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51. 发明申请

US20080251281A1 ELECTRICAL INTERCONNECT STRUCTURE AND METHOD 有权
标题翻译：电气互连结构与方法
公开(公告)号：US20080251281A1
公开(公告)日：2008-10-16
申请号：US11733840
申请日：2007-04-11
申请人： Stephen Leslie Buchwalter , Bruce K. Furman , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih
发明人： Stephen Leslie Buchwalter , Bruce K. Furman , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih
IPC分类号： H05K1/03 , H01K3/10
CPC分类号： H01L24/16 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/27 , H01L24/28 , H01L24/31 , H01L24/73 , H01L24/81 , H01L24/94 , H01L2221/68377 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/1131 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/11822 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/136 , H01L2224/16 , H01L2224/16225 , H01L2224/17051 , H01L2224/274 , H01L2224/29111 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/3436 , H05K2201/0379 , H05K2201/094 , H05K2201/10234 , H05K2201/10242 , H05K2201/10977 , Y02P70/613 , Y10T29/49165 , H01L2224/45111 , H01L2924/01047 , H01L2224/13099 , H01L2924/01083 , H01L2924/00 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.
摘要翻译：一种电气结构和成型方法。电结构包括第一衬底，其包括第一导电焊盘，第二衬底，其包括第二导电焊盘，以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

52. 发明授权

US09579738B2 Flux composition and techniques for use thereof 有权
标题翻译：助焊剂组合物及其使用技术
公开(公告)号：US09579738B2
公开(公告)日：2017-02-28
申请号：US13034932
申请日：2011-02-25
申请人： Kang-Wook Lee , Jae-Woong Nah , Nathalie Normand , Valerie Oberson
发明人： Kang-Wook Lee , Jae-Woong Nah , Nathalie Normand , Valerie Oberson
IPC分类号： B23K1/00 , B23K35/36 , B23K35/362
CPC分类号： B23K1/0016 , B23K35/3601 , B23K35/362
摘要： The present invention is directed to flux compositions. One composition comprises an activator, a medium-viscosity solvent being a polymer, and a high-viscosity solvent being a copolymer containing first monomers and second monomers. Another composition comprises an activator, and a high-viscosity solvent comprising a copolymer containing first monomers and second monomers. Another composition comprises an activator of 6-12 percent by weight of glutaric acid, pimelic acid, tartaric acid, or mixtures thereof, and a medium-viscosity solvent of 88-94 percent by weight comprising a polymer with hydroxyl end groups. Another composition comprises an activator in a liquid state comprising poly(ethylene glycol)-diacid, and a medium-viscosity solvent comprising a polymer with hydroxyl end groups.
摘要翻译：本发明涉及助焊剂组合物。一种组合物包含活化剂，中等粘度溶剂为聚合物，高粘度溶剂为包含第一单体和第二单体的共聚物。另一组合物包含活化剂和包含含有第一单体和第二单体的共聚物的高粘度溶剂。另一组合物包含6-12重量％的戊二酸，庚二酸，酒石酸或其混合物的活化剂和88-94重量％的中等粘度溶剂，其包含具有羟基端基的聚合物。另一种组合物包含液态的活化剂，其包含聚（乙二醇） - 二酸，以及包含具有羟基端基的聚合物的中等粘度溶剂。

53. 发明授权

US08921221B2 IMS (injection molded solder) with two resist layers forming solder bumps on substrates 有权
标题翻译： IMS（注塑焊料），其中两个抗蚀剂层在基底上形成焊料凸块
公开(公告)号：US08921221B2
公开(公告)日：2014-12-30
申请号：US13164728
申请日：2011-06-20
申请人： Mark H. McLeod , Jae-Woong Nah
发明人： Mark H. McLeod , Jae-Woong Nah
IPC分类号： H01L21/44 , B23K1/20 , B23K3/06 , H01L23/485
CPC分类号： B23K1/20 , B23K3/0638 , H01L2224/11
摘要： A photoresist layer is applied over a solder resist layer on a substrate such as a wafer. Openings in the solder resist and photoresist layers are filled with flux-free molten solder using IMS. The process is applicable to fine pitch applications and chip size packaging substrates. A protection layer may be employed to facilitate removal of the photoresist layer from the substrate. An oversized substrate including an adhesive layer on a peripheral area may be employed for providing greater adhesion of a dry film layer to the peripheral area of the substrate than the central portion thereof. The peripheral area is removed following IMS.
摘要翻译：将抗蚀剂层施加在诸如晶片的衬底上的阻焊层上。使用IMS将阻焊剂和光致抗蚀剂层中的开口填充无助熔融熔融焊料。该方法适用于细间距应用和芯片尺寸封装基板。可以使用保护层以便于从基板去除光致抗蚀剂层。可以使用包括在周边区域上的粘合剂层的尺寸过大的基材，以提供比其中心部分更大的干膜层对基材周边区域的附着力。在IMS之后删除外围区域。

54. 发明授权

US08669137B2 Copper post solder bumps on substrate 有权
标题翻译：铜柱焊锡凸块在基板上
公开(公告)号：US08669137B2
公开(公告)日：2014-03-11
申请号：US13078807
申请日：2011-04-01
申请人： Jae-Woong Nah , Da-Yuan Shih
发明人： Jae-Woong Nah , Da-Yuan Shih
IPC分类号： H01L21/56
CPC分类号： H01L24/81 , H01L21/4853 , H01L21/563 , H01L23/49816 , H01L23/562 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/11312 , H01L2224/1132 , H01L2224/1134 , H01L2224/11462 , H01L2224/13022 , H01L2224/13076 , H01L2224/131 , H01L2224/13147 , H01L2224/1403 , H01L2224/14051 , H01L2224/14131 , H01L2224/14135 , H01L2224/1601 , H01L2224/16225 , H01L2224/16227 , H01L2224/45124 , H01L2224/73104 , H01L2224/73204 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/9211 , H01L2924/00013 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/15747 , H01L2924/181 , H01L2924/3841 , H01L2924/00012 , H01L2224/81 , H01L2224/83 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/3512 , H01L2924/00 , H01L2224/48
摘要： A method comprises forming semiconductor flip chip interconnects where the flip chip comprises a wafer and a substrate having electrical connecting pads and electrically conductive posts operatively associated with the pads and extending away from the pads to terminate in distal ends. Solder bumping the distal ends by injection molding solder onto the distal ends produces a solder bumped substrate. Another embodiment comprises providing the substrate having the posts on the pads with a mask having a plurality of through hole reservoirs and aligning the reservoirs in the mask to be substantially concentric with the distal ends. This is followed by injecting liquid solder into the reservoirs to provide a volume of liquid solder on the distal ends, cooling the liquid solder in the reservoirs to solidify the solder, removing the mask to expose the solidified solder after the cooling and thereby provide a solder bumped substrate. This is followed by positioning the solder bumped substrate on a wafer in a manner that leaves a gap between the wafer and the substrate. The wafer has electrically conductive sites on the surface for soldering to the posts. Abutting the sites and the solder bumped posts followed by heating the solder to its liquidus temperature joins the wafer and substrate, after which, the gap is optionally filled with a material comprising an underfill.
摘要翻译：一种方法包括形成半导体倒装芯片互连，其中倒装芯片包括晶片和具有电连接焊盘的基板和与焊盘可操作地相关联的导电柱，并且远离焊盘延伸以终止于远端。通过将焊料注射到远端上来焊接远端的焊料产生焊料凸起的衬底。另一个实施例包括在衬垫上设置具有多个通孔储存器的掩模的衬垫，并将掩模中的储存器与远端基本上同心对准。然后将液体焊料注入储存器中以在远端提供一定量的液体焊料，冷却储存器中的液体焊料以固化焊料，除去掩模以在冷却之后露出固化的焊料，从而提供焊料碰撞底物。接着将焊料凸起的衬底以晶片和衬底之间留下间隙的方式定位在晶片上。晶片在表面上具有用于焊接到柱的导电位置。将焊点和焊料凸起柱接合，然后将焊料加热至液相线温度，从而连接晶片和衬底，此后，间隙可选地填充有包括底部填充材料的材料。

55. 发明授权

US08651359B2 Flip chip bonder head for forming a uniform fillet 失效
标题翻译：翻转芯片焊接头用于形成均匀的圆角
公开(公告)号：US08651359B2
公开(公告)日：2014-02-18
申请号：US12861017
申请日：2010-08-23
申请人： Michael A. Gaynes , Jae-Woong Nah
发明人： Michael A. Gaynes , Jae-Woong Nah
IPC分类号： B23K1/00
CPC分类号： B23K1/0016 , B23K3/047 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/48227 , H01L2224/73104 , H01L2224/73204 , H01L2224/75252 , H01L2224/75303 , H01L2224/75315 , H01L2224/75745 , H01L2224/81815 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/9211 , H01L2225/06513 , H01L2225/06568 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/1203 , H01L2924/1305 , H01L2924/1306 , H01L2924/15787 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/3512
摘要： A low thermal conductivity material layer covers a peripheral portion of the bottom surface of the conductive plate of a chip bonder head. The center portion of the conductive plate is exposed or covered with another conductive plate laterally surrounded by the low thermal conductivity material layer. During bonding, the chip bonder head holds a first substrate upside down and heats the first substrate through the conductive plate. Heating of a fillet, i.e., the laterally extruding portion, of a pre-applied underfill material is reduced because the temperature at the exposed surfaces of the low thermal conductivity material layer is lower than the temperature at the bottom surface of the conductive plate. The longer curing time and the more uniform shape of the fillet in the bonded structure enhance the structural reliability of the bonded substrates.
摘要翻译：低导热性材料层覆盖芯片接合头的导电板的底面的周边部分。导电板的中心部分被另一导电板暴露或覆盖，导电板横向被低导热材料层包围。在接合期间，芯片接合头将第一衬底倒置并且通过导电板加热第一衬底。由于低导热材料层的暴露表面的温度低于导电板的底表面处的温度，加热了预先施加的底部填充材料的圆角，即侧向挤压部分。接合结构中固化时间越长，圆角形状越均匀，提高了粘合基材的结构可靠性。

56. 发明申请

US20140013606A1 UNDERFILL MATERIAL DISPENSING FOR STACKED SEMICONDUCTOR CHIPS 有权
标题翻译：堆叠半导体芯片的材料分配
公开(公告)号：US20140013606A1
公开(公告)日：2014-01-16
申请号：US13567567
申请日：2012-08-06
申请人： Jae-Woong Nah , Katsuyuki Sakuma , Bucknell C. Webb
发明人： Jae-Woong Nah , Katsuyuki Sakuma , Bucknell C. Webb
IPC分类号： B43L7/00
CPC分类号： H01L21/50 , H01L21/561 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06582 , H01L2224/32145 , H01L2924/00012 , H01L2224/32225 , H01L2224/81 , H01L2924/014
摘要： A template having tapered openings can be employed to enable injection of underfill material through gaps having a width less than a lateral dimension of an injector needle for the underfill material. Each tapered opening has a first lateral dimension on an upper side and a second lateral dimension on a lower side. Compliant material portions can be employed to accommodate variations in distance between the template and stacked semiconductor chips and/or an injector head. Optionally, another head can be employed to apply compressed gas to push out the underfill material after the underfill material is applied to the gaps. Multiple injector heads can be employed to simultaneously inject the underfill material at different sites. An adhesive layer can be substituted for the at least one lower compliant material portion.
摘要翻译：可以使用具有锥形开口的模板，以使得能够通过具有小于底部填充材料的注射器针的横向尺寸的间隙的间隙注入底部填充材料。每个锥形开口具有在上侧上的第一横向尺寸和在下侧上的第二横向尺寸。可以采用符合材料的部分来适应模板和堆叠的半导体芯片和/或注射器头之间的距离的变化。可选地，在将底部填充材料施加到间隙之后，可以使用另一个头部来施加压缩气体以推出底部填充材料。可以使用多个注射器头来同时将底部填充材料注入不同的位置。粘合剂层可以代替至少一个下顺应材料部分。

57. 发明授权

US08541299B2 Electrical interconnect forming method 有权
标题翻译：电互连成型方法
公开(公告)号：US08541299B2
公开(公告)日：2013-09-24
申请号：US12787527
申请日：2010-05-26
申请人： Stephen Leslie Buchwalter , Bruce K. Furman , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih
发明人： Stephen Leslie Buchwalter , Bruce K. Furman , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih
IPC分类号： H01L21/44 , H01L21/48
CPC分类号： H01L24/16 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/27 , H01L24/28 , H01L24/31 , H01L24/73 , H01L24/81 , H01L24/94 , H01L2221/68377 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/1131 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/11822 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/136 , H01L2224/16 , H01L2224/16225 , H01L2224/17051 , H01L2224/274 , H01L2224/29111 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/3436 , H05K2201/0379 , H05K2201/094 , H05K2201/10234 , H05K2201/10242 , H05K2201/10977 , Y02P70/613 , Y10T29/49165 , H01L2224/45111 , H01L2924/01047 , H01L2224/13099 , H01L2924/01083 , H01L2924/00 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.
摘要翻译：电互连形成方法。电互连包括包括第一导电焊盘的第一衬底，包括第二导电焊盘的第二衬底以及将第一导电焊盘电连接和机械地连接到第二导电焊盘的互连结构。互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

58. 发明申请

US20120318338A1 NANOWIRES FORMED BY EMPLOYING SOLDER NANODOTS 审中-公开
公开(公告)号：US20120318338A1
公开(公告)日：2012-12-20
申请号：US13599577
申请日：2012-08-30
申请人： Keith E. Fogel , Jeehwan Kim , Jae-Woong Nah , Devendra K. Sadana , Kuen-Ting Shiu
发明人： Keith E. Fogel , Jeehwan Kim , Jae-Woong Nah , Devendra K. Sadana , Kuen-Ting Shiu
IPC分类号： H01L31/0236 , H01L31/076 , H01L31/075
CPC分类号： H01L31/1804 , H01L31/022425 , H01L31/02363 , H01L31/02366 , H01L31/0352 , H01L31/035227 , Y02E10/50
摘要： A photovoltaic device and method include depositing a metal film on a substrate layer. The metal film is annealed to form islands of the metal film on the substrate layer. The substrate layer is etched using the islands as an etch mask to form pillars in the substrate layer.

59. 发明申请

US20120273155A1 SPHERICAL SOLDER REFLOW METHOD 失效
标题翻译：球形反射法
公开(公告)号：US20120273155A1
公开(公告)日：2012-11-01
申请号：US13438505
申请日：2012-04-03
申请人： Peter A. Gruber , Jae-Woong Nah
发明人： Peter A. Gruber , Jae-Woong Nah
IPC分类号： B22D25/02
CPC分类号： H01L24/11 , H01L24/13 , H01L2224/11003 , H01L2224/1111 , H01L2224/13111 , H01L2224/13116 , H01L2924/01322 , H01L2924/14 , H01L2924/3841 , H05K3/3478 , H05K2203/041 , H01L2924/01082 , H01L2924/01029 , H01L2924/01047 , H01L2924/01083 , H01L2924/0105 , H01L2924/00
摘要： The present disclosure relates to methods of making solder balls having a uniform size. More particularly, the disclosure relates to improved solder ball formation processes that prevent or reduce bridging/merging of two or more solder balls during reflow. The processes of the instant disclosure are desirable because they do not require a sifting step to obtain uniformly-sized solder balls.
摘要翻译：本公开涉及制造具有均匀尺寸的焊球的方法。更具体地说，本公开涉及改进的焊球形成过程，其防止或减少回流期间两个或更多个焊球的桥接/合并。本公开的方法是期望的，因为它们不需要筛选步骤来获得均匀尺寸的焊球。

60. 发明申请

US20120217289A1 Flux Composition and Techniques for Use Thereof 有权
标题翻译：助焊剂组合物及其使用技术
公开(公告)号：US20120217289A1
公开(公告)日：2012-08-30
申请号：US13034932
申请日：2011-02-25
申请人： Kang-Wook Lee , Jae-Woong Nah , Nathalie Normand , Valerie Oberson
发明人： Kang-Wook Lee , Jae-Woong Nah , Nathalie Normand , Valerie Oberson
IPC分类号： B23K35/363 , B23K1/20
CPC分类号： B23K1/0016 , B23K35/3601 , B23K35/362
摘要： The present invention is directed to flux compositions and uses thereof. One composition comprises an activator, a medium-viscosity solvent being a polymer, and a high-viscosity solvent being a copolymer containing first monomers and second monomers. Another composition comprises an activator, and a high-viscosity solvent comprising a copolymer containing first monomers and second monomers. Another composition comprises an activator of 6-12 percent by weight of glutaric acid, pimelic acid, tartaric acid, or mixtures thereof, and a medium-viscosity solvent of 88-94 percent by weight comprising a polymer with hydroxyl end groups. Another composition comprises an activator in a liquid state comprising poly(ethylene glycol)-diacid, and a medium-viscosity solvent comprising a polymer with hydroxyl end groups. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.
摘要翻译：本发明涉及助焊剂组合物及其用途。一种组合物包含活化剂，中等粘度溶剂为聚合物，高粘度溶剂为包含第一单体和第二单体的共聚物。另一组合物包含活化剂和包含含有第一单体和第二单体的共聚物的高粘度溶剂。另一组合物包含6-12重量％的戊二酸，庚二酸，酒石酸或其混合物的活化剂和88-94重量％的中等粘度溶剂，其包含具有羟基端基的聚合物。另一种组合物包含液态的活化剂，其包含聚（乙二醇） - 二酸，以及包含具有羟基端基的聚合物的中等粘度溶剂。还提供了一种用于接合物体的焊接方法，包括以下步骤：将焊剂组合物施加到一个或多个物体的至少一部分，并且连接物体。

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