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51. 发明授权

US07759781B2 LSI package provided with interface module 失效
标题翻译： LSI封装提供了接口模块
公开(公告)号：US07759781B2
公开(公告)日：2010-07-20
申请号：US11552256
申请日：2006-10-24
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： H01L23/48
CPC分类号： H01L23/49827 , H01L25/18 , H01L2924/0002 , H01L2924/09701 , H01L2924/15311 , H01L2924/3011 , H05K1/0268 , H05K1/141 , H05K7/023 , H05K2201/049 , H05K2201/10704 , H05K2201/10719 , H01L2924/00
摘要： A LSI package encompasses: an interposer having board-connecting joints, which facilitate connection with a printed wiring board, and module-connecting terminals, part of the module-connecting terminals are assigned as interposer-site monitoring terminals; a signal processing LSI mounted on the interposer; and an I/F module having a plurality of interposer-connecting terminals, which are arranged to correspond to arrangement of the module-connecting terminals, and a transmission line to establish an external interconnection of signal, which is transmitted from the signal processing LSI, part of the interposer-connecting terminals are assigned as module-site monitoring terminals. The interposer-site and module-site monitoring terminals are configured to flow a monitoring current to confirm electric contact between the signal processing LSI and the I/F module.
摘要翻译： LSI封装包括：具有板连接接头的插入件，其便于与印刷线路板的连接，以及模块连接端子，部分模块连接端子被分配为插入器位置监视端子; 安装在所述插入器上的信号处理LSI; 以及具有多个插入器连接端子的I / F模块，其被配置为对应于模块连接端子的配置，以及传输线，用于建立从信号处理LSI发送的信号的外部互连，插入器连接端子的一部分被分配为模块站点监视终端。中介站点和模块现场监视终端被配置为流动监视电流以确认信号处理LSI和I / F模块之间的电接触。

52. 发明授权

US07535090B2 LSI package provided with interface module 失效
标题翻译： LSI封装提供了接口模块
公开(公告)号：US07535090B2
公开(公告)日：2009-05-19
申请号：US11015013
申请日：2004-12-20
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： H01L23/48
CPC分类号： H01L23/49827 , H01L25/18 , H01L2924/0002 , H01L2924/09701 , H01L2924/15311 , H01L2924/3011 , H05K1/0268 , H05K1/141 , H05K7/023 , H05K2201/049 , H05K2201/10704 , H05K2201/10719 , H01L2924/00
摘要： A LSI package encompasses: an interposer having board-connecting joints, which facilitate connection with a printed wiring board, and module-connecting terminals, part of the module-connecting terminals are assigned as interposer-site monitoring terminals; a signal processing LSI mounted on the interposer; and an I/F module having a plurality of interposer-connecting terminals, which are arranged to correspond to arrangement of the module-connecting terminals, and a transmission line to establish an external interconnection of signal, which is transmitted from the signal processing LSI, part of the interposer-connecting terminals are assigned as module-site monitoring terminals. The interposer-site and module-site monitoring terminals are configured to flow a monitoring current to confirm electric contact between the signal processing LSI and the I/F module.
摘要翻译： LSI封装包括：具有板连接接头的插入件，其便于与印刷线路板的连接，以及模块连接端子，部分模块连接端子被分配为插入器位置监视端子; 安装在所述插入器上的信号处理LSI; 以及具有多个插入器连接端子的I / F模块，其被配置为对应于模块连接端子的配置，以及传输线，用于建立从信号处理LSI发送的信号的外部互连，插入器连接端子的一部分被分配为模块站点监视终端。中介站点和模块现场监视终端被配置为流动监视电流以确认信号处理LSI与I / F模块之间的电接触。

53. 发明授权

US07441964B2 Optical guide holding member and optical module 失效
标题翻译：光导保持构件和光学模块
公开(公告)号：US07441964B2
公开(公告)日：2008-10-28
申请号：US11531922
申请日：2006-09-14
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： G02B6/36
CPC分类号： G02B6/4201 , G02B6/423 , G02B6/424 , G02B6/4274
摘要： The present invention provides an optical guide holding member having holding holes in which optical guides are fitted and held. The optical guide holding member has electric leads buried in a mounting surface on which the openings of the holding holes are opened. The electric leads are partly exposed on the mounting surface, and are also exposed on a side surface crossing the mounting surface. The optical semiconductor device is electrically connected to the exposed part of electric leads and is optically coupled with the optical guides.
摘要翻译：本发明提供一种光导保持构件，其具有保持孔，光导装置安装并保持在该保持孔中。光导保持构件具有埋入保持孔的开口的安装面上的电引线。电引线部分地暴露在安装表面上，并且也暴露在与安装表面交叉的侧表面上。光学半导体器件电连接到电引线的暴露部分并与光导光学耦合。

54. 发明授权

US07438481B2 Optical semiconductor module and semiconductor device including the same 失效
标题翻译：光半导体模块及其半导体装置
公开(公告)号：US07438481B2
公开(公告)日：2008-10-21
申请号：US11200045
申请日：2005-08-10
申请人： Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： G02B6/30 , G02B6/36
CPC分类号： G02B6/3644 , G02B6/3652 , G02B6/4201 , G02B6/4253 , G02B6/4255 , G02B6/428 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/1305 , H01L2924/15311 , H05K1/0274 , H01L2924/00 , H01L2224/0401
摘要： An optical semiconductor module comprises a guide which has a positioning portion for an optical transmission line, an optical semiconductor mounting surface from which one end face of the optical transmission line disposed in the positioning portion is exposed, and a wiring layer formed on the optical semiconductor mounting surface. An optical semiconductor element is mounted on the optical semiconductor mounting surface of the guide, with a light-emitting surface or a light-receiving surface thereof facing the one end face of the optical transmission line, and is electrically connected to the wiring layer.
摘要翻译：光学半导体模块包括具有用于光传输线路的定位部分的引导件，设置在定位部分中的光传输线的一个端面从该半导体安装表面露出的光学半导体安装表面和形成在光学半导体上的布线层安装面。将光学半导体元件安装在引导件的光学半导体安装面上，其发光面或受光面朝向光传输线的一个端面，并与导线层电连接。

55. 发明申请

US20080185733A1 LSI PACKAGE PROVIDED WITH INTERFACE MODULE, AND TRANSMISSION LINE HEADER EMPLOYED IN THE PACKAGE 失效
标题翻译：提供接口模块的LSI封装和在封装中使用的传输线头
公开(公告)号：US20080185733A1
公开(公告)日：2008-08-07
申请号：US12098212
申请日：2008-04-04
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： H01L23/52
CPC分类号： G02B6/4201 , G02B6/4202 , G02B6/4249 , G02B6/4251 , G02B6/4269 , G02B6/428 , G02B6/4284 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/16 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/29386 , H01L2224/83102 , H01L2224/83851 , H01L2224/92125 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12042 , H01L2924/12043 , H01L2924/1305 , H01L2924/14 , H01L2924/3011 , H01L2924/3512 , H01L2924/00 , H01L2924/00014 , H01L2924/01022 , H01L2924/0665
摘要： An LSI package encompasses a transmission line header embracing a header-base, a transmission line held by the header-base, and an interface IC chip mounted on the header-base, an interposer substrate having a plurality of board-connecting joints, which facilitate connection with the printed wiring board; an LSI chip mounted on the interposer substrate; and a receptacle having a lead terminal and being mounted on the interposer substrate, configured to accommodate the transmission line header so that the interface IC chip electrically connects to the LSI chip through the lead terminal.
摘要翻译： LSI封装包括一个传输线头，包括一个标题基座，一个由标题基座保持的传输线，以及一个安装在标题基座上的接口IC芯片，一个具有多个板连接接头的插入基片，与印刷线路板的连接; 安装在所述插入器基板上的LSI芯片; 以及插座，其具有引线端子并安装在所述插入器基板上，被配置为容纳所述传输线集管，使得所述接口IC芯片通过所述引线端子电连接到所述LSI芯片。

56. 发明申请

US20080138027A1 Method of producing optical fiber positioning component, and optical fiber positioning component 有权
标题翻译：光纤定位部件的制造方法以及光纤定位部件
公开(公告)号：US20080138027A1
公开(公告)日：2008-06-12
申请号：US11984675
申请日：2007-11-20
申请人： Wataru Sakurai , Mitsuaki Tamura , Hideto Furuyama , Hiroshi Hamasaki , Hideo Numata
发明人： Wataru Sakurai , Mitsuaki Tamura , Hideto Furuyama , Hiroshi Hamasaki , Hideo Numata
IPC分类号： G02B6/00
CPC分类号： G02B6/4219 , G02B6/3652 , G02B6/3696 , G02B6/3817 , G02B6/3878 , G02B6/4249
摘要： A flow of a resin which is injected for insert-molding a wiring plate into an end face of an optical fiber positioning component is regulated by regulating portions disposed in side portions of a die. Therefore, leads of the wiring plate can be prevented from being fixed while remaining to be positionally displaced by the force of the flowing resin. As a result, three-dimensional electrical wirings can be formed easily and correctly.
摘要翻译：注射用于将布线板嵌入成型到光纤定位部件的端面中的树脂的流动通过设置在管芯的侧部的限制部分来调节。因此，可以防止布线板的引线固定，同时通过流动树脂的力保持位置位移。结果，可以容易且正确地形成三维电气布线。

57. 发明授权

US07364369B2 Lead frame, optical coupling part using lead frame, and manufacturing method of optical coupling part 有权
标题翻译：引线框架，使用引线框架的光耦合部件，以及光耦合部件的制造方法
公开(公告)号：US07364369B2
公开(公告)日：2008-04-29
申请号：US11711862
申请日：2007-02-28
申请人： Wataru Sakurai , Kazuhito Saito , Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
发明人： Wataru Sakurai , Kazuhito Saito , Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： G02B6/36
CPC分类号： G02B6/43 , G02B6/4202 , H01L2924/0002 , H01L2924/00
摘要： When a resin 59 to form a molded body 20 is poured and a lead frame 30 is attached to a front end face 21 of the molded body 20 by insert molding, protective leads 32 provided on both outsides of a lead pattern 31 of the lead frame 30 moderate the flow of the resin 59 and the force acting on the lead pattern 31 is decreased, so that misregistration of the lead pattern 31 can be prevented. Accordingly, the inserted and molded lead frame 30 can be wired on the front end face 21 of the molded body 20 for easily accomplishing three-dimensional electric wiring.
摘要翻译：当浇铸形成模制体20的树脂59并且通过嵌件模制将引线框架30附接到模制体20的前端面21时，设置在引线框架的引线图案31的外侧的保护引线32 30使树脂59的流动缓和，并且作用在引线图案31上的力减小，从而可以防止引线图案31的不对准。因此，插入成型的引线框架30可以布线在成型体20的前端面21上，以便于实现三维电线。

58. 发明授权

US07330352B2 Interface module-mounted LSI package 失效
标题翻译：接口模块安装的LSI封装
公开(公告)号：US07330352B2
公开(公告)日：2008-02-12
申请号：US11496446
申请日：2006-08-01
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/367 , H01L23/49827 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/1305 , H01L2924/15311 , H01L2924/00
摘要： An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is in contact with both the signal processing LSI and the interface module, and radiates heat of the signal processing LSI and the interface module. The LSI package has a gap, which serves as a heat resistor portion between the heat radiating portion for the signal processing LSI and the heat radiating portion for the interface module.
摘要翻译：接口模块安装的LSI封装具有内置基板，其具有信号处理LSI，用于信号传输的接口模块，机械地连接到插入器并且电连接到信号处理LSI，以及与两个信号接触的散热器处理LSI和接口模块，并辐射信号处理LSI和接口模块的热量。 LSI封装具有间隙，其作为用于信号处理LSI的散热部分和用于接口模块的散热部分之间的热电阻部分。

59. 发明授权

US07300213B2 Member holding optical transmission line and optical module 失效
标题翻译：会员持有光传输线和光模块
公开(公告)号：US07300213B2
公开(公告)日：2007-11-27
申请号：US11472367
申请日：2006-06-22
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： G02B6/36
CPC分类号： G02B6/4212 , G02B6/4249
摘要： In an optical module, a member has a hole and a mounting surface in which the hole is open and electric wiring is formed. A recess is formed in the mounting surface. The electric wiring is formed in the recess and is continuously extended to an outside the recess. The electric wiring is provided with a connecting portion on a bottom surface of the recess. An optical transmission line is inserted into the hole and its optical input or optical output end is faced to the optical semiconductor device so as to be optically coupled to the optical transmission line. The semiconductor device is mounted on the mounting surface and electrically connected to the connecting portion. The gap between the optical semiconductor device and the opening end face of the optical transmission line is filled with an adhesive.
摘要翻译：在光学模块中，构件具有孔和安装表面，孔中打开孔并形成电布线。在安装面上形成凹部。电气配线形成在凹部中，并且连续地延伸到凹部的外侧。电气配线在凹部的底面设置有连接部。光传输线插入孔中，其光输入或光输出端面对光半导体器件，以光耦合到光传输线。半导体器件安装在安装表面上并电连接到连接部分。光学半导体器件与光传输线的开口端面之间的间隙填充有粘合剂。

60. 发明授权

US07198412B2 Holder of optical transmission lines and multi-core optical wave-guide 有权
标题翻译：光传输线和多芯光波导的支架
公开(公告)号：US07198412B2
公开(公告)日：2007-04-03
申请号：US11014833
申请日：2004-12-20
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： G02B6/36 , H01R13/00 , H01R33/945
CPC分类号： G02B6/4249 , G02B6/3644
摘要： A holder of optical transmission lines encompasses an insulating base body defined by a mounting face to mount an optical device chip, an opposing face opposing to the mounting face and side faces which connect between the mounting face and the opposing face, one of side faces is assigned as an interconnection face, and provided with through-holes penetrating between the mounting face and the opposing face so as to hold optical transmission lines, the through-holes define openings on the mounting face; electric interconnections extending from respective vicinities of the opening on the mounting face on to the interconnection face; and heat conduction passages assigned alternately with the electric interconnections, extending from the mounting face on to the interconnection face, each of the heat conduction passages is longer than the electric interconnections on the interconnection face.
摘要翻译：光传输线的保持器包括由安装面限定的绝缘基体，以安装光学器件芯片，与安装面相对的相对面和连接在安装面和相对面之间的侧面，一个侧面是被配置为互连面，并且在安装面和相对面之间设置有贯穿孔的通孔，以保持光传输线，通孔在安装面上限定开口; 电互连从安装面上的开口的各附近延伸到互连面; 以及从安装面延伸到互连面的电互连交替配置的热传导通路，每个导热通道比互连面上的电互连长。

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