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51. 发明授权

US11912563B2 Micromechanical component and method for manufacturing a micromechanical component 有权
公开(公告)号：US11912563B2
公开(公告)日：2024-02-27
申请号：US17287389
申请日：2019-12-13
申请人： Robert Bosch GmbH
发明人： Hans Artmann , Christoph Hermes , Heribert Weber , Jochen Reinmuth , Peter Schmollngruber , Thomas Friedrich
IPC分类号： B81B3/00 , B81C1/00 , G01L7/08 , G01L9/00
CPC分类号： B81B3/0072 , B81C1/00158 , G01L7/082 , G01L9/0072 , B81B2201/0264 , B81B2203/0127 , B81B2203/0307 , B81C2201/0101
摘要： A micromechanical component, whose diaphragm is supported and has support structures on its inner diaphragm side. Each of the support structures includes a first and second edge element structure, and at least one intermediate element structure positioned between the first and second edge element structures. For each of the support structures, a plane of symmetry is definable, with respect to which at least the first edge element structure of the respective support structure and the second edge element structure of the respective support structure are specularly symmetric. In each of support structures, a first maximum dimension of its first edge element structure perpendicular to its plane of symmetry and a second maximum dimension of its second edge element structure perpendicular to its plane of symmetry are greater than the maximum dimension of its intermediate element structure perpendicular to its plane of symmetry.

52. 发明授权

US11846509B2 Three-axis rotation rate sensor including a substrate and a double rotor 有权
公开(公告)号：US11846509B2
公开(公告)日：2023-12-19
申请号：US17648331
申请日：2022-01-19
申请人： Robert Bosch GmbH
发明人： Jochen Reinmuth
IPC分类号： G01C19/5719 , G01C19/5712
CPC分类号： G01C19/5719 , G01C19/5712
摘要： A three-axis rotation rate sensor including a substrate and a double rotor. The double rotor includes a first rotor and a second rotor which are elastically connected to one another via a first coupling element so that the two rotors are excitable to rotary oscillations in phase opposition. The first rotor includes a first seismic mass and a second seismic mass that are deflectably supported with respect to the first rotor, and the second rotor includes a third seismic mass and a fourth seismic mass that are deflectably supported with respect to the second rotor. The first mass is connected to the third mass via a first rocker element so that upon a lateral deflection of the first mass, the third mass is deflected in a direction opposite the lateral deflection of the first mass.

53. 发明申请

US20220328258A1 MEMS SWITCH INCLUDING AN EMBEDDED METAL CONTACT 有权
公开(公告)号：US20220328258A1
公开(公告)日：2022-10-13
申请号：US17715213
申请日：2022-04-07
申请人： Robert Bosch GmbH
发明人： Jochen Reinmuth , Matthew Lewis , Peter Schmollngruber
IPC分类号： H01H1/00 , H01H11/00
摘要： A MEMS switch that includes a substrate with a first insulating layer and a silicon layer thereabove, a fixed portion and a movable switching portion being formed in the silicon layer.
A first metal layer is situated in recesses in the silicon layer at a side of the silicon layer facing away from the substrate, the first metal layer forming at least one switchable electrical contact between the fixed portion and the switching portion.
A method for manufacturing a MEMS switch including at least one embedded metal contact is also described.

54. 发明申请

US20220324696A1 MEMS SWITCH INCLUDING A CAP CONTACT 有权
公开(公告)号：US20220324696A1
公开(公告)日：2022-10-13
申请号：US17715233
申请日：2022-04-07
申请人： Robert Bosch GmbH
发明人： Bernd Klein , Jochen Reinmuth , Lutz Mueller , Matthew Lewis
IPC分类号： B81B3/00
摘要： A micromechanical switch including a first substrate with a micromechanical functional layer in which a deflectable switching element is formed, and with a second substrate that is connected to the first substrate. The second substrate is situated at a distance above the switching element. The switching element includes an electrically conductive first contact area and is deflectable toward the second substrate. The second substrate, at an internal side, includes an electrically conductive second contact area that is situated in such a way that the switching element together with the first contact area may be applied to the second contact area in order to close an electrical contact. A method for manufacturing a micromechanical switch is also described.

55. 发明申请

US20220250901A1 MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE 有权
公开(公告)号：US20220250901A1
公开(公告)日：2022-08-11
申请号：US17570167
申请日：2022-01-06
申请人： Robert Bosch GmbH
发明人： Jochen Reinmuth
IPC分类号： B81B3/00 , B81C1/00
摘要： A micromechanical component for a sensor device, including a seismic mass, which is situated at and/or in a mounting and which includes a first electrode area, a second electrode area electrically insulated from the first electrode area, and a connecting area made up of at least one electrically insulating material. The first electrode area and the second electrode area each mechanically contact the connecting area and are connected to one another via the connecting area. At least one first conductive area of the first electrode area and a second conductive area of the second electrode area are structured out of a first semiconductor and/or metal layer. The first electrode area also includes a third conductive area. The second electrode area also includes a fourth conductive area. The third conductive area and the fourth conductive area are structured out of a second semiconductor and/or metal layer.

56. 发明申请

US20220144623A1 MICROMECHANICAL SENSOR ELEMENT 有权
公开(公告)号：US20220144623A1
公开(公告)日：2022-05-12
申请号：US17452929
申请日：2021-10-29
申请人： Robert Bosch GmbH
发明人： Jochen Reinmuth
IPC分类号： B81B3/00 , G01P15/125
摘要： A micromechanical sensor element includes a substrate, a first structure movably arranged on the substrate, a second structure movably arranged on the substrate and an electrode arrangement, situated on the substrate in a fixed manner, which includes at least one first electrode. The movably arranged structures are coupled with each other by at least one coupling element in such a way that, upon a deflection of the first movably arranged structure along a first direction, the second movably arranged structure undergoes a deflection along an opposite direction. The first electrode includes a plurality of electrode surfaces. The movably arranged structures each include a plurality of movable electrode surfaces. The substrate-fixed electrode surfaces and the movable electrode surfaces engage with each other. The movable electrode surfaces are each situated on sides of the electrode surfaces of the substrate-fixed electrode arrangement facing away from the movably arranged structures.

57. 发明申请

US20210403315A1 SENSOR DEVICE AND METHOD FOR PRODUCING A SENSOR DEVICE 有权
公开(公告)号：US20210403315A1
公开(公告)日：2021-12-30
申请号：US17295432
申请日：2019-12-18
申请人： Robert Bosch GmbH
发明人： Hans Artmann , Jochen Reinmuth
IPC分类号： B81B3/00 , B81C1/00 , G01L9/00
摘要： A sensor device is described. The sensor device includes at least one substrate; an edge region that is disposed on the substrate and laterally delimits an inner region above the substrate; a diaphragm that is anchored on the edge structure and at least partly spans the inner region, the diaphragm encompassing in the inner region at least one region which is movable by way of a pressure and which encloses a cavity between the diaphragm and the substrate; and a first intermediate carrier that extends in the movable region below the diaphragm and is connected to the diaphragm, and in particular has at least one trench.

58. 发明授权

US11187528B2 Rotation rate sensor, method for manufacturing a rotation rate sensor 有权
公开(公告)号：US11187528B2
公开(公告)日：2021-11-30
申请号：US16058228
申请日：2018-08-08
申请人： Robert Bosch GmbH
发明人： Jochen Reinmuth , Robert Maul
IPC分类号： G01C19/5747 , G01C19/5762 , G01C19/5712 , B81B3/00 , G01C19/5769 , G01C19/5783
摘要： A rotation rate sensor including a substrate, a drive structure, which is movable with regard to the substrate, a detection structure, and a Coriolis structure, the drive structure, the Coriolis structure, and the detection structure being essentially situated in a layer, in that an additional layer is situated essentially in parallel to the layer above or underneath the layer, a mechanical connection between the Coriolis structure and the drive structure being established with a first spring component, the first spring component being configured as a part of the additional layer, and/or a mechanical connection between the detection structure and the substrate being established with a second spring component, the second spring component being configured as a part of the additional layer.

59. 发明申请

US20210261404A1 ELECTRICAL CONTACTING AND METHOD FOR PRODUCING AN ELECTRICAL CONTACTING 有权
公开(公告)号：US20210261404A1
公开(公告)日：2021-08-26
申请号：US17252044
申请日：2019-06-25
申请人： Robert Bosch GmbH
发明人： Jochen Reinmuth , Markus Kuhnke , Stefan Majoni , Timo Schary
IPC分类号： B81B7/00 , B81C1/00
摘要： An electrical contacting between a surrounding wiring and a conductor region. The conductor region is situated in a conductor layer above an SOI wafer or SOI chip. A cover layer is situated above the conductor layer and below the surrounding wiring. The cover layer has a contacting region. The contacting region is insulated from the rest of the cover layer by a first configuration of recesses. An opening is formed at least in the contacting region. A metallic material is situated in the opening. The metallic material connects the surrounding wiring and the conductor region.

60. 发明授权

US10556789B2 Laser resealing with stress-reducing prestructuring 有权
公开(公告)号：US10556789B2
公开(公告)日：2020-02-11
申请号：US15297794
申请日：2016-10-19
申请人： Robert Bosch GmbH
发明人： Frank Reichenbach , Jochen Reinmuth , Philip Kappe , Mawuli Ametowobla
IPC分类号： B81C1/00 , B81B7/02 , C03B23/20 , C03C23/00
摘要： A method for manufacturing a micromechanical component including a substrate and a cap connected to the substrate and together with the substrate enclosing a first cavity, a first pressure prevailing and a first gas mixture with a first chemical composition being enclosed in the first cavity: in a first method step, an access opening, connecting the first cavity to surroundings of the micromechanical component, being formed in the substrate or in the cap; in a second method step, the first pressure and/or the first chemical composition being adjusted in the first cavity; in a third method step, the access opening being sealed by introducing energy and heat into an absorbing part of the substrate or the cap with the aid of a laser; in a fourth method step, a recess being formed, and/or an elevation being formed, and/or a reflection area being formed, and/or an absorption area being formed.

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