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    • 60. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
    • 半导体器件及其制造方法
    • US20130126972A1
    • 2013-05-23
    • US13304086
    • 2011-11-23
    • Chang-Tzu WangMei-Ling ChaoChien-Ting Lin
    • Chang-Tzu WangMei-Ling ChaoChien-Ting Lin
    • H01L27/12H01L21/336
    • H01L29/66795H01L21/26513H01L21/823821H01L27/0924
    • A semiconductor device and a fabricating method thereof are provided. The semiconductor device includes a substrate of a first conductivity type, a fin, a gate, source and drain regions of a second conductivity type, and a first doped region of the second conductivity type. A plurality of isolation structures is formed on the substrate. The fin is disposed on the substrate between two adjacent isolation structures. The gate is disposed on the isolation structures and covers a portion of the fin, wherein the portion of the fin covered by the gate is of the first conductivity type. The source and drain regions is configured in the fin at respective sides of the gate. The first doped region is configured in the fin underlying the source and drain regions and adjoining the substrate. The first doped region has an impurity concentration lower than that of the source and drain regions.
    • 提供了一种半导体器件及其制造方法。 半导体器件包括具有第二导电类型的第一导电类型,鳍状物,栅极,源极和漏极区域以及第二导电类型的第一掺杂区域的衬底。 在基板上形成多个隔离结构。 翅片设置在两个相邻隔离结构之间的基板上。 栅极设置在隔离结构上并覆盖翅片的一部分,其中由栅极覆盖的鳍的部分是第一导电类型。 源极和漏极区域在栅极的相应侧配置在鳍片中。 第一掺杂区域配置在源极和漏极区域下方的鳍片中,并与衬底相邻。 第一掺杂区的杂质浓度低于源区和漏区。