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    • 55. 发明授权
    • LED-based lighting fixtures for surface illumination with improved heat dissipation and manufacturability
    • 基于LED的照明灯具,用于表面照明,具有改进的散热和可制造性
    • US07878683B2
    • 2011-02-01
    • US12114062
    • 2008-05-02
    • Derek LoganColin Piepgras
    • Derek LoganColin Piepgras
    • F21S4/00F21V21/00
    • F21V5/00F21S4/28F21S8/036F21V3/02F21V5/002F21V7/0091F21V15/01F21V15/013F21V15/04F21V17/12F21V21/005F21V29/507F21Y2103/10F21Y2115/10H05B33/0803H05B33/0815Y10S362/80
    • LED-based lighting apparatus and assembly methods in which mechanical and/or thermal coupling between respective components is accomplished via a transfer of force from one component to another. In one example, a multiple-LED assembly is disposed in thermal communication with a heat sink that forms part of a housing. A primary optical element situated within a pressure-transfer member is disposed above and optically aligned with each LED. A shared secondary optical facility forming another part of the housing is disposed above and compressively coupled to the pressure-transfer members. A force exerted by the second optical facility is transferred via the pressure-transfer members so as to press the LED assembly toward the heat sink, thereby facilitating heat transfer. In one aspect, the LED assembly is secured in the housing without the need for adhesives. In another aspect, the secondary optical facility does not directly exert pressure onto any primary optical element, thereby reducing optical misalignment.
    • 基于LED的照明装置和组装方法,其中各部件之间的机械和/或热耦合通过力从一个部件传递到另一个部件来实现。 在一个示例中,多LED组件设置成与形成壳体一部分的散热器热连通。 位于压力传递构件内的主要光学元件设置在每个LED的上方并与之对准。 形成壳体的另一部分的共用次级光学设备设置在压力传递构件的上方并压缩耦合。 由第二光学设备施加的力经由压力传递构件传递,以将LED组件朝向散热器按压,从而便于热传递。 在一个方面,LED组件固定在壳体中,而不需要粘合剂。 另一方面,第二光学设备不直接施加压力到任何主要光学元件上,从而减少光学偏移。