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51. 发明授权

US07348678B2 Integrated circuit package to provide high-bandwidth communication among multiple dice 有权
标题翻译：集成电路封装，提供多个骰子之间的高带宽通信
公开(公告)号：US07348678B2
公开(公告)日：2008-03-25
申请号：US11314459
申请日：2005-12-21
申请人： Qing A. Zhou , Wei O. Shi , Jiangqi He , Daoqiang Lu
发明人： Qing A. Zhou , Wei O. Shi , Jiangqi He , Daoqiang Lu
IPC分类号： H01L23/48 , H01L21/00 , B23K31/02
CPC分类号： H01L25/0652 , H01L25/18 , H01L2224/16 , H01L2924/15311 , H01L2924/15312
摘要： A system may include a microprocessor die, an integrated circuit package substrate, and a die disposed between the microprocessor die and the integrated circuit package substrate. In some embodiments, the integrated circuit package substrate defines a first cavity, and the die is disposed at least partially within the first cavity.
摘要翻译：系统可以包括微处理器管芯，集成电路封装衬底和设置在微处理器管芯和集成电路封装衬底之间的管芯。在一些实施例中，集成电路封装衬底限定第一空腔，并且裸片至少部分地设置在第一空腔内。

52. 发明申请

US20080067668A1 Microelectronic package, method of manufacturing same, and system containing same 审中-公开
标题翻译：微电子封装，制造方法和含有该微电子封装的系统
公开(公告)号：US20080067668A1
公开(公告)日：2008-03-20
申请号：US11521729
申请日：2006-09-15
申请人： Wei Shi , Daoqiang Lu , Qing Zhou , Jiangoi He
发明人： Wei Shi , Daoqiang Lu , Qing Zhou , Jiangoi He
IPC分类号： H01L23/34
CPC分类号： H01L23/3735 , H01L23/36 , H01L23/3675 , H01L23/50 , H01L2924/0002 , H01L2924/00
摘要： A microelectronic package includes a substrate (110), a die (120) electrically connected to the substrate, and a heat dissipation device (130) coupled to the die. The heat dissipation device includes a capacitor (250, 310). In one embodiment the heat dissipation device is a microchannel having a base (131) and a cover plate (132, 300) over the base, and the capacitor is located within the cover plate.
摘要翻译：微电子封装包括基板（110），与基板电连接的管芯（120）以及耦合到管芯的散热器件（130）。散热装置包括电容器（250,310）。在一个实施例中，散热装置是具有在基座上方的基座（131）和盖板（132,300）的微通道，并且电容器位于盖板内。

53. 发明申请

US20070284730A1 METHOD, APPARATUS, AND SYSTEM FOR THIN DIE THIN THERMAL INTERFACE MATERIAL IN INTEGRATED CIRCUIT PACKAGES 审中-公开
标题翻译：集成电路封装薄膜热绝缘材料的方法，装置和系统
公开(公告)号：US20070284730A1
公开(公告)日：2007-12-13
申请号：US11423551
申请日：2006-06-12
申请人： Wei Shi , Daoqiang Lu , Edward A. Zarbock
发明人： Wei Shi , Daoqiang Lu , Edward A. Zarbock
IPC分类号： H02K9/20
CPC分类号： H01L21/50 , H01L23/3735 , H01L23/3736 , H01L2224/16225 , H01L2224/73253 , Y10T29/49144
摘要： Some embodiments of the invention include a thermal interface between a heat spreader and a die. The thermal interface may include a main layer of a single material or a combination of multiple materials. The thermal interface may include one or more additional layers covering one or more surfaces of the main layer. The thermal interface may be bonded to the die and the heat spreader at a low temperature, with flux or without flux. Other embodiments are described and claimed.
摘要翻译：本发明的一些实施例包括散热器和模具之间的热界面。热界面可以包括单一材料的主层或多种材料的组合。热界面可以包括覆盖主层的一个或多个表面的一个或多个附加层。热界面可以在低温下与焊剂和散热器结合，焊剂或无焊剂。描述和要求保护其他实施例。

54. 发明授权

US07288438B2 Solder deposition on wafer backside for thin-die thermal interface material 有权
标题翻译：用于薄模热界面材料的晶片背面上的焊料沉积
公开(公告)号：US07288438B2
公开(公告)日：2007-10-30
申请号：US11116554
申请日：2005-04-28
申请人： Daoqiang Lu
发明人： Daoqiang Lu
IPC分类号： H01L21/00
CPC分类号： H01L21/4871 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/31 , H01L24/75 , H01L24/83 , H01L2221/68327 , H01L2224/0401 , H01L2224/04026 , H01L2224/16 , H01L2224/274 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/73253 , H01L2224/83193 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/16152 , H01L2924/19043 , H01L2924/01047 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： A solder is deposited on the backside of a wafer. The wafer can be pre-deposited with a barrier layer such as a titanium base and other materials. Deposition is carried out by electroplating, electroless plating, chemical vapor deposition, and physical vapor deposition. The solder-deposited die is bonded with a heat spreader that did not require a pre-deposited solder.
摘要翻译：焊料沉积在晶片的背面。晶片可以预先沉积有阻挡层，例如钛基和其它材料。通过电镀，化学镀，化学气相沉积和物理气相沉积进行沉积。焊料沉积的模具与不需要预沉积焊料的散热器结合。

55. 发明授权

US07279720B2 Large bumps for optical flip chips 有权
标题翻译：光学倒装芯片的大块
公开(公告)号：US07279720B2
公开(公告)日：2007-10-09
申请号：US10864188
申请日：2004-06-08
申请人： Ming Fang , Valery Dubin , Daoqiang Lu
发明人： Ming Fang , Valery Dubin , Daoqiang Lu
IPC分类号： H01L33/00
CPC分类号： H01L24/16 , G02B6/4204 , G02B6/4232 , H01L24/11 , H01L24/81 , H01L2224/1134 , H01L2224/1147 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04941 , H01L2924/14 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/00015 , H01L2224/29099
摘要： The invention provides bumps between a die and a substrate with a height greater than or equal to a height of a waveguide between the die and the substrate. The bumps may be formed on a die prior to that die being singulated from a wafer.
摘要翻译：本发明提供了一种具有高于或等于管芯和衬底之间的波导高度的管芯和衬底之间的凸起。在从芯片被切割成晶片之前，可以在模具上形成凸块。

56. 发明授权

US07279359B2 High performance amine based no-flow underfill materials for flip chip applications 有权
标题翻译：用于倒装芯片应用的高性能胺基无流动底层填充材料
公开(公告)号：US07279359B2
公开(公告)日：2007-10-09
申请号：US10949995
申请日：2004-09-23
申请人： Tian-An Chen , Daoqiang Lu
发明人： Tian-An Chen , Daoqiang Lu
IPC分类号： H01L21/44
CPC分类号： H01L24/27 , H01L21/563 , H01L24/29 , H01L2224/13111 , H01L2224/13116 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/14 , H01L2924/19041 , H01L2924/01083 , H01L2924/0665 , H01L2924/00 , H01L2224/0401
摘要： Amine-based no-flow underfill materials and a method to produce flip-chip devices electrically bonded to a substrate are described. The no-flow underfill material includes an amine-based curing agent and a fluxing agent, which activates at a fluxing temperature and is neutral at the temperatures lower than the fluxing temperature. The fluxing agent of the no-flow underfill material heated to the activation temperature generates a reactive acid in-situ during chip attachment process to facilitate joint formation. The no-flow underfill material is formed on the substrate. A chip is placed on the no-flow underfill material formed on the substrate. A temperature is increased to activate the fluxing agent. The temperature is further increased to form conductive joints between the chip and the substrate. Further, the no-flow underfill material is cured. The conductive joints between the chip and the substrate may be lead-free.
摘要翻译：描述了基于胺的无流动底部填充材料和制造电连接到基底的倒装芯片器件的方法。无流动的底部填充材料包括胺基固化剂和助熔剂，其在助熔温度下活化并在低于助熔温度的温度下为中性。加热到活化温度的无流动底部填充材料的助熔剂在芯片附着过程期间原位产生反应性酸以促进接头形成。在底物上形成无流动的底部填充材料。将芯片放置在形成在基板上的无流动底部填充材料上。增加温度以激活助熔剂。进一步增加温度以在芯片和衬底之间形成导电接头。此外，固化了无流动的底部填充材料。芯片和衬底之间的导电接头可以是无铅的。

57. 发明申请

US20070228112A1 Method and arrangement for forming a microelectronic package 审中-公开
标题翻译：用于形成微电子封装的方法和装置
公开(公告)号：US20070228112A1
公开(公告)日：2007-10-04
申请号：US11394928
申请日：2006-03-31
申请人： Wei Shi , Thomas Fitzgerald , Steve Mayer , Carl Deppisch , Daoqiang Lu
发明人： Wei Shi , Thomas Fitzgerald , Steve Mayer , Carl Deppisch , Daoqiang Lu
IPC分类号： B23K31/02
CPC分类号： B23K1/0016 , H01L21/6835 , H01L23/3675 , H01L24/27 , H01L24/743 , H01L24/83 , H01L2224/27334 , H01L2224/29109 , H01L2224/73253 , H01L2224/7565 , H01L2224/83011 , H01L2224/83101 , H01L2224/83191 , H01L2224/83801 , H01L2924/0001 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01049 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/16152 , H05K3/3478 , H05K2203/0338 , H05K2203/0415 , H01L2924/01047 , H01L2924/0105 , H01L2924/00015 , H01L2224/29099 , H01L2224/83205
摘要： A method of forming a microelectronic package, and an arrangement to attach a solder preform onto a microelectronic die in order to form the package. The method comprises: providing a reinforced solder preform including a solder preform and a backing layer attached to a backside of the solder preform; placing the reinforced solder preform on a surface of a first microelectronic component adapted to be soldered; attaching the solder preform to the surface of the first microelectronic component after placing the reinforced solder preform; removing the backing layer from the solder preform after placing the reinforced solder preform; placing a second microelectronic component to be soldered onto the solder preform after removing the backing layer; and soldering the second microelectronic component to the first microelectronic component to form the package.
摘要翻译：一种形成微电子封装的方法，以及将焊料预制件附着到微电子管芯上以形成封装的装置。该方法包括：提供加强的焊料预制件，其包括焊料预制件和附接到焊料预制件的背面的背衬层; 将加强的焊料预制件放置在适于被焊接的第一微电子部件的表面上; 在放置加强的焊料预制件之后，将焊料预制件附接到第一微电子部件的表面; 在放置加强焊料预制件之后从焊料预制件上去除背衬层; 在移除背衬层之后放置要焊接到焊料预制件上的第二微电子部件; 以及将所述第二微电子部件焊接到所述第一微电子部件以形成所述封装。

58. 发明申请

US20070155198A1 Substrate with raised edge pads 有权
标题翻译：基片与凸起的边缘垫
公开(公告)号：US20070155198A1
公开(公告)日：2007-07-05
申请号：US11315854
申请日：2005-12-22
申请人： Wei Shi , Daoqiang Lu , Qing Zhou , Jiangqi He
发明人： Wei Shi , Daoqiang Lu , Qing Zhou , Jiangqi He
IPC分类号： H01R12/00
CPC分类号： H05K7/1061 , Y10T29/49117
摘要： A separable electrical connection may be provided with a landside pad on one of two electrical components to be joined. The landside pad may be made up of two parts, including a flat portion and a raised edge formed on the flat portion. In some embodiments, the raised edge may have a closed geometric shape. Then, a socket contact engaging the junction between the flat portion and the raised edge is prevented from sliding off of the landside pad by the raised edge. In addition, dual areas of electrical connection can be established between both the flat portion and raised edge of the landside pad and the correspondingly shaped pair of portions on the socket. This increases the electrical efficiency of the connection and its security.
摘要翻译：可分离的电连接可以在待连接的两个电气部件之一上设置有陆侧焊盘。侧面垫可以由两部分组成，包括平坦部分和形成在平坦部分上的凸起边缘。在一些实施例中，凸起边缘可以具有闭合的几何形状。然后，通过凸起边缘防止接合平坦部分和凸起边缘之间的连接处的插座触点从边缘垫片滑出。此外，可以在陆侧衬垫的平坦部分和凸起边缘以及插座上的相应形状的一对部分之间建立双重电连接区域。这增加了连接的电效率及其安全性。

59. 发明申请

US20070152321A1 Fluxless heat spreader bonding with cold form solder 审中-公开
标题翻译：无焊散热器与冷成型焊料接合
公开(公告)号：US20070152321A1
公开(公告)日：2007-07-05
申请号：US11323904
申请日：2005-12-29
申请人： Wei Shi , Daoqiang Lu , Qing Zhou , Jiangqi He
发明人： Wei Shi , Daoqiang Lu , Qing Zhou , Jiangqi He
IPC分类号： H01L23/12 , H01L21/50
CPC分类号： H01L21/4871 , H01L25/0655 , H01L2224/16 , H01L2224/73253 , H01L2924/01079 , H01L2924/01327 , H01L2924/16152 , H01L2924/00
摘要： The formation of electronic assemblies including a heat spreader coupled to at least one die is described. One embodiment relates to a method including positioning a solder on a heat spreader. The method also includes forming a solid state diffusion bond between the solder and the heat spreader. The solid state diffusion bonded solder and heat spreader are positioned on a die and heated to a temperature sufficient to melt the solder and form a bond between the solder and the die, in the absence of a flux. Other embodiments are described and claimed.
摘要翻译：描述了包括耦合到至少一个管芯的散热器的电子组件的形成。一个实施例涉及一种包括将焊料定位在散热器上的方法。该方法还包括在焊料和散热器之间形成固态扩散接合。固态扩散焊接和散热器位于模具上并加热至足以熔化焊料的温度，并在不存在焊剂的情况下在焊料和管芯之间形成结合。描述和要求保护其他实施例。

60. 发明申请

US20070138647A1 Integrated circuit package to provide high-bandwidth communication among multiple dice 有权
标题翻译：集成电路封装，提供多个骰子之间的高带宽通信
公开(公告)号：US20070138647A1
公开(公告)日：2007-06-21
申请号：US11314459
申请日：2005-12-21
申请人： Qing Zhou , Wei Shi , Jiangqi He , Daoqiang Lu
发明人： Qing Zhou , Wei Shi , Jiangqi He , Daoqiang Lu
IPC分类号： H01L23/52
CPC分类号： H01L25/0652 , H01L25/18 , H01L2224/16 , H01L2924/15311 , H01L2924/15312
摘要： A system may include a microprocessor die, an integrated circuit package substrate, and a die disposed between the microprocessor die and the integrated circuit package substrate. In some embodiments, the integrated circuit package substrate defines a first cavity, and the die is disposed at least partially within the first cavity.
摘要翻译：系统可以包括微处理器管芯，集成电路封装衬底和设置在微处理器管芯和集成电路封装衬底之间的管芯。在一些实施例中，集成电路封装衬底限定第一空腔，并且裸片至少部分地设置在第一空腔内。

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