Ta layer and an upper W layer to promote small grain size and reduced electro-migration. The composite film is especially advantageous for heaters greater than 1000 Angstroms thick where dR/R is difficult to control in the prior art. The DFH may be a (Ta/W)n laminate in which the Ta layers are about 30 Angstroms thick and the combined thickness of the W layers is from 400 to 1200 Angstroms. A Ta film is preferably sputter deposited with an Ar pressure of 3 to 5 mTorr and the W film is sputter deposited in the same chamber with a 3 to 20 mTorr Ar pressure. In one embodiment, a merged read/write head has one DFH in the read head and a second DFH in the write head.
    • 公开了一种用于改善寿命和更好的膜均匀性的动态飞行加热器(DFH)。 加热器具有较低的非晶Ta层和上W层,以促进小晶粒尺寸和减少的电迁移。 复合膜对于现有技术中dR / R难以控制的大于1000埃的加热器是特别有利的。 DFH可以是(Ta / W)n层叠体,其中Ta层的厚度约为30埃,W层的组合厚度为400至1200埃。 优选以3至5mTorr的Ar压力溅射沉积Ta膜,并将W膜以3至20mTorr Ar压力溅射沉积在相同的室中。 在一个实施例中,合并的读/写头在读头中具有一个DFH,在写头中具有第二DFH。
    • 60. 发明授权
    • CoFe insertion for exchange bias and sensor improvement
    • CoFe插入用于交换偏置和传感器改进
    • US07564658B2
    • 2009-07-21
    • US10948021
    • 2004-09-23
    • Kunliang ZhangHui-Chuan WangTong ZhaoMin LiChyu-Jiuh Torng
    • Kunliang ZhangHui-Chuan WangTong ZhaoMin LiChyu-Jiuh Torng
    • G11B5/33
    • B82Y25/00B82Y10/00G01R33/093G11B5/3929G11B2005/3996
    • A GMR spin value structure with improved performance and a method for making the same is disclosed. A key feature is the incorporation of a thin ferromagnetic insertion layer such as a 5 Angstrom thick CoFe layer between a NiCr seed layer and an IrMn AFM layer. Lowering the Ar flow rate to 10 sccm for the NiCr sputter deposition and raising the Ar flow rate to 100 sccm for the IrMn deposition enables the seed layer to be thinned to 25 Angstroms and the AFM layer to about 40 Angstroms. As a result, HEX between the AFM and pinned layers increases by up to 200 Oe while the Tb is maintained at or above 250° C. When the seed/CoFe/AFM configuration is used in a read head sensor, a higher GMR ratio is observed in addition to smaller free layer coercivity (HCF), interlayer coupling (HE), and HK values.
    • 公开了具有改进性能的GMR自旋值结构及其制造方法。 一个关键特征是在NiCr种子层和IrMn AFM层之间引入薄铁磁插入层,例如5埃厚的CoFe层。 将Ni流速降低到10sccm,对于IrMn沉积,Ar流速提高到100sccm,使得种子层可以变薄到25埃,AFM层变成约40埃。 结果,AFM和被钉扎层之间的HEX增加高达200Oe,而Tb保持在或超过250℃。当在读头传感器中使用种子/ CoFe / AFM配置时,较高的GMR比率 除了较小的自由层矫顽力(HCF),层间耦合(HE)和HK值之外还观察到。