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51. 发明授权

US08472182B2 Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack 有权
标题翻译：用于促进从液冷电子机架散热的装置和方法
公开(公告)号：US08472182B2
公开(公告)日：2013-06-25
申请号：US12845374
申请日：2010-07-28
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20781
摘要： Apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure associated with the electronic component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop to receive coolant from and supply coolant to the liquid-cooled structure. The heat exchanger is disposed external to the electronics rack within a cool air plenum of the data center containing the rack, and the plenum is coupled to a cool air source providing cooled air to the data center. Cooled air of the cool air plenum passes across the heat exchanger and cools coolant passing through the heat exchanger, which dissipates heat from the coolant passing therethrough to the cool air passing across the heat exchanger to facilitate liquid cooling of the electronic component(s) associated with the liquid-cooled structure.
摘要翻译：提供了用于促进电子机架的一个或多个部件的冷却的装置和方法。该装置包括与要冷却的电子部件相关联的液冷结构，以及液 - 空热交换器，其经由冷却剂回路与液冷结构流体连通地连接以从冷却剂接收冷却剂并供应冷却剂到液冷结构。热交换器设置在包含机架的数据中心的冷空气室内的电子机架的外部，并且气室与冷空气源耦合，从而向数据中心提供冷却的空气。冷空气通风室的冷却空气穿过热交换器并冷却通过热交换器的冷却剂，冷却剂将通过其的冷却剂的热量散发到通过热交换器的冷空气，以促进电子部件相关联的液体冷却具有液冷结构。

52. 发明申请

US20130118712A1 DUAL COIL WITH ADAPTER TO MOVE BETWEEN REDUNDANT AND NON-REDUNDANT HIGH PERFORMANCE HEAT EXCHANGER 有权
标题翻译：具有适应能力的双线圈可以在冗余和非冗余高性能热交换器之间移动
公开(公告)号：US20130118712A1
公开(公告)日：2013-05-16
申请号：US13296207
申请日：2011-11-14
申请人： Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Madhusudan K. Iyengar , Roger R. Schmidt
IPC分类号： F28D15/00 , B23P15/26
CPC分类号： H05K7/20736 , F28D2021/0028 , F28F2210/04 , H05K7/20618 , H05K7/20781 , Y10T29/4935
摘要： An apparatus, rear door heat exchanger, system, and method for controlling the redundancy of a cooling system for a server rack. The system includes a cooling system having at least two liquid cooling circuits. The system also includes a rear door heat exchanger connected to the cooling system. The rear door heat exchanger includes two heat exchange coils. Each heat exchange coil is carried by the server rack and configured to interface with a different liquid cooling circuit. The rear door heat exchanger also includes an adapter configured to couple together the two heat exchange coils into one heat exchange unit. The heat exchange unit is configured to interface with one liquid cooling circuit from the cooling system.
摘要翻译：一种用于控制用于服务器机架的冷却系统的冗余的装置，后门热交换器，系统和方法。该系统包括具有至少两个液体冷却回路的冷却系统。该系统还包括连接到冷却系统的后门热交换器。后门热交换器包括两个热交换线圈。每个热交换线圈由服务器机架承载，并配置成与不同的液体冷却回路接口。后门热交换器还包括配置成将两个热交换盘管连接在一起的一个热交换单元中的适配器。热交换单元配置成与来自冷却系统的一个液体冷却回路相连接。

53. 发明申请

US20120298338A1 DATA CENTER WITH DUAL RADIATOR CABINETS FOR REDUNDANT OPERATION 有权
标题翻译：具有用于冗余操作的双散热器柜的数据中心
公开(公告)号：US20120298338A1
公开(公告)日：2012-11-29
申请号：US13115590
申请日：2011-05-25
申请人： Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Madhusudan K. Iyengar , Roger R. Schmidt
IPC分类号： F28D15/00
CPC分类号： F28F27/00 , F28D1/0475 , F28F1/32 , H05K7/20745 , Y10T29/49826
摘要： Methods of preventing overheating of computer equipment in a cabinet when a supply coolant to a cooler in the cabinet fails. An example embodiment is a data center that includes a plurality of cabinets and at least two main coolant supply lines. The cabinets are configured to house computer equipment and the main coolant supply lines provide coolant to the plurality of cabinets. Moreover, each cabinet includes a cooler and each of these coolers includes at least two radiators which receive coolant from different main coolant supply lines.
摘要翻译：当柜内的冷却器供给冷却液时，防止机柜内计算机设备过热的方法失效。示例性实施例是包括多个机柜和至少两个主冷却剂供应管线的数据中心。机柜被配置为容纳计算机设备，并且主冷却剂供应管线为多个机柜提供冷却剂。此外，每个机柜包括一个冷却器，并且这些冷却器中的每一个包括至少两个从不同主冷却剂供应管路接收冷却剂的散热器。

54. 发明授权

US08248801B2 Thermoelectric-enhanced, liquid-cooling apparatus and method for facilitating dissipation of heat 有权
标题翻译：热电增强型液体冷却装置和方便散热的方法
公开(公告)号：US08248801B2
公开(公告)日：2012-08-21
申请号：US12845355
申请日：2010-07-28
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20 , H05K5/00 , H05K7/00 , F28F7/00 , F28D15/00 , F25D23/12
CPC分类号： H05K7/2079 , H05K7/20836
摘要： Thermoelectric-enhanced, liquid-cooling apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure in thermal communication with the component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop for receiving coolant from and supply coolant to the liquid-cooled structure. A thermoelectric array is disposed with first and second coolant loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the liquid-to-air heat exchanger for cooling thereof.
摘要翻译：提供了热电增强型液体冷却装置和方法，以便于电子机架的一个或多个部件的冷却。该装置包括与要冷却的部件热连通的液冷结构，以及液 - 空热交换器，其经由冷却剂回路与液冷结构流体连通，用于接收和供应冷却剂冷却液流向液冷结构。热电阵列设置有与阵列的第一和第二侧热接触的第一和第二冷却剂回路部分。热电阵列用于将热量从穿过第一环路部分的冷却剂传递到穿过第二环路部分的冷却剂，并且在冷却剂通过液冷结构之前冷却通过第一环部分的冷却剂。通过第一和第二环路部分的冷却剂通过液体 - 空气热交换器进行冷却。

55. 发明授权

US08210741B2 Apparatus for thermal characterization under non-uniform heat load 有权
标题翻译：非均匀热负荷下热表征的装置
公开(公告)号：US08210741B2
公开(公告)日：2012-07-03
申请号：US12611519
申请日：2009-11-03
申请人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Roger R. Schmidt
发明人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Roger R. Schmidt
IPC分类号： G01N25/72 , G01K3/00
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： An apparatus determines cooling characteristics of an operational cooling device used for transferring heat from an electronic device. The operational cooling device is thermally coupled to a heat pipe. The heat pipe has an exposed surface for selective application of heat thereon. Heat from a localized heat source is selectively applied to at least one region of the exposed surface. The heat source is preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the heat from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the operational cooling device.
摘要翻译：设备确定用于从电子设备传送热量的操作冷却装置的冷却特性。操作冷却装置热耦合到热管。热管具有用于选择性地在其上施加热量的暴露表面。来自局部热源的热量被选择性地施加到暴露表面的至少一个区域。热源优选能够相对于暴露的表面和热强度在位置上都变化。优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与来自局部热源的热隔离。当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。然后将温度分布用于热操作冷却装置的特征。

56. 发明授权

US08189334B2 Dehumidifying and re-humidifying cooling apparatus and method for an electronics rack 有权
标题翻译：电子机架的除湿和再加湿冷却装置和方法
公开(公告)号：US08189334B2
公开(公告)日：2012-05-29
申请号：US12787790
申请日：2010-05-26
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20 , G06F1/20 , F25D15/00
CPC分类号： H05K7/20736 , F24F3/14 , F24F2013/221 , H05K7/20745
摘要： Dehumidifying and re-humidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet side of the rack, wherein air flows through the rack from the air inlet side to an air outlet side. The heat exchanger, which is positioned for ingressing air to pass thereacross before passing through the electronics rack, is in fluid communication with a coolant loop for passing coolant through the heat exchanger, and the heat exchanger dehumidifies ingressing air to the electronics rack to reduce a dew point of air flowing through the rack. A condensate collector disposed at the air inlet side collects liquid condensate from the heat exchanger's dehumidifying of ingressing air, and an evaporator disposed at the air outlet side humidifies air egressing from the electronics rack employing condensate from the condensate collector.
摘要翻译：为电子机架提供除湿和再加湿冷却装置和方法。该装置包括设置在机架的空气入口侧的空气 - 液体热交换器，其中空气从空气入口侧流过空气出口侧。定位用于在通过电子机架之前使空气通过的热交换器与用于使冷却剂通过热交换器的冷却剂回路流体连通，并且热交换器将进入的空气除湿到电子机架以减少空气流过架子的露点。设置在空气入口侧的冷凝水收集器收集来自热交换器对进入空气的除湿的液体冷凝物，并且设置在空气出口侧的蒸发器使用来自冷凝物收集器的冷凝物从电子机架排出空气。

57. 发明授权

US08179677B2 Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack 有权
标题翻译：用于电子机架的电子子系统的浸入式冷却装置和方法
公开(公告)号：US08179677B2
公开(公告)日：2012-05-15
申请号：US12825756
申请日：2010-06-29
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20809 , F28D15/02
摘要： Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment, with the electronic subsystem being immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment in an upper portion of the compartment. The condenser fins facilitate cooling of dielectric fluid vapor rising to the upper portion of the compartment. A filler material is disposed within the sealed compartment to reduce the amount of dielectric fluid required within the compartment to achieve immersion-cooling of the electronic subsystem, and the filler material includes a shaped surface to direct dielectric fluid vapor within the compartment towards the condenser fins.
摘要翻译：提供冷却装置和方法用于电子机架的电子子系统的浸没冷却。冷却装置包括至少部分围绕电子子系统和形成密封隔室的外壳，以及设置在密封室内的电介质流体，电子子系统浸没在电介质流体内。提供了一种液体冷却的蒸汽冷凝器，其包括在隔室的上部中在密封隔室内延伸的多个导热冷凝器翅片。冷凝器翅片有助于冷却上升到隔室上部的介质流体蒸气。填充材料设置在密封隔室内以减少隔室内所需的介电流体的量以实现电子子系统的浸没冷却，并且填充材料包括成形表面，以将隔室内的介质流体蒸气导向冷凝器翅片。

58. 发明授权

US08077462B2 Stress relieved hose routing to liquid-cooled electronics rack door 失效
标题翻译：减轻软管布置到液冷电子机柜门
公开(公告)号：US08077462B2
公开(公告)日：2011-12-13
申请号：US12552479
申请日：2009-09-02
申请人： Wayne A. Barringer , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , James J. Steffes , Gerard V. Weber, Jr.
发明人： Wayne A. Barringer , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , James J. Steffes , Gerard V. Weber, Jr.
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H05K7/2079 , H05K7/20818 , Y10T29/4935
摘要： A cooling apparatus and method are provided which include an air-to-liquid heat exchanger and system coolant inlet and outlet plenums mounted to an electronics rack door along an edge of the door remote from the edge hingedly mounted to the rack. The plenums are in fluid communication with the heat exchanger and respectively include an inlet and outlet. Coolant supply and return hoses are disposed above the electronics rack and couple the inlet plenum to a coolant supply header and the outlet plenum to a coolant return header. The hoses are sufficiently long and flexible to open or close the door. A stress relief structure is attached to the top of the door and clamps the supply and return hoses in fixed relation to relieve stress on connect couplings at the ends of the hoses to the plenum inlet and outlet during opening or closing of the door.
摘要翻译：提供了一种冷却装置和方法，其包括空气 - 液体热交换器和系统冷却剂入口和出口集气室，其沿着门的边缘安装到电子机架门，远离铰接安装到机架的边缘。增压室与热交换器流体连通，分别包括入口和出口。冷却剂供应和返回软管设置在电子机架上方，并将进气室连接到冷却剂供应集管，并将出口压力室连接到冷却剂返回集管。软管足够长且灵活以打开或关闭门。应力消除结构连接到门的顶部，并且固定地夹紧供应和返回软管，以在门的打开或关闭期间将软管端部处的连接联接器上的压力释放到通风口入口和出口。

59. 发明申请

US20110286175A1 LIQUID COOLANT CONDUIT SECURED IN AN UNUSED SOCKET FOR MEMORY MODULE COOLING 有权
标题翻译：液体冷却液管道用于存储模块冷却的未使用的插座
公开(公告)号：US20110286175A1
公开(公告)日：2011-11-24
申请号：US12785779
申请日：2010-05-24
申请人： Madhusudan K. Iyengar , Vinod Kamath , Howard V. Mahaney, JR. , Mark E. Steinke , Aparna Vallury
发明人： Madhusudan K. Iyengar , Vinod Kamath , Howard V. Mahaney, JR. , Mark E. Steinke , Aparna Vallury
IPC分类号： G06F1/20
CPC分类号： G06F1/20 , G06F2200/201
摘要： An apparatus for cooling a memory module installed in a computer system includes a liquid coolant conduit that is connected to a conduit support structure having a form factor selectively securable within a first preconfigured memory module socket of the computer system in order to position the liquid coolant conduit above the first socket. A heat pipe provides direct thermal contact between the liquid conduit and a heat spreader assembly in direct thermal contact with a face of the memory module. The apparatus may include a second heat pipe and second heat spreader assembly for similarly cooling a second memory module. In alternative configurations, the apparatus may cool memory modules on opposing sides of the conduit or memory modules that are both on the same side of the conduit.
摘要翻译：用于冷却安装在计算机系统中的存储器模块的装置包括液体冷却剂导管，该液体冷却剂导管连接到导管支撑结构，导管支撑结构具有选择性地固定在计算机系统的第一预配置存储器模块插槽内的形状因子，以便定位液体冷却剂导管在第一个插槽之上。热管提供液体导管与散热器组件之间的直接热接触，与存储器模块的表面直接热接触。该装置可以包括用于类似地冷却第二存储器模块的第二热管和第二散热器组件。在替代配置中，设备可以冷却导管的相对侧上的存储器模块或存储器模块，这些存储器模块都在导管的同一侧。

60. 发明授权

US08027162B2 Liquid-cooled electronics apparatus and methods of fabrication 失效
标题翻译：液冷电子设备及制造方法
公开(公告)号：US08027162B2
公开(公告)日：2011-09-27
申请号：US12566081
申请日：2009-09-24
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Michael R. Rizzolo , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Michael R. Rizzolo , Robert E. Simons
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/2079
摘要： Liquid-cooled electronics apparatuses and methods are provided. The cooled electronics apparatuses include a liquid-cooled cold rail and an electronics subassembly. The liquid-cooled cold rail has a thermally conductive structure and a coolant-carrying channel extending within and cooling the thermally conductive structure. The electronics subassembly includes an electronics card(s) and one or more thermal transfer plates. The electronics card(s) includes electronic devices to be cooled, and the one or more thermal transfer plates are each rigidly affixed to one or more electronic devices of the electronics card(s). Each thermal transfer plate is thermally conductive and couples the electronics subassembly to the liquid-cooled cold rail to thermally interface the one or more electronic devices to the liquid-cooled cold rail to facilitate cooling of the electronic devices. In one embodiment, the electronics subassembly includes multiple interleaved electronics cards and thermal transfer plates.
摘要翻译：提供液冷电子设备和方法。冷却的电子设备包括液冷冷轨和电子组件。液冷冷轨具有导热结构和在导热结构内延伸并冷却导热结构的冷却剂承载通道。电子组件包括电子卡和一个或多个热传递板。电子卡片包括要冷却的电子设备，并且一个或多个热转印板每个刚性地固定到电子卡的一个或多个电子设备。每个热传递板是导热的并且将电子组件耦合到液冷冷轨，以将一个或多个电子设备热连接到液冷冷轨，以便电子设备的冷却。在一个实施例中，电子组件包括多个交错电子卡和热转印板。

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