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    • 59. 发明申请
    • Methods for angled ion implantation of semiconductor devices
    • 半导体器件成角度离子注入的方法
    • US20050078725A1
    • 2005-04-14
    • US10969465
    • 2004-10-20
    • Tzu-Yu Wang
    • Tzu-Yu Wang
    • H01L21/265H01S5/00H01L21/00
    • H01L21/26586
    • This disclosure concerns methods for ion implantation of semiconductor devices such as VCSELs. In on example of such a method, a surface of the semiconductor structure is disposed at a predetermined orientation. The semiconductor structure is then rotated at a predetermined speed. An ion beam of characteristic flux is generated and directed at the surface of the semiconductor structure so that the ion beam is incident on the surface at an incident flux angle. Because the ion beam is incident on the surface at a defined angle, an implant region having an approximately wedge shaped cross-section is formed in the semiconductor device.
    • 本公开涉及半导体器件(例如VCSEL)的离子注入方法。 在这种方法的例子中,半导体结构的表面以预定取向设置。 然后半导体结构以预定速度旋转。 产生特征通量的离子束并且指向半导体结构的表面,使得离子束以入射磁通角入射在表面上。 因为离子束以限定的角度入射在表面上,所以在半导体器件中形成具有大致楔形横截面的植入区域。
    • 60. 发明授权
    • Long wavelength VCSEL with tunnel junction, and implant
    • 具有隧道结的长波长VCSEL和植入物
    • US06813293B2
    • 2004-11-02
    • US10301380
    • 2002-11-21
    • Ralph H. JohnsonTzu-Yu Wang
    • Ralph H. JohnsonTzu-Yu Wang
    • H01S500
    • H01S5/18308H01S5/0425H01S5/18311H01S5/18316H01S5/1833H01S5/18369H01S5/18377H01S5/2063H01S5/3095
    • A vertical cavity emitting laser (VCSEL) having a tunnel junction. The junction may be isolated with an implant into a top mirror and past the junction and p-layer. A trench around the VCSEL may result in reduced capacitance and more D.C. isolation of the junction. The implant may occur after the trench is made. Some implant may pass the trench to a bottom mirror. Additional isolation and current confinement may be provided with lateral oxidation of a layer below the junction. Internal trenches may be made from the top of the VCSEL vertically to an oxidizable layer below the junction. For further isolation, an open trench may be placed around a bonding pad and its bridge to the VCSEL and internal vertical trenches may be placed on the pad and its bridge down to the oxidizable layer.
    • 具有隧道结的垂直腔发射激光器(VCSEL)。 该结可以通过植入物分离成上反射镜并经过结和p层。 VCSEL周围的沟槽可能会导致电容降低,并可能导致更多的直流隔离。 植入物可以在制成沟槽之后发生。 一些植入物可以通过沟槽到底部反射镜。 可以提供额外的隔离和电流限制,其中在结点下方的层的侧向氧化。 内部沟槽可以从VCSEL的顶部垂直地连接到结点下面的可氧化层。 为了进一步隔离,可以在接合焊盘周围放置开放沟槽,并且其到VCSEL的桥接器和内部垂直沟槽可以被放置在焊盘上并且其桥接器到达可氧化层。