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51. 发明申请

US20070138635A1 Semiconductor device and manufacturing method of the same 有权
标题翻译：半导体器件及其制造方法相同
公开(公告)号：US20070138635A1
公开(公告)日：2007-06-21
申请号：US11374134
申请日：2006-03-14
申请人： Masamitsu Ikumo , Hiroyuki Yoda , Eiji Watanabe
发明人： Masamitsu Ikumo , Hiroyuki Yoda , Eiji Watanabe
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L24/12 , H01L23/3171 , H01L24/11 , H01L24/16 , H01L2224/0381 , H01L2224/03912 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/1132 , H01L2224/114 , H01L2224/1147 , H01L2224/116 , H01L2224/131 , H01L2224/73253 , H01L2224/83102 , H01L2224/92125 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2224/13099 , H01L2924/00014
摘要： A semiconductor device includes a plurality of electrode layers provided at designated positions of a semiconductor substrate, an organic insulation film formed on the semiconductor substrate by selectively exposing designated areas of the electrode layers, and projection electrodes for outside connection, the projection electrodes being formed on the designated areas of the electrode layers. Thickness of the organic insulation film situated in the vicinity of the periphery of the projection electrodes is greater than thickness of the organic insulation film situated between the projection electrodes.
摘要翻译：半导体器件包括设置在半导体衬底的指定位置处的多个电极层，通过选择性地暴露电极层的指定区域和用于外部连接的突出电极而形成在半导体衬底上的有机绝缘膜，所述突起电极形成在电极层的指定区域。位于突出电极周围附近的有机绝缘膜的厚度大于位于突出电极之间的有机绝缘膜的厚度。

52. 发明申请

US20060210431A1 Micro plate treating device and micro plate carrying method 失效
标题翻译：微板处理装置和微板承载方法
公开(公告)号：US20060210431A1
公开(公告)日：2006-09-21
申请号：US10554924
申请日：2005-04-05
申请人： Akira Higuchi , Eiji Watanabe
发明人： Akira Higuchi , Eiji Watanabe
IPC分类号： G01N35/00
CPC分类号： G01N35/028 , G01N2035/0405 , Y10T436/11 , Y10T436/113332 , Y10T436/114165 , Y10T436/114998
摘要： In a microplate processing apparatus that removes lid (11) of microplate (10) conveyed by microplate conveying mechanism (3), performs a dispensing process by dispensing head (8), and attaches lid (11) after the dispensing process is completed, lid (11) removed by lid removing mechanism (6) at second position (P2), is conveyed to fourth position (P4) located downstream, in advance of microplate (10) with this lid (11) having been attached, by microplate conveying mechanism (3), to be retained by lid attaching mechanism (9), and then is attached to microplate (10) having been conveyed to fourth position (P4), after the dispensing process is completed.
摘要翻译：在移除由微板输送机构（3）输送的微板（10）的盖（11）的微板处理装置中，通过分配头（8）进行分配处理，并且在分配处理结束后附加盖（11）在第二位置（P 2）处通过盖移除机构（6）移除的第二位置（11）被移动到位于下游的第四位置（P 4），在微板（10）之前，通过微孔板输送机构（3），由盖安装机构（9）保持，然后在分配处理完成之后附接到已经输送到第四位置（P 4）的微孔板（10）。

53. 发明申请

US20060169253A1 Common rail for diesel engine 失效
标题翻译：柴油机共轨
公开(公告)号：US20060169253A1
公开(公告)日：2006-08-03
申请号：US11342031
申请日：2006-01-27
申请人： Shoichiro Usui , Masayoshi Usui , Yasuji Sakamoto , Eiji Watanabe , Yasuaki Hashimoto
发明人： Shoichiro Usui , Masayoshi Usui , Yasuji Sakamoto , Eiji Watanabe , Yasuaki Hashimoto
IPC分类号： F02M69/46
CPC分类号： F02M55/025 , F02M55/005 , F02M2200/8084
摘要： A common rail a diesel engine includes a branching connection body firmly fixed on common rail body by friction welding. A fronting face of the branching connection body to be fixed on the common rail body by friction welding is in the shape of a cone whose center part is slightly projected and whose peripheral part is a gentle cone face.
摘要翻译：共轨柴油发动机包括通过摩擦焊接牢固地固定在共轨主体上的分支连接体。通过摩擦焊接固定在共轨主体上的分支连接体的前面呈圆锥形，其中心部分略微突出，其周边部分是平缓的锥面。

54. 发明申请

US20060056211A1 PWM INVERTER CONTROL APPARATUS AND CONTROL METHOD 有权
标题翻译： PWM逆变器控制装置和控制方法
公开(公告)号：US20060056211A1
公开(公告)日：2006-03-16
申请号：US10517534
申请日：2003-06-04
申请人： Yoshiyuki Tanaka , Katsutoshi Yamanaka , Eiji Watanabe
发明人： Yoshiyuki Tanaka , Katsutoshi Yamanaka , Eiji Watanabe
IPC分类号： H02M7/5387
CPC分类号： H02M7/483 , H02M1/32 , H02M1/36 , H02M7/487
摘要： It is an object of the invention to provide a multilevel PWM inverter control apparatus capable of safely carrying out switching from a normal operation to a protecting operation and performing a reset from the protecting operation to the normal run safely and smoothly without requiring a complicated control algorithm. In the invention, if a current value I which is measured is set to have a level which is equal to or higher than the level of a first reference value I1 and is lower than the level of a second reference value I2, a zero vector to be started from an OOO state in which an intermediate potential is output for all of phases is output (Step 22). If the current value I is set to have a level which is equal to or higher than the level of the second reference value I2 and is lower than the level of a third reference value I3, a base block operation for bringing all of switching units into an OFF state is carried out after outputting the zero vector (Step 28). If the current value I is equal to or greater than the third reference value I3, an emergency stop is carried out (Step 29). When a reset to a normal operation is carried out after the execution of the base block operation, the reset to the normal operation is performed after the execution of the operation for outputting the zero vector.
摘要翻译：本发明的目的是提供一种能够安全地执行从正常操作到保护操作的切换的多电平PWM逆变器控制装置，并且安全平稳地执行从保护操作到正常运行的复位，而不需要复杂的控制算法。

55. 发明授权

US06933422B2 Nav2 channel gene-deficient mice 失效
标题翻译： Nav2通道基因缺陷小鼠
公开(公告)号：US06933422B2
公开(公告)日：2005-08-23
申请号：US09920653
申请日：2001-08-03
申请人： Masaharu Noda , Eiji Watanabe
发明人： Masaharu Noda , Eiji Watanabe
IPC分类号： A01K67/027 , A61K38/00 , A61K45/00 , A61P3/12 , A61P25/00 , C07K14/47 , C07K14/705 , C07K16/18 , C07K19/00 , C12N1/15 , C12N1/19 , C12N1/21 , C12N5/10 , C12N15/09 , C12N15/12 , C12N15/85 , C12P21/08 , G01N33/15 , G01N33/50 , G01N33/53 , G01N33/566 , A01K67/00 , A01K67/033 , C12N15/00 , C12N15/02 , C12N15/63 , C12N15/70 , C12N15/74 , C12N15/87 , G01N33/00
CPC分类号： C12N15/8509 , A01K67/0276 , A01K2207/15 , A01K2217/00 , A01K2217/05 , A01K2217/072 , A01K2217/075 , A01K2227/105 , A01K2267/03 , A61K38/00 , C07K14/705 , C07K2319/00
摘要： An object of the present invention is to provide a null mutant non-human animal showing salt intake behavior similar to that of wild-type animals under water-sufficient conditions and showing much more intakes of hypertonic saline compared with wild-type animals under water- and salt-depleted conditions, for example, an Nav2 gene-deficient non-human animal, which is useful as a model animal of excessive salt intake experiments.The object will be attained by following process: mouse genomic libraries are screened with rat NaG cDNA as a probe, then Nav2 gene of genomic DNA is isolated, and a targeting vector is constructed by inserting marker gene such as neo gene into the exon of Nav2. After thus constructed targeting vector is induced to ES cells, homologously recombined ES cells are selected, then germ line chimeric mice are constructed with this ES cells strain, and they are hybridized with the wild-type mice and heterozygous mutant mice are obtained. By intercrossing of thus obtained heterozygous mutant mice, Nav2 knockout mice are constructed.
摘要翻译：本发明的目的是提供一种无效突变体非人类动物，其在充分水条件下显示类似于野生型动物的盐摄入行为，并且与野生型动物相比，在水 - 和贫盐条件下，例如可以用作过量盐摄入实验的模型动物的Na2V2基因缺陷型非人动物。该目的将通过以下步骤实现：用大鼠NaG cDNA作为探针筛选小鼠基因组文库，然后分离基因组DNA的Na + 2基因，通过插入标记基因构建靶向载体例如neo基因转移到Na 2+的外显子中。将这样构建的靶向载体诱导到ES细胞后，选择同源重组的ES细胞，然后用该ES细胞株构建种系嵌合小鼠，并与野生型小鼠杂交并获得杂合突变体小鼠。通过交叉如此获得的杂合突变小鼠，构建了N 2 O 2敲除小鼠。

56. 发明授权

US06905951B2 Method of forming a device substrate and semiconductor package including a pyramid contact 失效
标题翻译：形成器件衬底和包括金字塔接触的半导体封装的方法
公开(公告)号：US06905951B2
公开(公告)日：2005-06-14
申请号：US10862403
申请日：2004-06-08
申请人： Yoshiyuki Yoneda , Masaharu Minamizawa , Eiji Watanabe , Mitsutaka Sato
发明人： Yoshiyuki Yoneda , Masaharu Minamizawa , Eiji Watanabe , Mitsutaka Sato
IPC分类号： H01L23/12 , H01L21/48 , H01L21/56 , H01L21/68 , H01L23/14 , H01L23/31 , H01L23/32 , H01L23/498 , H01L21/44 , H01L21/302 , H01L21/461
CPC分类号： H01L21/6835 , H01L21/4846 , H01L21/563 , H01L23/147 , H01L23/3121 , H01L23/49822 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2221/68345 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/4809 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device substrate has fine terminals with a small pitch and is able to be easily produced at a low cost without using a special process. A mounting terminal has a pyramidal shape and extending between a front surface and a back surface of a silicon substrate. An end of the mounting terminal protrudes from the back surface of the silicon substrate. A wiring layer is formed on the front surface of the silicon substrate. The wiring layer includes a conductive layer that is electrically connected to the mounting terminal.
摘要翻译：半导体器件基板具有细小的间距的端子，并且能够在不使用特殊工艺的情况下以低成本容易地制造。安装端子具有金字塔形状并且在硅衬底的前表面和后表面之间延伸。安装端子的一端从硅衬底的背面突出。在硅衬底的前表面上形成布线层。布线层包括电连接到安装端子的导电层。

57. 发明授权

US06781224B2 Semiconductor device and package including forming pyramid mount protruding through silicon substrate 有权
标题翻译：包括形成通过硅衬底突出的金字塔安装的半导体器件和封装
公开(公告)号：US06781224B2
公开(公告)日：2004-08-24
申请号：US10262074
申请日：2002-10-02
申请人： Yoshiyuki Yoneda , Masaharu Minamizawa , Eiji Watanabe , Mitsutaka Sato
发明人： Yoshiyuki Yoneda , Masaharu Minamizawa , Eiji Watanabe , Mitsutaka Sato
IPC分类号： H01L2302
CPC分类号： H01L21/6835 , H01L21/4846 , H01L21/563 , H01L23/147 , H01L23/3121 , H01L23/49822 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2221/68345 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/4809 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device substrate has fine terminals with a small pitch and is able to be easily produced at a low cost without using a special process. A mounting terminal has a pyramidal shape and extending between a front surface and a back surface of a silicon substrate. An end of the mounting terminal protrudes from the back surface of the silicon substrate. A wiring layer is formed on the front surface of the silicon substrate. The wiring layer includes a conductive layer that is electrically connected to the mounting terminal.
摘要翻译：半导体器件基板具有细小的间距的端子，并且能够在不使用特殊工艺的情况下以低成本容易地制造。安装端子具有金字塔形状并且在硅衬底的前表面和后表面之间延伸。安装端子的一端从硅衬底的背面突出。在硅衬底的前表面上形成布线层。布线层包括电连接到安装端子的导电层。

58. 发明授权

US06712522B2 Perforated sleeve connector 失效
标题翻译：穿孔套筒连接器
公开(公告)号：US06712522B2
公开(公告)日：2004-03-30
申请号：US10067329
申请日：2002-02-07
申请人： Eiji Watanabe , Kenji Nakamura
发明人： Eiji Watanabe , Kenji Nakamura
IPC分类号： G02B636
CPC分类号： G02B6/3874 , C25D1/02 , G02B6/3877
摘要： A cylindrical sleeve connector for mounting ferrules retaining optical fibers therein is formed with a plurality of perforations arranged in a given pattern so as to be elastically deformable within in a specified elastic region. The sleeve connector is produced, using electroforming process, on a cylindrical electroforming mandrel comprising a conductive rod with external surface texture that is equivalent to required internal surface texture of the sleeve connector and a non-conductive layer formed on the conductive rod so as to provide non-conductive segments identical in configuration with the perforations and arranged in conformity with the given pattern of perforations of the cylindrical sleeve connector.
摘要翻译：用于将保持光纤的套圈安装在其中的圆柱形套筒连接器形成有以给定图案布置的多个穿孔，以便在特定的弹性区域内可弹性变形。套筒连接器使用电铸工艺制造在圆柱形电铸心轴上，该圆柱形电铸心轴包括具有等同于套筒连接器的所需内表面纹理的外部表面纹理的导电杆和形成在导电杆上的非导电层，以便提供非导电部件的结构与穿孔相同，并且与圆柱形套筒连接器的给定型式的穿孔一致。

59. 发明授权

US06344407B1 Method of manufacturing solder bumps and solder joints using formic acid 有权
标题翻译：使用甲酸制造焊锡凸块和焊点的方法
公开(公告)号：US06344407B1
公开(公告)日：2002-02-05
申请号：US09691075
申请日：2000-10-19
申请人： Hirohisa Matsuki , Fumihiko Taniguchi , Kunio Kodama , Eiji Watanabe , Masataka Mizukoshi , Hiroyuki Matsui
发明人： Hirohisa Matsuki , Fumihiko Taniguchi , Kunio Kodama , Eiji Watanabe , Masataka Mizukoshi , Hiroyuki Matsui
IPC分类号： B23K3522
CPC分类号： B23K35/38 , B23K35/262 , B23K35/268 , B23K35/3618 , B23K2101/40 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05548 , H01L2224/05572 , H01L2224/11 , H01L2224/11334 , H01L2224/13 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01054 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15787 , H05K3/3489 , H01L2924/00 , H01L2224/05655 , H01L2924/00014 , H01L2224/05166
摘要： A semiconductor device manufacturing method comprises the steps of forming solder bumps on an underlying metal film of a semiconductor device, and placing the semiconductor device and the solder layer in a reduced pressure atmosphere containing formic acid to form the solder bumps. Accordingly, the solder bumps can be formed without flux generating voids in the solder layer. Furthermore, the cleaning required after the solder bumps are formed can be omitted.
摘要翻译：半导体器件制造方法包括以下步骤：在半导体器件的下面的金属膜上形成焊料凸块，并将半导体器件和焊料层放置在含有甲酸的减压气氛中以形成焊料凸块。因此，可以在焊料层中形成焊剂凸块而没有焊剂产生空隙。此外，可以省略在形成焊料凸块之后所需的清洁。

60. 发明授权

US06232147B1 Method for manufacturing semiconductor device with pad structure 有权
标题翻译：具有衬垫结构的半导体器件的制造方法
公开(公告)号：US06232147B1
公开(公告)日：2001-05-15
申请号：US09365413
申请日：1999-08-02
申请人： Hirohisa Matsuki , Kenichi Kado , Eiji Watanabe , Kazuyuki Imamura , Takahiro Yurino
发明人： Hirohisa Matsuki , Kenichi Kado , Eiji Watanabe , Kazuyuki Imamura , Takahiro Yurino
IPC分类号： H01L2144
CPC分类号： H01L24/10 , H01L23/49816 , H01L24/13 , H01L24/48 , H01L2224/05124 , H01L2224/05139 , H01L2224/05147 , H01L2224/05155 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05657 , H01L2224/05664 , H01L2224/05669 , H01L2224/13 , H01L2224/13099 , H01L2224/16237 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399 , H01L2924/013
摘要： A semiconductor device equipped with secondary pads having adequate arrangement for an arbitrary packaging process. The secondary pads are connected with the primary pads of the semiconductor device with a novel lead wire structure, which is characterized by its low electric resistance, good mechanical strength to protect active components of the device, good adhesion to bumps, and anti-electromigration property. The semiconductor device has: semiconductor circuit elements 2 embedded in a semiconductor substrate 1; a plurality of conductive primary pads 4 each formed in a region above, and surrounding, the circuit element 2; a first protective insulation substrate 5 covering the substrate and having first openings 6 for the primary pads 4; lead wires 7 each consisting of a conductive bulk layer 15 made of copper and a metallic top layer 16, the bulk layer formed on the first protective insulation substrate 5 and having one end connected with a corresponding one of the primary pads 4 through an associated opening 6 and the other end located in a region surrounding the opening 6, while the top layer made of a metal having Vickers hardness of more than 100; and a second protective insulation substrate 8 having second openings 9 for exposing the top surfaces of the other ends of the lead wires 7 serving as the secondary pads 17.
摘要翻译：一种装备有用于任意包装过程的适当布置的辅助垫的半导体器件。辅助焊盘与半导体器件的主焊盘与新颖的引线结构连接，其特征在于其低电阻，良好的机械强度以保护器件的有源部件，对凸块的良好粘附性和抗电迁移性。半导体器件具有：嵌入半导体衬底1中的半导体电路元件2; 多个导电性主焊盘4，各自形成在电路元件2的上方并包围电路元件2的区域中; 覆盖基板并具有用于主焊盘4的第一开口6的第一保护绝缘基板5; 引线7由导电体层15和铜构成，金属顶层16形成在第一保护绝缘基片5上，并且其一端通过相关的开口连接到相应的一个主焊盘4中 6，另一端位于围绕开口6的区域中，而顶层由维氏硬度大于100的金属制成; 以及具有第二开口9的第二保护绝缘基板8，用于暴露作为二次焊盘17的引线7的另一端的顶表面。

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