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    • 52. 发明授权
    • Full width array scanning spectrophotometer
    • 全宽阵列扫描分光光度计
    • US06975949B2
    • 2005-12-13
    • US10833231
    • 2004-04-27
    • Lalit K. MesthaJagdish C. TandonSteven B. Bolte
    • Lalit K. MesthaJagdish C. TandonSteven B. Bolte
    • G01J3/10G01J3/50G01R23/16G01J3/51G01N21/25G03B27/00
    • G01J3/50G01J3/501G01N21/255G01N2201/0627
    • A full width array spectrophotometer for full width scanning color analysis of color test targets, with one or two substantially linear elongated arrays of closely spaced multiple LED illumination sources of plural different color emissions in a multiply repeated pattern of at least three or four different colors transversely spanning a printer paper path and sequentially illuminated to illuminate a transverse band across a printed sheet moving in the paper path, and a corresponding elongated low cost light imaging bar with a parallel and correspondingly elongated array of multiple closely spaced different color sensitive (three or four rows of color-filtered) photodetectors, which imaging bar is positioned to detect and analyze light reflected from the transverse sequentially illuminated band.
    • 全宽阵列分光光度计,用于彩色测试目标的全宽度扫描颜色分析,具有一个或两个基本上线性的细长阵列,其具有多个不同颜色的多个LED照明源,具有至少三个或四个不同颜色的多重重复图案横向 跨越打印机纸路径并顺序照亮以照射在纸路径中移动的印刷片材上的横向带,以及相应的细长的低成本光成像条,其具有多个紧密间隔的不同颜色敏感(三或四个)的平行和相应细长的阵列 行彩色滤波的)光电检测器,其成像条被定位成检测和分析从横向顺序照射的带反射的光。
    • 53. 发明授权
    • Raster input scanner with short and long integration periods
    • 光栅输入扫描仪具有短和长的积分期
    • US5416611A
    • 1995-05-16
    • US260664
    • 1994-06-16
    • Jagdish C. Tandon
    • Jagdish C. Tandon
    • H04N1/19H04N1/40H04N5/235H04N1/04
    • H04N1/40056H04N5/2353
    • In a raster input scanner, an original image is converted into digital image data. A scanning bar having at least one array of photosites is moved relative to the original image, whereby the photosites are sequentially exposed to light within a range of intensities reflected from locations on the original image. Each of the image signals from the photosites is integrated as the scanning bar moves relative to the original image, some signals being integrated for a first duration to yield a long-integration image datum, and some signals being integrated for a second duration shorter than the first duration to yield a short-integration image datum. One of the long-integration image datum and the short-integration datum is selected for each location in the original image, depending on the intensity of light associated with the location in the original image.
    • 在光栅输入扫描器中,将原始图像转换成数字图像数据。 具有至少一个光电阵列的扫描条相对于原始图像移动,由此在从原始图像上的位置反射的强度范围内,依次曝光光。 当扫描条相对于原始图像移动时,来自光斑的每个图像信号被集成,一些信号被集成在第一持续时间以产生长积分图像数据,并且一些信号被集成在比第二持续时间短 第一个持续时间以产生短积分图像基准。 根据与原始图像中的位置相关联的光的强度,为原始图像中的每个位置选择长积分图像基准和短积分基准之一。
    • 55. 发明授权
    • Replaceable image sensor array
    • 可更换图像传感器阵列
    • US4860075A
    • 1989-08-22
    • US295175
    • 1989-01-01
    • Mehdi N. AraghiJagdish C. Tandon
    • Mehdi N. AraghiJagdish C. Tandon
    • H01L21/306H01L27/144H01L27/146
    • H01L21/30608H01L27/1446H01L27/146
    • An image sensor array and method of fabrication which facilitates replacement of a defective one in a series of arrays butted together to form a longer scanning array in which a (110) silicon wafer having a row of photosites has separation lines etched thereon by orientation dependent etching along the (111) planes, with the separation lines for the opposite ends of the array each consisting of first and second partial boundary lines longitudinally offset from one another connected by a third boundary line so that the ends of the array have a has a generally L-shaped offset permitting bi-directional separating and aligned inserting movement when replacing a defective array.In a second embodiment, the arrays are formed on (100) silicon with alternating `nail` head and `mesa` head shapes to facilitate removal and replacement of a defective array.
    • 一种图像传感器阵列和制造方法,其有助于将一系列阵列中的有缺陷的阵列对接在一起以形成更长的扫描阵列,其中具有一排光泽的(110)硅晶片具有通过取向相关蚀刻在其上蚀刻的分离线 沿着(111)平面,阵列的相对端的分隔线每一个由第一和第二部分边界线组成,第一和第二部分边界线彼此纵向彼此相互连接,由第三边界线连接,使得阵列的端部具有通常 L形偏移允许在更换有缺陷的阵列时双向分离和对准插入运动。 在第二实施例中,阵列形成在具有交替“钉头”和“台面”头形状的(100)硅上,以便于去除和更换缺陷阵列。
    • 58. 发明授权
    • Image sensor array for assembly with like arrays to form a longer array
    • 图像传感器阵列,用于组装类似阵列以形成更长的阵列
    • US4695716A
    • 1987-09-22
    • US923516
    • 1986-10-27
    • Jagdish C. TandonMehdi N. Araghi
    • Jagdish C. TandonMehdi N. Araghi
    • H01L21/306H01L21/78H01L27/144H01L25/04
    • H01L27/1446H01L21/30608H01L21/78
    • Apparatus and method of fabricating a sensor array from a (110) silicon substrate having a row of photosites to provides a sensor array chip with uniformly smooth and angled ends designed to permit the chip to be lock butted end to end with other like chips to form a full length scanning array in which the substrate is etched for separation along the (111) planes at the desired boundaries of the chip, the etched boundaries delimiting the chip ends running between selected pairs of photosites to provide whole photosites right up to the ends of the chip so as to avoid any cap or interruption between the photosites at the junctions with other chips.In a second embodiment, the chip ends are formed with complementary irregular shapes to enhance locating and butting of the chips with one another, and in a third embodiment, grooves are etched between each of the photosites in the row to assure photosite uniformity and prevent cross talk between photosites.
    • 从具有一列光电子的(110)硅衬底制造传感器阵列的装置和方法,以提供具有均匀光滑和成角度的端部的传感器阵列芯片,其被设计成允许芯片与其它类似芯片端对端地对接以形成 全长扫描阵列,其中衬底被蚀刻以在芯片的期望边界处沿(111)面分离,蚀刻边界限定芯片端部在选定的一对光电子之间运行,以提供整个光电子直到直到末端 芯片,以避免在与其他芯片的交点处的光电子之间的任何盖子或中断。 在第二实施例中,芯片端部形成为互补的不规则形状,以增强芯片彼此的定位和对接,并且在第三实施例中,在行中的每个光电子之间蚀刻凹槽以确保光泽均匀性并防止交叉 光照之间的谈话
    • 59. 发明授权
    • Image sensor array for assembly with like arrays to form a longer array
    • 图像传感器阵列,用于组装类似阵列以形成更长的阵列
    • US4668333A
    • 1987-05-26
    • US808797
    • 1985-12-13
    • Jagdish C. TandonMehdi N. Araghi
    • Jagdish C. TandonMehdi N. Araghi
    • H01L27/146H01L21/306H01L21/78H01L27/14H01L27/144H04N1/028B44C1/22
    • H01L21/78H01L21/30608H01L27/1446
    • Apparatus and method of fabricating a sensor array from a (110) silicon substrate having a row of photosites to provide a sensor array chip with uniformly smooth and angled ends designed to permit the chip to be lock butted end to end with other like chips to form a full length scanning array in which the substrate is etched for separation along the (111) planes at the desired boundaries of the chip, the etched boundaries delimiting the chip ends running between selected pairs of photosites to provide whole photosites right up to the ends of the chip so as to avoid any gap or interruption between the photosites at the junctions with other chips.In a second embodiment, the chip ends are formed with complementary irregular shapes to enhance locating and butting of the chips with one another, and in a third embodiment, grooves are etched between each of the photosites in the row to assure photosite uniformity and prevent cross talk between photosites.
    • 从具有一列光电子的(110)硅衬底制造传感器阵列的装置和方法,以提供具有均匀平滑和成角度的端部的传感器阵列芯片,其被设计成允许芯片与其它类似的芯片端对端地对接以形成 全长扫描阵列,其中衬底被蚀刻以在芯片的期望边界处沿(111)面分离,蚀刻边界限定芯片端部在选定的一对光电子之间运行,以提供整个光电子直到直到末端 芯片,以避免在与其他芯片的交点处的光斑之间的任何间隙或中断。 在第二实施例中,芯片端部形成为互补的不规则形状,以增强芯片彼此的定位和对接,并且在第三实施例中,在行中的每个光电子之间蚀刻凹槽以确保光泽均匀性并防止交叉 光照之间的谈话