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    • 51. 发明申请
    • NOISE-SUPPRESSING WIRING-MEMBER AND PRINTED WIRING BOARD
    • 噪声抑制接线构件和打印接线板
    • US20080049410A1
    • 2008-02-28
    • US11769386
    • 2007-06-27
    • Toshiyuki KAWAGUCHIKazutoki TAHARATsutomu SAGAMitsuaki NEGISHI
    • Toshiyuki KAWAGUCHIKazutoki TAHARATsutomu SAGAMitsuaki NEGISHI
    • H05K9/00
    • H05K1/0234H05K1/0298H05K1/167H05K2201/0191H05K2201/0317H05K2201/0326H05K2201/093H05K2201/09309
    • The present invention relates to a wiring member including: a copper foil layer having a smooth surface with a surface roughness Rz of 2 μm or less; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness of 5 to 200 nm; and an insulating resin layer provided between the smooth surface of the copper foil layer and the noise suppressing layer, and also relates to a printed wiring board equipped with the wiring member. Moreover, the present invention relates to a noise suppressing structure including: a first conductive layer; a second conductive layer; a noise suppressing layer provided between the first conductive layer and the second conductive layer, the noise suppressing layer being to be electromagnetically-coupled with the first conductive layer, the noise suppressing layer comprising a metallic material or a conductive ceramic, and the noise suppressing layer having a thickness of 5 to 300 nm; a first insulating layer provided between the first conductive layer and the noise suppressing layer; and a second insulating layer provided between the second conductive layer and the noise suppressing layer; wherein the noise suppressing structure has: a region (I) in which the noise suppressing layer and the first conductive layer face each other; and a region (II) in which the noise suppressing layer and the first conductive layer do not face each other but the noise suppressing layer and the second conductive layer face each other, the regions (I) and (II) neighboring each other.
    • 布线构件技术领域本发明涉及一种布线构件,其包括:具有表面粗糙度Rz为2μm以下的光滑表面的铜箔层; 含有金属材料或导电陶瓷的噪声抑制层,其厚度为5〜200nm; 以及设置在铜箔层的光滑表面和噪声抑制层之间的绝缘树脂层,并且还涉及配备有配线构件的印刷线路板。 此外,本发明涉及一种噪声抑制结构,包括:第一导电层; 第二导电层; 设置在第一导电层和第二导电层之间的噪声抑制层,噪声抑制层与第一导电层电磁耦合,噪声抑制层包括金属材料或导电陶瓷,噪声抑制层 具有5〜300nm的厚度; 设置在所述第一导电层和所述噪声抑制层之间的第一绝缘层; 以及设置在所述第二导电层和所述噪声抑制层之间的第二绝缘层; 其中所述噪声抑制结构具有:所述噪声抑制层和所述第一导电层彼此面对的区域(I); 以及区域(I)和(II)彼此相邻的区域(II),其中噪声抑制层和第一导电层彼此不相对,但是噪声抑制层和第二导电层彼此面对。