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    • 55. 发明申请
    • Capacitor, semiconductor device having the same, and method of manufacturing the semiconductor device
    • 具有相同的电容器,半导体器件以及半导体器件的制造方法
    • US20050087789A1
    • 2005-04-28
    • US10902824
    • 2004-08-02
    • Hion-suck BaikJung-hyun LeeJong-bong ParkYun-chang Park
    • Hion-suck BaikJung-hyun LeeJong-bong ParkYun-chang Park
    • H01L27/108H01L21/02H01L21/285H01L21/8242H01L21/44
    • H01L28/75H01L21/28556H01L27/10852H01L27/10855H01L28/55H01L28/65H01L28/90H01L28/91
    • A semiconductor device with a stack type capacitor having a lower electrode formed of an aluminum-doped metal, and a manufacturing method thereof are provided. The semiconductor device includes: a semiconductor substrate having a gate structure and an active region; an interlayer dielectric film formed on the active region; a lower electrode formed of a metal containing aluminum on the interlayer dielectric film; a dielectric layer formed on the lower electrode; an upper electrode formed on the dielectric layer; and a plug formed in the interlayer dielectric film to electrically connect the active region with the lower electrode. The method includes: forming a gate structure and an active region on a semiconductor substrate; forming an interlayer dielectric film on the resultant semiconductor substrate; forming a plug in the interlayer dielectric film to electrically connect with the active region; forming a mold oxidation layer on the plug and the interlayer dielectric film; patterning the mold oxidation layer with a predetermined pattern and forming a lower electrode of material containing aluminum on the plug; and sequentially forming a dielectric layer and an upper electrode on the lower electrode.
    • 提供具有由铝掺杂金属形成的下电极的堆叠型电容器的半导体器件及其制造方法。 半导体器件包括:具有栅极结构和有源区的半导体衬底; 形成在有源区上的层间绝缘膜; 在层间电介质膜上由含有铝的金属形成的下电极; 形成在下电极上的电介质层; 形成在电介质层上的上电极; 以及形成在所述层间电介质膜中以将所述有源区电连接到所述下电极的插塞。 该方法包括:在半导体衬底上形成栅极结构和有源区; 在所得半导体衬底上形成层间绝缘膜; 在所述层间电介质膜中形成插塞以与所述有源区电连接; 在插塞和层间电介质膜上形成模具氧化层; 以预定图案图案化模具氧化层,并在插头上形成含有铝的材料的下电极; 并且在下电极上依次形成电介质层和上电极。