会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 51. 发明授权
    • Positive resist composition
    • 正抗蚀剂组成
    • US5955240A
    • 1999-09-21
    • US738784
    • 1996-10-29
    • Kazufumi SatoKazuyuki NittaAkiyoshi YamazakiYoshika SakaiToshimasa Nakayama
    • Kazufumi SatoKazuyuki NittaAkiyoshi YamazakiYoshika SakaiToshimasa Nakayama
    • G03F7/004G03F7/039H01L21/027
    • G03F7/0392G03F7/0045Y10S430/106
    • Disclosed is an improved, chemically-amplifying positive resist composition for radiations, especially UV rays, deep-UV rays, excimer laser beams, X-rays, electron beams. The composition comprises (A) a resin component whose solubility in an alkaline aqueous solution is increased by the action of acids, (B) a chemical compound which generates an acid when exposed to radiations, and (C) an organic carboxylic acid compound and (D) an amine, in which said resin component (A) is a mixture comprising (a) a polyhydroxystyrene having a weight-average molecular weight of from 8,000 to 25,000 and a molecular weight distribution (Mw/Mn) of 1.5 or less where from 10 to 60 mol % of the hydroxyl groups have been substituted by residues of a general formula (I): ##STR1## wherein R.sup.1 represents a hydrogen atom or a methyl group, R.sup.2 represents a methyl group or an ethyl group, and R.sup.3 represents a lower alkyl group having 1 to 4 carbon atoms;and (b) a polyhydroxystyrene having a weight-average molecular weight of from 8,000 to 25,000 and a molecular weight distribution (M.sub.w /M.sub.n) of 1.5 or less where from 10 to 60 mol % of the hydroxyl groups have been substituted by tert-butoxycarbonyloxy groups. The composition has a high sensitivity, a high resolution, high heat resistance, good width characteristic in focus depth and good post-exposure storage stability, has good storage stability as a resist solution, and gives resist patterns with good profiles, without depending on the substrate to which it is applied. The composition is useful for forming fine patterns in producing ultra-LSIs.
    • 公开了用于辐射,特别是紫外线,深紫外线,准分子激光束,X射线,电子束的改进的化学增幅正性抗蚀剂组合物。 该组合物包含(A)通过酸的作用在碱性水溶液中的溶解度增加的树脂成分,(B)暴露于辐射时产生酸的化合物,(C)有机羧酸化合物和( D)胺,其中所述树脂组分(A)是包含(a)重均分子量为8,000至25,000的聚羟基苯乙烯和分子量分布(Mw / Mn)为1.5以下的混合物,其中, 10〜60mol%的羟基已被通式(I)的残基取代:其中R1表示氢原子或甲基,R2表示甲基或乙基,R3表示低级烷基 具有1至4个碳原子; 和(b)重均分子量为8,000〜25,000,分子量分布(Mw / Mn)为1.5以下的聚羟基苯乙烯,其中10〜60摩尔%的羟基已被叔丁氧羰基氧基 团体 该组合物具有高灵敏度,高分辨率,高耐热性,聚焦深度的良好宽度特性和良好的曝光后储存稳定性,作为抗蚀剂溶液具有良好的储存稳定性,并且具有良好外形的抗蚀剂图案,而不依赖于 底物。 该组合物可用于在制造超LSI时形成精细图案。
    • 52. 发明授权
    • Chemical-sensitization photoresist composition
    • 化学增感光刻胶组合物
    • US5945517A
    • 1999-08-31
    • US119640
    • 1998-07-21
    • Kazuyuki NittaKazufumi SatoToshiharu ShimamakiKunio HayakawaShin-ya Kuramoto
    • Kazuyuki NittaKazufumi SatoToshiharu ShimamakiKunio HayakawaShin-ya Kuramoto
    • G03F7/004C07D407/02C07C245/14
    • G03F7/0045
    • Proposed is a positive- or negative-working chemical-sensitization photoresist composition having advantages in respect of the contrast and resolution of patterning, photo-sensitivity and cross sectional profile of the patterned resist layer as well as in respect of stability of the latent image formed by pattern-wise exposure to light before post-exposure baking treatment. The composition comprises: (A) 100 parts by weight of a film-forming resinous ingredient which causes a change, i.e. increase or decrease, of solubility in an aqueous alkaline solution by the interaction with an acid; and (B) from 0.5 to 20 parts by weight of a radiation-sensitive acid-generating agent which is a diazomethane compound represented by the general formulaR.sup.1 --SO.sub.2 --C(=N.sub.2)--SO.sub.2 --R.sup.2,in which R.sup.1 and R.sup.2 are each, independently from the other, a monovalent cyclic group substituted on the cyclic nucleus by an acid-dissociable group such as a tert-butoxycarbonyl and acetal groups. Several novel diazomethane compounds are disclosed.
    • 提出了一种正性或负性工作的化学增感光致抗蚀剂组合物,其在图案化抗蚀剂层的图案的对比度和分辨率,光敏感性和横截面轮廓方面以及在形成的潜像的稳定性方面具有优势 在曝光前烘烤处理下通过图案曝光。 该组合物包含:(A)100重量份成膜树脂成分,其通过与酸的相互作用而引起在碱性水溶液中的溶解度的改变,即增加或减少; 和(B)0.5〜20重量份的辐射敏感性产酸剂,其为通式为R 1 -SO 2 -C(= N 2)-SO 2 -R 2表示的重氮甲烷化合物,其中R 1和R 2各自为 独立地是通过酸解离基团如叔丁氧基羰基和缩醛基团在环状核上取代的一价环状基团。 公开了几种新的重氮甲烷化合物。
    • 53. 发明授权
    • Compounds for use in a positive-working resist composition
    • 用于正性抗蚀剂组合物的化合物
    • US5929271A
    • 1999-07-27
    • US912123
    • 1997-08-15
    • Hideo HadaKazufumi SatoHiroshi KomanoToshimasa Nakayama
    • Hideo HadaKazufumi SatoHiroshi KomanoToshimasa Nakayama
    • C07C69/013G03F7/004G03F7/039C07C69/74
    • C07C69/013G03F7/0045G03F7/039Y10S430/115Y10S430/122
    • Proposed is novel compounds for use in a chemical-sensitization positive-working photoresist composition used in the photolithographic patterning process for the manufacture of fine electronic devices, which is capable of giving, with high photosensitivity to ArF excimer laser beams, a patterned resist layer having an excellently orthogonal cross sectional profile and high resistance against dry etching and exhibiting good adhesion to the substrate surface. While the composition comprises (A) a film-forming resinous ingredient which causes an increase of alkali solubility by interacting with an acid and (B) a radiation-sensitive acid-generating agent, the most characteristic feature of the invention consists in the use of a specific acrylic resin as the component (A), which comprises the monomeric units of a (meth)acrylic acid ester of hydroxy bicyclo�3.1.1!heptanone unsubstituted or substituted by an alkyl group such as hydroxypinanone (meth)acrylate, optionally, in combination with the monomeric units derived from (meth)acrylic acid and/or tert-butyl (meth)acrylate in a molar fraction of 3:7 to 7:3.
    • 提出了用于制造精细电子器件的光刻图案化方法中使用的化学增感正性光致抗蚀剂组合物中的新化合物,其能够赋予ArF准分子激光束具有高光敏性的图案化抗蚀剂层,其具有 具有优异的正交横截面轮廓和高耐干腐蚀性,并且对基材表面表现出良好的粘合性。 虽然组合物包含(A)通过与酸相互作用引起碱溶解度增加的成膜树脂成分和(B)辐射敏感的酸产生剂,但是本发明的最特征在于使用 作为组分(A)的特定丙烯酸树脂,其包含未被取代或被烷基如羟基酮(甲基)丙烯酸酯取代的羟基双环[3.1.1]庚酮的(甲基)丙烯酸酯的单体单元, 与来自(甲基)丙烯酸和/或(甲基)丙烯酸叔丁酯的单体单元组合,摩尔分数为3:7至7:3。