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51. 发明申请

US20070251832A1 Method and apparatus for electrochemical mechanical polishing of cu with higher liner velocity for better surface finish and higher removal rate during clearance 审中-公开
标题翻译：用于电化学机械抛光的方法和装置，具有更高的衬垫速度以更好的表面光洁度和更高的清除率
公开(公告)号：US20070251832A1
公开(公告)日：2007-11-01
申请号：US11413493
申请日：2006-04-27
申请人： Tianbao Du , Feng Liu , You Wang , Alain Duboust , Wei-Yung Hsu
发明人： Tianbao Du , Feng Liu , You Wang , Alain Duboust , Wei-Yung Hsu
IPC分类号： B23H9/00
CPC分类号： B23H5/08 , B24B21/04 , B24B37/04 , B24B57/02
摘要： The present invention relates to an apparatus and a method for polishing a semiconductor substrate with high throughput. One embodiment of the present invention provides an apparatus for electro-chemical mechanical polishing a conductive surface on a substrate. The apparatus comprises a fluid basin having a fluid volume for retaining a polishing solution, a linear polishing station disposed in the fluid basin, wherein the linear polishing station having at least one electrode and a conductive top surface with a linear movement, the conductive top surface is configured to provide an electrical bias to the conductive surface on the substrate, and a carrier head configured to retain the substrate and position the conductive surface of the substrate to be in contact with the conductive top surface of the linear polishing station.
摘要翻译：本发明涉及一种以高产量抛光半导体衬底的装置和方法。本发明的一个实施例提供了一种用于对基底上的导电表面进行电化学机械抛光的装置。该装置包括具有用于保持抛光溶液的流体体积的流体池，设置在流体池中的线性抛光站，其中线性抛光站具有至少一个电极和具有线性运动的导电顶表面，导电顶表面被配置为向衬底上的导电表面提供电偏压，以及被配置为保持衬底并且将衬底的导电表面定位成与线性抛光站的导电顶表面接触的载体头。

52. 发明授权

US07214297B2 Substrate support element for an electrochemical plating cell 失效
标题翻译：用于电化学电镀单元的基板支撑元件
公开(公告)号：US07214297B2
公开(公告)日：2007-05-08
申请号：US10879668
申请日：2004-06-28
申请人： You Wang , Anzhong Chang , John O. Dukovic
发明人： You Wang , Anzhong Chang , John O. Dukovic
IPC分类号： C25B9/02
CPC分类号： H01L21/6723 , C25D17/001 , C25D17/06
摘要： A contact ring for an electrochemical plating system is provided. The contact ring includes an annular substrate supporting member, a plurality of radially positioned conductive substrate contact pins extending from the substrate supporting member, an annular conductive thief element attached to the substrate supporting member, and at least one source of electrical power in electrical communication with the contact pins and the conductive thief element.
摘要翻译：提供了用于电化学电镀系统的接触环。所述接触环包括环形基板支撑构件，从所述基板支撑构件延伸的多个径向定位的导电基板接触销，附接到所述基板支撑构件的环形导电小窃贼元件，以及至少一个与所述基板支撑构件电连通的电力源触针和导电小窃贼元件。

53. 发明申请

US20070079086A1 System for archival storage of data 审中-公开
标题翻译：数据存档系统
公开(公告)号：US20070079086A1
公开(公告)日：2007-04-05
申请号：US11540494
申请日：2006-09-28
申请人： You Wang , Steven Hartung , Kenneth Merry , Thomas Gabrysch
发明人： You Wang , Steven Hartung , Kenneth Merry , Thomas Gabrysch
IPC分类号： G06F12/16
CPC分类号： G06F3/0634 , G06F3/0625 , G06F3/0689 , G06F11/1448 , G06F11/2089 , G06F11/2094 , G06F11/2097 , G06F16/113 , Y02D10/154
摘要： A secondary storage system for maintaining data units transferred from a primary storage system is provided. The secondary storage system includes secondary storage media. Not all of the secondary storage media are powered on at the same time. The secondary storage media includes at least one storage medium that is always in the powered-on mode. Metadata is stored in one or more of at least the one storage medium in the powered-on mode. The metadata includes at least one attribute of a data unit stored in a secondary storage medium that is in the lower power mode of operation than at least the one storage medium that is always in the powered-on mode.
摘要翻译：提供了用于维护从主存储系统传送的数据单元的辅助存储系统。辅助存储系统包括辅助存储介质。并非所有辅助存储介质都同时打开。辅助存储介质包括总是处于通电模式的至少一个存储介质。在加电模式下，元数据被存储在至少一个存储介质中的一个或多个中。元数据包括存储在次要存储介质中的数据单元的至少一个属性，该属性处于处于较低功率操作模式的数据单元，而不是至少一个始终处于通电模式的存储介质。

54. 发明申请

US20060175298A1 Method and composition for polishing a substrate 审中-公开
标题翻译：抛光基材的方法和组合物
公开(公告)号：US20060175298A1
公开(公告)日：2006-08-10
申请号：US11350051
申请日：2006-02-07
申请人： Junzi Zhao , You Wang , Feng Liu , Stan Tsai
发明人： Junzi Zhao , You Wang , Feng Liu , Stan Tsai
IPC分类号： C09K13/00 , C09K13/06 , H01L21/461 , B44C1/22 , C03C25/68
CPC分类号： H01L21/7684 , B24B37/044 , C09G1/02 , C09G1/04 , C25F3/02 , H01L21/32125
摘要： Polishing compositions and methods for removing barrier materials from a substrate surface are provided. In one aspect, a composition is provided for removing at least a barrier material from a substrate surface including an acid based electrolyte system, one or more chelating agents, one or more pH adjusting agents to provide a pH between about 3 and about 11, and a solvent. The composition may be used in an electrochemical mechanical planarization process. The polishing compositions and methods described herein improve the effective removal rate of barrier materials from the substrate surface with a reduction in planarization type defects.
摘要翻译：提供了用于从衬底表面去除阻挡材料的抛光组合物和方法。一方面，提供一种组合物，用于从基材表面至少除去阻挡材料，所述基材表面包括酸性电解质体系，一种或多种螯合剂，一种或多种pH调节剂以提供约3至约11的pH，以及溶剂。该组合物可用于电化学机械平面化工艺中。本文所述的抛光组合物和方法通过减小平坦化型缺陷来提高阻挡材料从衬底表面的有效去除速率。

55. 发明申请

US20050284755A1 Substrate support element for an electrochemical plating cell 失效
标题翻译：用于电化学电镀单元的基板支撑元件
公开(公告)号：US20050284755A1
公开(公告)日：2005-12-29
申请号：US10879668
申请日：2004-06-28
申请人： You Wang , Anzhong Chang , John Dukovic
发明人： You Wang , Anzhong Chang , John Dukovic
IPC分类号： C25D5/00 , C25D7/12 , C25D17/06
CPC分类号： H01L21/6723 , C25D17/001 , C25D17/06
摘要： A contact ring for an electrochemical plating system is provided. The contact ring includes an annular substrate supporting member, a plurality of radially positioned conductive substrate contact pins extending from the substrate supporting member, an annular conductive thief element attached to the substrate supporting member, and at least one source of electrical power in electrical communication with the contact pins and the conductive thief element.
摘要翻译：提供了用于电化学电镀系统的接触环。所述接触环包括环形基板支撑构件，从所述基板支撑构件延伸的多个径向定位的导电基板接触销，附接到所述基板支撑构件的环形导电小窃贼元件以及与所述基板支撑构件电连接的至少一个电力源触针和导电小窃贼元件。

56. 发明申请

US20050145499A1 Plating of a thin metal seed layer 审中-公开
标题翻译：电镀薄金属种子层
公开(公告)号：US20050145499A1
公开(公告)日：2005-07-07
申请号：US11072473
申请日：2005-03-03
申请人： Nicolay Kovarsky , You Wang , John Dukovic , Ivan Rodriguez
发明人： Nicolay Kovarsky , You Wang , John Dukovic , Ivan Rodriguez
IPC分类号： C25D5/18
CPC分类号： C25D17/10 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/007 , H01L21/2885 , H01L21/76843 , H01L21/76873 , H01L21/76877
摘要： A method and apparatus for plating a metal layer onto a substrate is provided. The plating apparatus includes two or more segments of an anode and an auxiliary electrode. The plating method includes a first stage of plating a thin metal seed uniformly in the center of the substrate and near the edges of the substrate before metal gap filling and bulk metal plating are performed. The thin metal seed is plated on the substrate surface by applying a current pulse provided by a first power supply and a second power supply which are in electrical communication in reverse polarity with one segment of the anode and the auxiliary electrode. Thereafter, gap filling of features is performed by applying a second current pulse where current is provided to all segments of the anode.
摘要翻译：提供了一种用于将金属层电镀到基底上的方法和装置。电镀装置包括阳极和辅助电极的两个或更多个区段。电镀方法包括在执行金属间隙填充和块状金属电镀之前，在基板的中心和基板的边缘附近均匀地电镀薄金属种子的第一阶段。通过施加由与阳极和辅助电极的一个部分相反极性电连通的第一电源和第二电源提供的电流脉冲，将薄金属种子电镀在基板表面上。此后，通过施加第二电流脉冲来执行特征的间隙填充，其中电流被提供给阳极的所有段。

57. 发明授权

US06490146B2 Electrostatic chuck bonded to base with a bond layer and method 失效
公开(公告)号：US06490146B2
公开(公告)日：2002-12-03
申请号：US09929806
申请日：2001-08-13
申请人： You Wang , Shamouil Shamouilian , Arnold Kholodenko , Alexander M. Veytser , Surinder S. Bedi , Kadthala R. Narendrnath , Semyon L. Kats , Dennis S. Grimard , Wing L. Cheng , Ananda H. Kumar
发明人： You Wang , Shamouil Shamouilian , Arnold Kholodenko , Alexander M. Veytser , Surinder S. Bedi , Kadthala R. Narendrnath , Semyon L. Kats , Dennis S. Grimard , Wing L. Cheng , Ananda H. Kumar
IPC分类号： H01G2300
CPC分类号： C04B37/026 , C04B37/006 , C04B37/021 , C04B2237/121 , C04B2237/122 , C04B2237/123 , C04B2237/124 , C04B2237/341 , C04B2237/343 , C04B2237/348 , C04B2237/36 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/401 , C04B2237/402 , C04B2237/403 , C04B2237/406 , C04B2237/407 , C04B2237/61 , C04B2237/62 , C04B2237/64 , C04B2237/74 , H01L21/6831 , H01L21/6833
摘要： An electrostatic chuck for holding a substrate has an electrostatic member having a dielectric covering an electrode that is chargeable to electrostatically hold the substrate. The bond layer has a metal layer that is infiltrated or brazed between the electrostatic member and the base. The base may be a composite of a ceramic and metal, the composite having a coefficient of thermal expansion within about ±30% of a coefficient of thermal expansion of the electrostatic member. The base may also have a heater.

58. 发明授权

US5194138A Method for creating a corrosion-resistant aluminum surface 失效
标题翻译：制造耐腐蚀铝表面的方法
公开(公告)号：US5194138A
公开(公告)日：1993-03-16
申请号：US556109
申请日：1990-07-20
申请人： Florian B. Mansfeld , Hong Shih , You Wang
发明人： Florian B. Mansfeld , Hong Shih , You Wang
IPC分类号： C23C22/56
CPC分类号： C23C22/56
摘要： A method for treating the surface of an aluminum-based material so as to make the surface resistant to corrosion includes the steps of contacting the surface with an aqueous cerium non-halide solution and then contacting the surface with an aqueous cerium halide solution. These steps may optionally be followed by a step of positively charging the metal surface while in contact with an aqueous molybdenum solution.
摘要翻译：用于处理铝基材料的表面以使表面耐腐蚀的方法包括使表面与无水卤化铈水溶液接触，然后使表面与卤化铈水溶液接触的步骤。这些步骤可以任选地在与钼水溶液接触的同时对金属表面进行正电充电的步骤。

59. 发明申请

US20140221662A1 INTERMEDIATE COMPOUNDS OF TAMIFLU, METHODS OF PREPARATION AND USES THEREOF 有权
标题翻译： TAMIFLU的中间体化合物，其制备方法及其用途
公开(公告)号：US20140221662A1
公开(公告)日：2014-08-07
申请号：US14123870
申请日：2010-12-17
申请人： Dawei Ma , Shaolin Zhu , Shouyun Yu , You Wang , Qianghui Zhou
发明人： Dawei Ma , Shaolin Zhu , Shouyun Yu , You Wang , Qianghui Zhou
IPC分类号： C07C319/12 , C07D207/14 , C07D213/73 , C07C227/16 , C07C229/66 , C07C227/14
CPC分类号： C07C319/12 , C07B2200/07 , C07C227/14 , C07C227/16 , C07C229/66 , C07C233/31 , C07C271/18 , C07C323/61 , C07C2601/14 , C07C2601/16 , C07D207/14 , C07D209/48 , C07D213/73 , C07D401/04 , C07D403/04
摘要： Chiral amino compounds, methods of preparation and uses thereof. Tamiflu can be obtained from the said compounds. Multi-substituted chiral tetrahydropyrrolyl amine which can be used as intermediate compounds of medicament can also be produced by the said compounds.
摘要翻译：手性氨基化合物，其制备方法及其应用。可以从所述化合物获得达菲。可以用作药物的中间体化合物的多取代手性四氢吡咯胺也可以由所述化合物制备。

60. 发明授权

US08403226B2 Chip card holder 失效
标题翻译：芯片卡座
公开(公告)号：US08403226B2
公开(公告)日：2013-03-26
申请号：US12850720
申请日：2010-08-05
申请人： You Wang
发明人： You Wang
IPC分类号： G06K7/00 , G06K7/08 , G06K19/00 , H04M1/00 , H05K1/14
CPC分类号： G06K7/0021
摘要： An exemplary chip card holder for holding a chip card includes a base member, a card receiving frame and a cover. The card receiving frame is mounted on the base member and defines an accommodating space for receiving the chip card therein. The accommodating space has an inserting opening for inserting the chip card into and removing the chip card out from the accommodating space. The cover includes a resisting block protruding therefrom. The cover is detachably latched to the base member in such a way that the resisting block is aligned with the inserting opening and located adjacent to an end of the chip card to hold the chip card within the accommodating space.
摘要翻译：用于保持芯片卡的示例性芯片卡保持器包括基座构件，卡片接收框架和盖子。卡接收框架安装在基座构件上并且限定用于在其中接收芯片卡的容纳空间。容纳空间具有插入开口，用于将芯片卡插入存放空间中并将其从芯片卡中取出。盖子包括从其突出的抵抗块。盖子可拆卸地锁定到基座构件上，使得抵抗块与插入口对准并且位于与芯片卡的一端相邻并且将芯片卡保持在容纳空间内。

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