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    • 60. 发明授权
    • Semiconductor laser device
    • 半导体激光器件
    • US06836491B2
    • 2004-12-28
    • US10273349
    • 2002-10-18
    • Takashi Itoh
    • Takashi Itoh
    • H01S319
    • G11B7/22G11B7/123H01S5/02212
    • A semiconductor laser device comprises a semiconductor laser chip, a first member which has one surface substantially perpendicular to a direction of an emission laser beam and has a concave having a bottom face substantially parallel to the one surface, and a second member inserted into the concave and joined to the first member. The semiconductor laser chip is disposed to the bottom face of the concave of the first member. The second member is inserted and joined into the concave of the first member so as to cover the semiconductor laser chip. Consequently, it is avoided to impair smoothness of the one surface of the first member, so that it is possible to precisely join the first and second members after being joined together to a desired apparatus at the one surface.
    • 半导体激光器件包括半导体激光器芯片,第一部件,其具有基本上垂直于发射激光束的方向的一个表面,并且具有基本上平行于该一个表面的底面的凹部,以及插入凹部 并加入了第一名成员。 半导体激光芯片设置在第一部件的凹部的底面上。 将第二构件插入并接合到第一构件的凹部中,以覆盖半导体激光器芯片。 因此,避免了损害第一构件的一个表面的平滑度,使得可以在第一和第二构件在一个表面上连接到所需的装置之后可以精确地接合第一和第二构件。