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51. 发明授权

US06467348B1 Microgyroscope with two resonant plates 失效
标题翻译：具有两个谐振板的微镜
公开(公告)号：US06467348B1
公开(公告)日：2002-10-22
申请号：US09702845
申请日：2000-11-01
申请人： Hoon Song , Seog-soon Baek , Hyun-cheol Kim , Byeoung Ju Ha , Yong-soo Oh
发明人： Hoon Song , Seog-soon Baek , Hyun-cheol Kim , Byeoung Ju Ha , Yong-soo Oh
IPC分类号： G01P904
CPC分类号： G01C19/574
摘要： A microgyroscope with two resonant plates is provided. The microgyroscope includes a substrate; first and second frames provided on the substrate to have a predetermined height, the first and second frames facing each other; a plurality of anchors supporting the first and second frames with respect to the substrate; first and second resonant plates provided between the first and second frames to be separated from each other by a predetermined distance; and a matching link unit connected to the first and second resonant plates so that it links the motion of one resonant plate to the motion of the other resonant plate such that the matching link unit is moved by the motion of one resonant plate in a first direction and then moves the other resonant plate in a second direction opposite to the first direction. In the microgyroscope, the difference between the resonance frequencies of the two resonant plates is removed by a self resonant matching structure implemented by the matching link, so that the range of an allowable process error is large, and the microgyroscope can be easily manufactured. Additionally, the reliability and the linearity of a resonance structure are improved. Since the driving beam and the sensing beam are separately designed, mode coupling can be prevented, thereby increasing the sensing sensibility.
摘要翻译：提供具有两个谐振板的微型陀螺仪。微陀螺仪包括基底; 设置在基板上以具有预定高度的第一和第二框架，第一和第二框架彼此面对; 多个锚固件，其相对于所述基板支撑所述第一和第二框架; 设置在第一和第二框架之间的第一和第二谐振板彼此分开预定距离; 以及连接到第一和第二谐振板的匹配连接单元，使得它将一个谐振板的运动连接到另一个谐振板的运动，使得匹配连接单元通过一个谐振板在第一方向上的运动而移动然后沿与第一方向相反的第二方向移动另一个谐振板。在微陀螺仪中，通过由匹配链路实现的自谐振匹配结构去除两个谐振板的谐振频率之间的差异，使得允许的工艺误差的范围大，并且可以容易地制造微型陀螺仪。此外，提高了谐振结构的可靠性和线性度。由于驱动光束和感测光束是分开设计的，因此可以防止模式耦合，从而增加感测灵敏度。

52. 发明申请

US20130100513A1 3-DIMENSIONAL HOLOGRAPHIC IMAGE DISPLAYING APPARATUS 有权
标题翻译：三维全息图像显示装置
公开(公告)号：US20130100513A1
公开(公告)日：2013-04-25
申请号：US13632503
申请日：2012-10-01
申请人： Kyu-hwan Choi , Dong-kyung Nam , Seung-hoon HAN , Jung-mok Bae , Hoon Song
发明人： Kyu-hwan Choi , Dong-kyung Nam , Seung-hoon HAN , Jung-mok Bae , Hoon Song
IPC分类号： G03H1/26
CPC分类号： G03H1/0244 , G02B6/0038 , G03H1/2286 , G03H1/24 , G03H2001/2226 , G03H2001/2263 , G03H2210/30 , G03H2223/16 , G03H2250/42
摘要： A 3-dimensional (3D) holographic image displaying apparatus is provided. The apparatus includes a hologram reproducer configured to generate surface plasmons in response to incident light and reproduce a 3D image by diffracting the generated surface plasmons by a hologram, and a surface light source unit including a light source and a light guide plate, the light guide plate being configured to allow incident light from the light source to enter into the light guide plate, internally reflect the allowed light, and output the internally reflected light through a light-output surface, the surface light source unit being configured to implement colors by adjusting an angle of the light incident to the hologram reproducer so that the outputted light through the light-output surface is incident to the hologram reproducer at a surface plasmon-forming angle for each wavelength to generate the surface plasmons corresponding to a plurality of color beams.
摘要翻译：提供三维（3D）全息图像显示装置。该装置包括：全息图再现器，被配置为响应于入射光产生表面等离子体激元，并通过用全息图衍射生成的表面等离子体激元和包括光源和导光板的表面光源单元来再现3D图像，板被配置为允许来自光源的入射光进入导光板，内部反射允许的光，并且通过光输出表面输出内部反射光，该表面光源单元被配置为通过调节来实现颜色入射到全息图再现器的光的角度，使得通过光输出表面的输出光以各波长以表面等离子体激发角入射到全息图再现器，以产生对应于多个彩色光束的表面等离子体。

53. 发明授权

US07487590B2 Method for manufacturing monolithic ink-jet printhead having heater disposed between dual ink chambers 失效
标题翻译：用于制造单片喷墨打印头的方法，其具有设置在双墨室之间的加热器
公开(公告)号：US07487590B2
公开(公告)日：2009-02-10
申请号：US11362838
申请日：2006-02-28
申请人： Hoon Song , Yong-soo Oh , Jun-hyub Park , Keon Kuk , Chang-seung Lee , Young-jae Kim , Ji-hyuk Lim
发明人： Hoon Song , Yong-soo Oh , Jun-hyub Park , Keon Kuk , Chang-seung Lee , Young-jae Kim , Ji-hyuk Lim
IPC分类号： B21D53/76 , B41J2/05
CPC分类号： B41J2/1404 , B41J2/1412 , B41J2/14129 , B41J2/1603 , B41J2/1625 , B41J2/1628 , B41J2/1631 , B41J2002/1437 , B41J2002/14467 , Y10T29/49083 , Y10T29/49128 , Y10T29/49401
摘要： A monolithic ink-jet printhead includes a substrate having a lower ink chamber formed on an upper surface thereof, a manifold for supplying ink to the lower ink chamber formed on a bottom surface thereof, and an ink channel providing communication therebetween; a nozzle plate having a plurality of passivation layers and a metal layer sequentially stacked on the substrate, the nozzle plate having an upper ink chamber formed therein on a bottom surface of the metal layer, a nozzle in communication with the upper ink chamber formed on an upper surface of the metal layer, and a connection hole providing communication between the upper ink chamber and the lower ink chamber; a heater located between the upper ink chamber and the lower ink chamber for heating ink contained in the lower and upper ink chambers; and a conductor electrically connected to the heater to apply a current to the heater.
摘要翻译：单片式喷墨打印头包括：在其上表面上形成有下墨室的基板，用于向形成在其底表面上的下墨室供墨的歧管和在其间提供连通的墨通道; 喷嘴板，其具有多个钝化层和顺序堆叠在所述基板上的金属层，所述喷嘴板在所述金属层的底面上形成有上部墨水室，与所述上部墨水室形成的喷嘴连通，所述金属层的上表面和连接孔提供所述上墨室和所述下墨室之间的连通; 位于上墨室和下墨室之间的加热器，用于加热容纳在下墨室和上墨室中的墨; 以及电连接到加热器以将电流施加到加热器的导体。

54. 发明申请

US20060290743A1 Method for manufacturing monolithic ink-jet printhead 审中-公开
标题翻译：单片喷墨打印头的制造方法
公开(公告)号：US20060290743A1
公开(公告)日：2006-12-28
申请号：US11512330
申请日：2006-08-30
申请人： Hoon Song , Yong-soo Oh , Jong-woo Shin , Chang-seung Lee , Hyung-taek Lim
发明人： Hoon Song , Yong-soo Oh , Jong-woo Shin , Chang-seung Lee , Hyung-taek Lim
IPC分类号： B41J2/04
CPC分类号： B41J2/1643 , B41J2/14129 , B41J2/14137 , B41J2/1601 , B41J2/1606 , B41J2/1625 , B41J2/1626 , B41J2/1628 , B41J2/1631 , B41J2/1642 , B41J2/1646 , B41J2002/1437
摘要： A monolithic ink-jet printhead includes a substrate which has an ink chamber to be supplied with ink, a manifold for supplying ink to the ink chamber, and an ink channel for providing communication between the ink chamber and the manifold, a nozzle plate including a plurality of passivation layers sequentially stacked on the substrate, a metal layer formed on the passivation layers, and a nozzle, through which ink is ejected from the ink chamber, that penetrates the nozzle plate, a heater provided between adjacent passivation layers, the heater being located above the ink chamber for heating ink within the ink chamber, a conductor provided between adjacent passivation layers, the conductor being electrically connected to the heater for applying a current to the heater, and a hydrophobic coating layer formed exclusively on an outer surface of the metal layer.
摘要翻译：单片式喷墨打印头包括具有要供应墨水的墨室的基板，用于向墨室供墨的歧管和用于在墨室和歧管之间提供连通的墨通道，依次层叠在基板上的多个钝化层，形成在钝化层上的金属层，以及喷嘴，墨水从墨水室喷出，穿过喷嘴板，设置在相邻钝化层之间的加热器，加热器位于油墨室之上，用于加热油墨室内的油墨，设置在相邻钝化层之间的导体，该导体电连接到加热器，用于向加热器施加电流;以及疏水涂层，其专门形成在金属层。

55. 发明授权

US06391673B1 Method of fabricating micro electro mechanical system structure which can be vacuum-packed at wafer level 失效
标题翻译：制造可在晶圆级真空包装的微机电系统结构的方法
公开(公告)号：US06391673B1
公开(公告)日：2002-05-21
申请号：US09702849
申请日：2000-11-01
申请人： Byeoung Ju Ha , Seog-soon Baek , Hyun-cheol Kim , Hoon Song , Yong-soo Oh
发明人： Byeoung Ju Ha , Seog-soon Baek , Hyun-cheol Kim , Hoon Song , Yong-soo Oh
IPC分类号： H01L2100
CPC分类号： B81C1/00293 , G01C19/5769 , G01P1/02 , G01P15/0802
摘要： A method of fabricating a micro electromechanical system (MEMS) structure which can be vacuum-packaged at the wafer level is provided. The method includes the steps of forming a multilayered stack including a signal line on a first wafer; bonding a second wafer to the multilayered stack; polishing the first wafer to a predetermined thickness; forming a MEMS structure in a vacuum area of the first wafer and a pad outside the vacuum area, the MEMS structure and the pad being connected to the signal line; forming a structure in a third wafer to have space corresponding to the vacuum area of the MEMS structure; and bonding the third wafer to the polished surface of the first wafer in a vacuum state. For protection of the structure and maintaining a vacuum level required for operation, the fabricated structure is vacuum-packaged at the wafer level, thereby improving the yield of fabrication. In addition, since a special vacuum packaging process is not necessary, the fabrication can be simplified.
摘要翻译：提供了一种制造可在晶片级真空封装的微机电系统（MEMS）结构的方法。该方法包括以下步骤：在第一晶片上形成包括信号线的多层堆叠; 将第二晶片接合到所述多层堆叠; 将第一晶片抛光至预定厚度; 在第一晶片的真空区域中形成MEMS结构，在真空区域外形成垫，MEMS结构和焊盘连接到信号线; 在第三晶片中形成具有对应于MEMS结构的真空区域的空间的结构; 以及在真空状态下将所述第三晶片接合到所述第一晶片的抛光表面。为了保护结构并保持操作所需的真空水平，制造的结构在晶片级被真空包装，从而提高了制造的产量。此外，由于不需要特殊的真空包装处理，因此可以简化制造。

56. 发明申请

US20050151269A1 UBM for fine pitch solder balland flip-chip packaging method using the same 有权
标题翻译： UBM用于精细节距焊球和倒装芯片封装方法使用相同
公开(公告)号：US20050151269A1
公开(公告)日：2005-07-14
申请号：US11012294
申请日：2004-12-16
申请人： Hoon Song , Dong-sik Shim
发明人： Hoon Song , Dong-sik Shim
IPC分类号： H01L21/60 , H01L23/13 , H01L23/485 , H01L29/06 , H05K1/11 , H05K3/34 , H01L21/44 , H01L21/48 , H01L21/50 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/13 , H01L23/13 , H01L24/03 , H01L24/05 , H01L24/16 , H01L24/81 , H01L29/0657 , H01L2224/0401 , H01L2224/05551 , H01L2224/05557 , H01L2224/05559 , H01L2224/05568 , H01L2224/05571 , H01L2224/05578 , H01L2224/05599 , H01L2224/10145 , H01L2224/1147 , H01L2224/13099 , H01L2224/13111 , H01L2224/16 , H01L2224/16237 , H01L2224/16238 , H01L2224/81365 , H01L2224/81385 , H01L2224/81801 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01006 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10157 , H01L2924/15151 , H01L2924/15787 , H01L2924/381 , H05K1/111 , H05K3/3436 , H05K2201/09036 , H05K2201/09045 , H05K2201/10674 , H05K2201/10734 , Y02P70/611 , Y02P70/613 , H01L2224/05552 , H01L2924/00
摘要： A flip-chip package for implementing a fine solder ball, and a flip-chip packaging method using the same. The flip-chip package includes a first wafer having a first electrode and a first under bump metal (UBM) formed on the first electrode and electrically connected to the first electrode; and second wafer opposing the first wafer and having a second electrode located in a position corresponding to the first electrode, and a second UBM formed on the second electrode and electrically connected to the second electrode. The first wafer has a depression formed on one or more areas adjacent to the first UBM, which depression partly receives a solder ball that connects the first and the second UBMs upon flip-chip bonding of the first and second wafers. Since the UBM is formed as an embossing pattern, a fine solder ball can be implemented. Additionally, the reliability of the package can be improved.
摘要翻译：一种用于实现精细焊球的倒装芯片封装以及使用其的倒装芯片封装方法。倒装芯片封装包括具有形成在第一电极上并电连接到第一电极的第一电极和第一下凸块金属（UBM）的第一晶片; 以及与所述第一晶片相对并且具有位于对应于所述第一电极的位置的第二电极的第二晶片，以及形成在所述第二电极上并电连接到所述第二电极的第二UBM。第一晶片具有形成在与第一UBM相邻的一个或多个区域上的凹陷部，该凹陷部分地接收在第一和第二晶片倒装芯片接合时连接第一和第二UBM的焊球。由于UBM形成为压花图案，因此可以实现精细的焊球。此外，可以提高包装的可靠性。

57. 发明授权

US07309924B2 UBM for fine pitch solder ball and flip-chip packaging method using the same 有权
标题翻译： UBM用于细间距焊球和倒装芯片封装方法使用
公开(公告)号：US07309924B2
公开(公告)日：2007-12-18
申请号：US11012294
申请日：2004-12-16
申请人： Hoon Song , Dong-sik Shim
发明人： Hoon Song , Dong-sik Shim
IPC分类号： H01L23/48
CPC分类号： H01L24/13 , H01L23/13 , H01L24/03 , H01L24/05 , H01L24/16 , H01L24/81 , H01L29/0657 , H01L2224/0401 , H01L2224/05551 , H01L2224/05557 , H01L2224/05559 , H01L2224/05568 , H01L2224/05571 , H01L2224/05578 , H01L2224/05599 , H01L2224/10145 , H01L2224/1147 , H01L2224/13099 , H01L2224/13111 , H01L2224/16 , H01L2224/16237 , H01L2224/16238 , H01L2224/81365 , H01L2224/81385 , H01L2224/81801 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01006 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10157 , H01L2924/15151 , H01L2924/15787 , H01L2924/381 , H05K1/111 , H05K3/3436 , H05K2201/09036 , H05K2201/09045 , H05K2201/10674 , H05K2201/10734 , Y02P70/611 , Y02P70/613 , H01L2224/05552 , H01L2924/00
摘要： A flip-chip package for implementing a fine solder ball, and a flip-chip packaging method using the same. The flip-chip package includes a first wafer having a first electrode and a first under bump metal (UBM) formed on the first electrode and electrically connected to the first electrode; and second wafer opposing the first wafer and having a second electrode located in a position corresponding to the first electrode, and a second UBM formed on the second electrode and electrically connected to the second electrode. The first wafer has a depression formed on one or more areas adjacent to the first UBM, which depression partly receives a solder ball that connects the first and the second UBMs upon flip-chip bonding of the first and second wafers. Since the UBM is formed as an embossing pattern, a fine solder ball can be implemented. Additionally, the reliability of the package can be improved.
摘要翻译：一种用于实现精细焊球的倒装芯片封装以及使用其的倒装芯片封装方法。倒装芯片封装包括具有形成在第一电极上并电连接到第一电极的第一电极和第一下凸块金属（UBM）的第一晶片; 以及与所述第一晶片相对并且具有位于对应于所述第一电极的位置的第二电极的第二晶片，以及形成在所述第二电极上并电连接到所述第二电极的第二UBM。第一晶片具有形成在与第一UBM相邻的一个或多个区域上的凹陷部，该凹陷部分地接收在第一和第二晶片倒装芯片接合时连接第一和第二UBM的焊球。由于UBM形成为压花图案，因此可以实现精细的焊球。此外，可以提高包装的可靠性。

58. 发明授权

US07226148B2 Ink-jet printhead and method of manufacturing the same 有权
标题翻译：喷墨打印头及其制造方法
公开(公告)号：US07226148B2
公开(公告)日：2007-06-05
申请号：US10899109
申请日：2004-07-27
申请人： Hoon Song , Yong-soo Oh , Jong-woo Shin , Hyung-taek Lim
发明人： Hoon Song , Yong-soo Oh , Jong-woo Shin , Hyung-taek Lim
IPC分类号： B41J2/05
CPC分类号： B41J2/1629 , B41J2/14137 , B41J2/1601 , B41J2/1628 , B41J2/1631 , B41J2/1635 , B41J2/1639 , B41J2/1642 , B41J2/1643 , B41J2/1646 , B41J2002/1437
摘要： An ink-jet printhead, and a method of manufacturing the same, includes a substrate, an ink chamber, a manifold, and an ink channel formed between the ink chamber and the manifold to provide flow communication between the ink chamber and the manifold, a substantially flat nozzle plate formed on the upper surface of the substrate, the nozzle plate including a plurality of passivation layers, a heat dissipation layer disposed on the plurality of passivation layers, the heat dissipation layer formed of a thermally conductive material and including a first thermally conductive layer formed on the plurality of passivation layers and a second thermally conductive layer formed on the first thermally conductive layer, and a nozzle extending through the nozzle plate in flow communication with the ink chamber, and a heater and a conductor, the heater heating ink filled in the ink chamber and the conductor applying current to the heater.
摘要翻译：喷墨打印头及其制造方法包括在油墨室和歧管之间形成的基板，油墨室，歧管和油墨通道，以提供油墨室与歧管之间的流动连通，基本上平坦的喷嘴板，形成在基板的上表面上，喷嘴板包括多个钝化层，设置在多个钝化层上的散热层，散热层由导热材料形成，并且包括第一热形成在多个钝化层上的导电层和形成在第一导热层上的第二导热层，以及延伸穿过与墨室流动连通的喷嘴板的喷嘴，以及加热器和导体，加热器加热墨填充在墨水室中，并且导体将电流施加到加热器。

59. 发明授权

US07169539B2 Monolithic ink-jet printhead having a tapered nozzle and method for manufacturing the same 有权
标题翻译：具有锥形喷嘴的单片喷墨打印头及其制造方法
公开(公告)号：US07169539B2
公开(公告)日：2007-01-30
申请号：US11084097
申请日：2005-03-21
申请人： Hyung-taek Lim , Jong-woo Shin , Hoon Song , Yong-soo Oh , Chang-seung Lee
发明人： Hyung-taek Lim , Jong-woo Shin , Hoon Song , Yong-soo Oh , Chang-seung Lee
IPC分类号： B41J2/16
CPC分类号： B41J2/14137 , B41J2/14129 , B41J2/1433 , B41J2/1603 , B41J2/1625 , B41J2/1626 , B41J2/1631 , B41J2/1646 , B41J2002/1437
摘要： A monolithic ink-jet printhead includes a substrate having an ink chamber, a manifold, and an ink channel in flow communication, a nozzle plate including a plurality of passivation layers stacked on the substrate and a heat dissipating layer stacked on the passivation layers, a nozzle for ejecting ink penetrating the nozzle plate, a heater provided between adjacent passivation layers above the ink chamber, and a conductor between adjacent passivation layers, the conductor being electrically connected to the heater, wherein the heat dissipating layer is made of a thermally conductive metal for dissipating heat from the heater, the lower part of the nozzle is formed by penetrating the plurality of passivation layers, and the upper part of the nozzle is formed by penetrating the heat dissipating layer in a tapered shape in which a cross-sectional area thereof decreases gradually toward an exit thereof.
摘要翻译：单片式喷墨打印头包括具有墨水室，歧管和流动连通的墨水通道的基板，包括堆叠在基板上的多个钝化层的喷嘴板和堆叠在钝化层上的散热层，用于喷射穿过喷嘴板的墨水的喷嘴，设置在墨水室上方的相邻钝化层之间的加热器和相邻钝化层之间的导体，导体电连接到加热器，其中散热层由导热金属为了从加热器散热，喷嘴的下部通过穿透多个钝化层而形成，并且喷嘴的上部通过穿透散热层而形成，该锥形形状的截面积为逐渐向其出口逐渐减少。

60. 发明授权

US07148141B2 Method for manufacturing metal structure having different heights 有权
标题翻译：具有不同高度的金属结构的制造方法
公开(公告)号：US07148141B2
公开(公告)日：2006-12-12
申请号：US11012312
申请日：2004-12-16
申请人： Dong-sik Shim , Chan-bong Jun , Hyung Choi , Hoon Song
发明人： Dong-sik Shim , Chan-bong Jun , Hyung Choi , Hoon Song
IPC分类号： H01L21/44
CPC分类号： H01L21/76885 , H01L21/2885 , H01L24/11 , H01L24/12 , H01L2224/0401 , H01L2224/0603 , H01L2224/13099 , H01L2224/1403 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01078 , H01L2924/181 , H01L2924/00
摘要： Disclosed is a method for forming a plurality of metal structures having different heights on a semiconductor substrate. The disclosed method for manufacturing a metal structure having different heights includes: forming a plurality of seed layers, to have heights corresponding to the metal structure to be formed, on a semiconductor substrate so that those layers can be electrically separated, performing a plating process using a plating mold, and applying different currents to the respective seed layers so that the plating thickness can be adjusted for each of the seed layers. Accordingly, a plurality of metal structures having different heights can be obtained by a plating mold forming process and a plating process that are performed just once, respectively.
摘要翻译：公开了一种在半导体衬底上形成具有不同高度的多个金属结构体的方法。所公开的制造具有不同高度的金属结构体的方法包括：在半导体衬底上形成多个种子层以具有与要形成的金属结构相对应的高度，使得这些层可以电分离，使用电镀模具，并且向相应的种子层施加不同的电流，使得可以针对每个种子层调整镀层厚度。因此，可以通过分别进行一次的电镀模具成型工序和电镀工序来获得具有不同高度的多个金属结构体。

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