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51. 发明授权

US08687364B2 Directly connected heat exchanger tube section and coolant-cooled structure 有权
标题翻译：直接连接热交换器管段和冷却剂冷却结构
公开(公告)号：US08687364B2
公开(公告)日：2014-04-01
申请号：US13283933
申请日：2011-10-28
申请人： Timothy J. Chainer , Patrick A. Coico , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
发明人： Timothy J. Chainer , Patrick A. Coico , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： B23P15/26 , H05K7/20781 , H05K7/20827 , Y10T29/4935 , Y10T29/49826
摘要： A cooling apparatus for an electronics rack is provided which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures and a tube. The heat exchanger, which is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.
摘要翻译：提供了一种用于电子机架的冷却装置，其包括空气 - 液体热交换器，一个或多个冷却剂冷却结构和管。与电子机架相关联并设置成冷却通过齿条的空气的热交换器包括多个不同的冷却剂承载管部分，每个管部分具有冷却剂入口和冷却剂出口，其中一个耦合与冷却剂回路流体连通以便于冷却剂流过管段。冷却剂冷却结构与机架的电子部件热接触，并且有助于将热量从部件传递到冷却剂。该管连接流体连通一个冷却剂冷却结构和一个管部分的冷却剂入口或出口中的另一个，并且促使冷却剂直接在热交换器的冷却剂承载管部分和冷却剂冷却结构之间流动。

52. 发明授权

US08344516B2 Integrated chip carrier with compliant interconnects 有权
标题翻译：集成芯片载体兼容互连
公开(公告)号：US08344516B2
公开(公告)日：2013-01-01
申请号：US12986460
申请日：2011-01-07
申请人： Timothy J. Chainer
发明人： Timothy J. Chainer
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L21/486 , H01L21/7682 , H01L21/76898 , H01L23/13 , H01L23/481 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/09701 , H01L2924/10253 , H01L2924/3011 , H01L2924/00 , H01L2224/0401
摘要： A silicon chip includes a silicon substrate, a plurality of pads, and a plurality of through vias to connect back-end-of-line wiring to the plurality of pads. The silicon substrate includes a layer of active devices and the back-end-of-line wiring connected to the active devices.
摘要翻译：硅芯片包括硅衬底，多个焊盘和多个通孔，以将后端线接线连接到多个焊盘。硅衬底包括有源器件层和连接到有源器件的后端线路布线。

53. 发明授权

US07707060B2 Automatic collection and dissemination of product usage information 有权
标题翻译：自动收集和传播产品使用信息
公开(公告)号：US07707060B2
公开(公告)日：2010-04-27
申请号：US10645128
申请日：2003-08-21
申请人： Timothy J. Chainer , Yasuo Amemiya , Steven W. Depp
发明人： Timothy J. Chainer , Yasuo Amemiya , Steven W. Depp
IPC分类号： G06F17/30 , G07G1/00
CPC分类号： G06Q30/0201 , G06Q30/02
摘要： Products include autonomic logic to self-monitor one or more parameters associated with the products to provide product usage information. Data relating to the product usage information generated by the products is automatically disseminated to interested entities. The interested entities may analyze the provided data and automatically forward information relating to the provided data back towards the products. The interested entities may also effect changes to products based on the data.
摘要翻译：产品包括自主逻辑，以自我监测与产品相关联的一个或多个参数以提供产品使用信息。与产品生成的产品使用信息相关的数据将自动传播给感兴趣的实体。感兴趣的实体可以分析提供的数据，并将与提供的数据相关的信息自动转发回产品。感兴趣的实体也可能会根据数据影响对产品的更改。

54. 发明申请

US20100033935A1 Method for Direct Heat Sink Attachment 有权
标题翻译：直接散热器附件方法
公开(公告)号：US20100033935A1
公开(公告)日：2010-02-11
申请号：US12535394
申请日：2009-08-04
申请人： Timothy J. Chainer
发明人： Timothy J. Chainer
IPC分类号： H05K7/20
CPC分类号： H01L23/40 , H01L23/4006 , H01L23/4093 , H01L2023/4062 , H01L2224/16 , H01L2224/73253 , Y10T29/53022 , Y10T29/5313
摘要： A system and method of attaching a heat sink to an integrated circuit chip includes providing a compliant material for constraining the heat sink's mechanical motion while simultaneously allowing for thermal expansion of the heat sink.
摘要翻译：将散热器附接到集成电路芯片的系统和方法包括提供用于约束散热器的机械运动的柔性材料，同时允许散热器的热膨胀。

55. 发明申请

US20090037016A1 C4NP Servo Controlled Solder Fill Head 有权
标题翻译： C4NP伺服控制焊接头
公开(公告)号：US20090037016A1
公开(公告)日：2009-02-05
申请号：US11830349
申请日：2007-07-30
申请人： Timothy J. Chainer , Peter A. Gruber , Dennis G. Manzer
发明人： Timothy J. Chainer , Peter A. Gruber , Dennis G. Manzer
IPC分类号： G06F19/00
CPC分类号： B23K3/0623 , B23K2101/40 , H01L24/742 , H01L2224/11334 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/14 , H01L2924/00
摘要： An apparatus for placing solder bumps on a mold plate includes: a solder fill head configured for dispensing molten solder onto the mold plate, the solder fill head also configured for relative movement over the mold plate; and a control mechanism configured for controlling positions of the solder fill head relative to the mold plate. The control mechanism includes: a control input signal containing data about an ideal positioning of the solder fill head; a plurality of sensors positioned on the solder fill head, the sensors configured for providing data about a gap between the solder fill head and the mold plate; a position controller configured for receiving the gap data and comparing the gap data with the control input signal, wherein said position controller provides an inequality signal if the gap data and the control input signal are not equal; an amplifier configured for receiving the inequality signal and amplifying it; and an actuator configured for receiving the amplified inequality signal and controlling movement of the solder fill head in response to the inequality signal received. The control mechanism may be a servo control mechanism. The sensors may be gap sensors.
摘要翻译：用于将焊料凸块放置在模板上的装置包括：焊料填充头，其被配置用于将熔融焊料分配到模板上，焊料填充头还构造成用于相对于模具板上的移动; 以及控制机构，被配置为控制焊料填充头相对于模板的位置。控制机构包括：控制输入信号，其包含关于焊料填充头的理想定位的数据; 定位在焊料填充头上的多个传感器，所述传感器被配置为提供关于焊料填充头和模板之间的间隙的数据; 位置控制器，被配置为接收所述间隙数据并将所述间隙数据与所述控制输入信号进行比较，其中如果所述间隙数据和所述控制输入信号不相等，则所述位置控制器提供不等式信号; 放大器，被配置为接收不等式信号并对其进行放大; 以及致动器，被配置为接收放大的不等式信号，并响应于所接收的不等式信号控制焊料填充头的移动。控制机构可以是伺服控制机构。传感器可以是间隙传感器。

56. 发明申请

US20080284018A1 INTEGRATED CHIP CARRIER WITH COMPLIANT INTERCONNECTS 有权
标题翻译：集成芯片载体与合规互连
公开(公告)号：US20080284018A1
公开(公告)日：2008-11-20
申请号：US12119805
申请日：2008-05-13
申请人： Timothy J. Chainer
发明人： Timothy J. Chainer
IPC分类号： H01L29/40
CPC分类号： H01L21/486 , H01L21/7682 , H01L21/76898 , H01L23/13 , H01L23/481 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/09701 , H01L2924/10253 , H01L2924/3011 , H01L2924/00 , H01L2224/0401
摘要： An electronic device includes: at least one electronic chip comprising a first coefficient of thermal expansion (CTE); and a carrier including a top surface connected to the bottom surface of the chip by solder bumps. The carrier further includes a second CTE that approximately matches the first CTE, and a plurality of through vias from the bottom surface of the carrier to the top surface of the carrier layer. Each through via includes a collar exposed at the top surface of the carrier, a pad exposed at the bottom surface of the carrier, and a post disposed between the collar and the pad. The post extends thorough a volume of space.
摘要翻译：电子设备包括：包括第一热膨胀系数（CTE）的至少一个电子芯片; 以及载体，其包括通过焊料凸块连接到芯片的底表面的顶表面。载体还包括与载体层的顶表面大致匹配的第一CTE的第二CTE和从载体的底表面到多个通孔。每个通孔包括暴露在载体的顶表面处的套环，暴露在载体的底表面处的垫，以及设置在套环和衬垫之间的柱。这篇文章扩展了一大堆空间。

57. 发明授权

US09445529B2 Liquid cooled data center design selection 有权
标题翻译：液冷数据中心设计选择
公开(公告)号：US09445529B2
公开(公告)日：2016-09-13
申请号：US13479265
申请日：2012-05-23
申请人： Timothy J. Chainer , Madhusudan K. Iyengar , Pritish R. Parida
发明人： Timothy J. Chainer , Madhusudan K. Iyengar , Pritish R. Parida
IPC分类号： G06G7/56 , H05K7/20
CPC分类号： H05K7/2079 , H05K7/20836
摘要： Input data, specifying aspects of a thermal design of a liquid cooled data center, is obtained. The input data includes data indicative of ambient outdoor temperature for a location of the data center; and/or data representing workload power dissipation for the data center. The input data is evaluated to obtain performance of the data center thermal design. The performance includes cooling energy usage; and/or one pertinent temperature associated with the data center. The performance of the data center thermal design is output.
摘要翻译：获得了指定液冷数据中心的热设计方面的输入数据。输入数据包括指示数据中心位置的环境室外温度的数据; 和/或表示数据中心的工作负载功耗的数据。评估输入数据以获得数据中心热设计的性能。性能包括冷却能量的使用; 和/或与数据中心相关联的一个相关温度。输出数据中心散热设计的性能。

58. 发明授权

US09250636B2 Coolant and ambient temperature control for chillerless liquid cooled data centers 有权
标题翻译：冷却液和环境温度控制无冷却液体冷却数据中心
公开(公告)号：US09250636B2
公开(公告)日：2016-02-02
申请号：US13439471
申请日：2012-04-04
申请人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Robert E. Simons
发明人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Robert E. Simons
IPC分类号： G05D23/00 , G05D23/19 , G06F1/20 , H05K7/20
CPC分类号： H05K7/20836 , F28F27/02 , G05D23/1932 , G06F1/206 , G06F2200/201 , Y02D10/16
摘要： Cooling control methods include measuring a temperature of air provided to a plurality of nodes by an air-to-liquid heat exchanger, measuring a temperature of at least one component of the plurality of nodes and finding a maximum component temperature across all such nodes, comparing the maximum component temperature to a first and second component threshold and comparing the air temperature to a first and second air threshold, and controlling a proportion of coolant flow and a coolant flow rate to the air-to-liquid heat exchanger and the plurality of nodes based on the comparisons.
摘要翻译：冷却控制方法包括通过空气 - 液体热交换器测量提供给多个节点的空气的温度，测量多个节点中的至少一个部件的温度并且在所有这些节点之间找到最大分量温度，比较将最大部件温度提高到第一和第二部件阈值，并将空气温度与第一和第二空气阈值进行比较，并且控制冷却剂流量和冷却剂流量的比例到空气到液体热交换器和多个节点基于比较。

59. 发明授权

US08805613B2 Method for environmental sensing 有权
标题翻译：环境感测方法
公开(公告)号：US08805613B2
公开(公告)日：2014-08-12
申请号：US12613758
申请日：2009-11-06
申请人： Timothy J. Chainer , Nitendra Rajput , Bernice E. Rogowitz
发明人： Timothy J. Chainer , Nitendra Rajput , Bernice E. Rogowitz
IPC分类号： G01V3/00 , G08B1/08
CPC分类号： G01V3/00 , G01W1/00
摘要： Data pertaining to environmental information is acquired using sensors on a multiplicity of networked pervasive devices, and analyzed to determine occurrence of at least one environmental event. Such data can be obtained, for example, from an inventive wireless communications device including an antenna, transmit circuitry coupled to the antenna for transmission of radio frequency radiation therefrom, at least one environmental sensor configured to obtain environmental data, and a communications module coupled to the at least one environmental sensor and configured to cause transmission of a representation of the data via the antenna and the transmit circuitry.
摘要翻译：关于环境信息的数据是使用多个网络普及设备上的传感器来获取的，并被分析以确定至少一个环境事件的发生。这样的数据可以例如从包括天线的发明的无线通信设备获得，耦合到天线的发射电路用于从其发射射频辐射，至少一个被配置为获得环境数据的环境传感器，以及耦合到所述至少一个环境传感器并且被配置为经由所述天线和所述发射电路来发送所述数据的表示。

60. 发明申请

US20110213995A1 Method, Apparatus And Computer Program Product Providing Instruction Monitoring For Reduction Of Energy Usage 审中-公开
标题翻译：方法，装置和计算机程序产品提供用于减少能源使用的指令监控
公开(公告)号：US20110213995A1
公开(公告)日：2011-09-01
申请号：US13074445
申请日：2011-03-29
申请人： Timothy J. Chainer
发明人： Timothy J. Chainer
IPC分类号： G06F1/32
CPC分类号： G06F1/3203 , G06F9/30156 , G06F9/3017
摘要： A method is disclosed to operate a power advisor. The method includes, reading a first instruction set; reading a data bus; and reading register value(s) stored in at least one data register. This information is analyzed for energy usage purposes. If a set of instruction can provide the same result with a lower energy usage, the first instruction set is replaced with the lower power usage instruction set. An apparatus and computer program product are also disclosed.
摘要翻译：公开了一种操作电力顾问的方法。该方法包括：读取第一指令集; 读数据总线; 以及读取存储在至少一个数据寄存器中的寄存器值。分析此信息的能源使用目的。如果一组指令可以提供具有较低能量使用的相同结果，则第一指令集被较低功率使用指令集替换。还公开了一种装置和计算机程序产品。

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