专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明授权

US07683429B2 Microstructure and manufacturing method of the same 有权
标题翻译：微结构和制造方法相同
公开(公告)号：US07683429B2
公开(公告)日：2010-03-23
申请号：US11420344
申请日：2006-05-25
申请人： Mayumi Yamaguchi , Konami Izumi
发明人： Mayumi Yamaguchi , Konami Izumi
IPC分类号： H01L21/30
CPC分类号： B81C1/00142
摘要： A microstructure which forms a micromachine is formed by using a silicon wafer as a mainstream, conventionally. In view of this, the invention provides a manufacturing method of a micromachine in which a microstructure is formed over an insulating substrate.The invention provides a micromachine including a layer containing polycrystalline silicon which is crystallized by thermal crystallization or laser crystallization using a metal element and including a space over or under the layer. Such polycrystalline silicon can be formed over an insulating surface and has high strength, therefore, it can be used as a microstructure as well. As a result, a microstructure formed over an insulating substrate or a micromachine provided with a microstructure can be provided.
摘要翻译：常规地使用硅晶片作为主流来形成微机械的微结构。鉴于此，本发明提供了一种微机械的制造方法，其中在绝缘基板上形成微结构。本发明提供一种微机械，其包括含有多晶硅的层，其通过使用金属元素的热结晶或激光结晶而结晶，并且在该层上或下方包含空间。这种多晶硅可以形成在绝缘表面上并具有高强度，因此也可以用作微结构。结果，可以提供在具有微结构的绝缘基板或微机械体上形成的微观结构。

52. 发明申请

US20090230815A1 MICRO ELECTRO MECHANICAL SYSTEM, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF 有权
标题翻译：微电子机械系统，半导体器件及其制造方法
公开(公告)号：US20090230815A1
公开(公告)日：2009-09-17
申请号：US12426602
申请日：2009-04-20
申请人： Mayumi Yamaguchi , Konami Izumi , Fuminori Tateishi
发明人： Mayumi Yamaguchi , Konami Izumi , Fuminori Tateishi
IPC分类号： H01L41/053
CPC分类号： B60C23/0493 , A61B5/02444 , A61B5/681 , B60C23/04 , B60C23/0408 , B60C23/0411 , B60C23/0413 , B60C23/20 , B81C1/0023 , G01L1/16 , G01L17/00 , H01L21/02118 , H01L21/02175 , H01L21/02183 , H01L21/02186 , H01L21/02189 , H01L21/54 , H01L24/93 , H01L27/20 , H01L35/34 , H01L41/25 , H01L41/311 , H01L41/313 , H01L2924/0002 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , Y10T29/42 , H01L2924/00
摘要： The present invention provides a MEMS and a sensor having the MEMS which can be formed without a process of etching a sacrifice layer. The MEMS and the sensor having the MEMS are formed by forming an interspace using a spacer layer. In the MEMS in which an interspace is formed using a spacer layer, a process for forming a sacrifice layer and an etching process of the sacrifice layer are not required. As a result, there is no restriction on the etching time, and thus the yield can be improved.
摘要翻译：本发明提供一种具有MEMS的MEMS和传感器，该传感器可以在没有蚀刻牺牲层的工艺的情况下形成。具有MEMS的MEMS和传感器通过使用间隔层形成间隙而形成。在使用间隔层形成间隙的MEMS中，不需要用于形成牺牲层的工艺和牺牲层的蚀刻工艺。结果，蚀刻时间没有限制，可以提高成品率。

53. 发明授权

US07528529B2 Micro electro mechanical system, semiconductor device, and manufacturing method thereof 有权
标题翻译：微机电系统，半导体器件及其制造方法
公开(公告)号：US07528529B2
公开(公告)日：2009-05-05
申请号：US11549310
申请日：2006-10-13
申请人： Mayumi Yamaguchi , Konami Izumi , Fuminori Tateishi
发明人： Mayumi Yamaguchi , Konami Izumi , Fuminori Tateishi
IPC分类号： H01L41/053
CPC分类号： B60C23/0493 , A61B5/02444 , A61B5/681 , B60C23/04 , B60C23/0408 , B60C23/0411 , B60C23/0413 , B60C23/20 , B81C1/0023 , G01L1/16 , G01L17/00 , H01L21/02118 , H01L21/02175 , H01L21/02183 , H01L21/02186 , H01L21/02189 , H01L21/54 , H01L24/93 , H01L27/20 , H01L35/34 , H01L41/25 , H01L41/311 , H01L41/313 , H01L2924/0002 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , Y10T29/42 , H01L2924/00
摘要： The present invention provides a MEMS and a sensor having the MEMS which can be formed without a process of etching a sacrifice layer. The MEMS and the sensor having the MEMS are formed by forming an interspace using a spacer layer. In the MEMS in which an interspace is formed using a spacer layer, a process for forming a sacrifice layer and an etching process of the sacrifice layer are not required. As a result, there is no restriction on the etching time, and thus the yield can be improved.
摘要翻译：本发明提供一种具有MEMS的MEMS和传感器，该传感器可以在没有蚀刻牺牲层的工艺的情况下形成。具有MEMS的MEMS和传感器通过使用间隔层形成间隙而形成。在使用间隔层形成间隙的MEMS中，不需要用于形成牺牲层的工艺和牺牲层的蚀刻工艺。结果，对蚀刻时间没有限制，因此可以提高成品率。

54. 发明申请

US20080177353A1 Cochlear implant device, extracorporeal sound collector, and cochlear implant system having the same 审中-公开
标题翻译：耳蜗植入装置，体外收集器和具有相同的人工耳蜗植入系统
公开(公告)号：US20080177353A1
公开(公告)日：2008-07-24
申请号：US12004512
申请日：2007-12-21
申请人： Takashi Hirota , Mayumi Yamaguchi
发明人： Takashi Hirota , Mayumi Yamaguchi
IPC分类号： A61N1/00 , A61F2/18
CPC分类号： H01L27/13 , A61N1/0541 , A61N1/36036 , H01L27/1214 , H01L27/1266 , H01L27/1277
摘要： An object is to provide a cochlear implant system (also known as an artificial inner ear system) which is easy to use with little interference with daily activities. A cochlear implant device (or artificial inner ear device) includes an inner ear electrode, an information processing circuit, a transmitter/receiver circuit, a charging circuit, and a battery; and the battery is charged with electromagnetic waves received by the transmitter/receiver circuit through the charging circuit. In addition, the power stored in the battery is supplied to the cochlear implant device. Further, the electromagnetic waves received by the transmitter/receiver circuit are converted into a signal by the information processing circuit, and the signal is provided from the inner ear electrode to stimulate the auditory nerve.
摘要翻译：目的是提供一种易于使用的人工耳蜗系统（也称为人造内耳系统），对日常活动几乎没有干扰。耳蜗植入装置（或人造内耳装置）包括内耳电极，信息处理电路，发射器/接收器电路，充电电路和电池; 并通过充电电路向电池充电由发射机/接收机电路接收的电磁波。此外，存储在电池中的功率被提供给耳蜗植入装置。此外，由发送器/接收器电路接收的电磁波被信息处理电路转换成信号，并且从内耳电极提供信号以刺激听觉神经。

55. 发明申请

US20070215963A1 MICROMACHINE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译： MICROMACHINE及其制造方法
公开(公告)号：US20070215963A1
公开(公告)日：2007-09-20
申请号：US11684711
申请日：2007-03-12
申请人： Mayumi Yamaguchi , Konami Izumi
发明人： Mayumi Yamaguchi , Konami Izumi
IPC分类号： H01L29/82
CPC分类号： B81B7/008 , B81C1/00246 , B81C2203/0742 , H01L27/1222 , H01L29/78678
摘要： A semiconductor element of the electric circuit includes a semiconductor layer over a gate electrode. The semiconductor layer of the semiconductor element is formed of a layer including polycrystalline silicon which is obtained by crystallizing amorphous silicon by heat treatment or laser irradiation, over a substrate. The obtained layer including polycrystalline silicon is also used for a structure layer such as a movable electrode of a structure body. Therefore, the structure body and the electric circuit for controlling the structure body can be formed over one substrate. As a result, a micromachine can be miniaturized. Further, assembly and packaging are unnecessary, so that manufacturing cost can be reduced.
摘要翻译：电路的半导体元件包括在栅电极上的半导体层。半导体元件的半导体层由包含多晶硅的层形成，该多晶硅通过在基板上通过热处理或激光照射而使非晶硅结晶而获得。所获得的包含多晶硅的层也用于结构体的结构层，例如结构体的可动电极。因此，可以在一个基板上形成用于控制结构体的结构体和电路。结果，微型机器可以被小型化。此外，组装和包装是不必要的，从而可以降低制造成本。

56. 发明申请

US20070143048A1 TEST METHOD OF MICROSCTRUCTURE BODY AND MICROMACHINE 有权
标题翻译：微结构体和微生物测试方法
公开(公告)号：US20070143048A1
公开(公告)日：2007-06-21
申请号：US11565135
申请日：2006-11-30
申请人： Mayumi YAMAGUCHI , Konami IZUMI , Fuminori TATEISHI
发明人： Mayumi YAMAGUCHI , Konami IZUMI , Fuminori TATEISHI
IPC分类号： G01R19/00
CPC分类号： B81C99/004 , G01R31/3025
摘要： It is an object to provide a test method of a process, an electric characteristic, and a mechanical characteristic of a structure body in a micromachine without contact. A structure body including a first conductive layer, a second conductive layer provided in parallel to the first conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer is provided; an antenna connected to the structure body is provided; electric power is supplied to the structure body wirelessly through the antenna; and an electromagnetic wave generated from the antenna is detected as a characteristic of the structure body.
摘要翻译：本发明的目的是提供一种微机械结构体的过程，电特性和机械特性的测试方法。提供一种结构体，包括第一导电层，与第一导电层平行设置的第二导电层，以及设置在第一导电层和第二导电层之间的牺牲层或空间。提供连接到结构体的天线; 电力通过天线无线地提供给结构体; 并且从天线产生的电磁波被检测为结构体的特征。

57. 发明申请

US20070111365A1 MANUFACTURING METHOD OF MICROSTRUCTURE AND MICROELECTROMECHANICAL SYSTEM 有权
标题翻译：微结构和微电子系统的制造方法
公开(公告)号：US20070111365A1
公开(公告)日：2007-05-17
申请号：US11557353
申请日：2006-11-07
申请人： Fuminori TATEISHI , Konami IZUMI , Mayumi YAMAGUCHI
发明人： Fuminori TATEISHI , Konami IZUMI , Mayumi YAMAGUCHI
IPC分类号： H01L21/00
CPC分类号： B81C1/00476
摘要： To reduce the number of photomasks which are used to form sacrificial layers for producing spaces of a microstructure, thereby reducing the manufacturing cost. Sacrificial layers are formed by using resist masks which are patterned with the same photomask. Specifically, after forming a first sacrificial layer by etching using a resist mask, a second sacrificial layer is formed by etching using a resist mask which is pattered with same photomask as the resist mask of the first sacrificial layer. By deforming one of the resist masks before etching its corresponding sacrificial layer, for example by increasing or reducing the external dimension of the resist mask, sacrificial layers having different sizes from each other can be formed.
摘要翻译：为了减少用于形成用于形成微结构的空间的牺牲层的光掩模的数量，从而降低制造成本。牺牲层通过使用用相同光掩模图案化的抗蚀剂掩模形成。具体而言，在使用抗蚀剂掩模蚀刻形成第一牺牲层之后，通过使用与第一牺牲层的抗蚀剂掩模相同的光掩模图案化的抗蚀剂掩模进行蚀刻来形成第二牺牲层。在蚀刻其相应的牺牲层之前，通过使抗蚀剂掩模之一变形，例如通过增加或减小抗蚀剂掩模的外部尺寸，可以形成具有彼此不同尺寸的牺牲层。

58. 发明申请

US20070078228A1 MICRO-ELECTRO-MECHANICAL DEVICE AND MANUFACTURING METHOD FOR THE SAME 有权
标题翻译：微电子机械装置及其制造方法
公开(公告)号：US20070078228A1
公开(公告)日：2007-04-05
申请号：US11469125
申请日：2006-08-31
申请人： Fuminori TATEISHI , Konami IZUMI , Mayumi YAMAGUCHI
发明人： Fuminori TATEISHI , Konami IZUMI , Mayumi YAMAGUCHI
IPC分类号： C08F297/02
CPC分类号： C08F297/02 , A61J3/00 , B81C1/0023 , H01L27/1214 , H01L27/1218 , H01L27/1255 , H01L27/1262 , H01L27/1266 , Y02P20/582
摘要： It is an object of the present invention to provide a micro-electro-mechanical-device having a microstructure and a semiconductor element over one surface. In particular, it is an object of the present invention to provide a method for simplifying the process of forming the microstructure and the semiconductor element over one surface. A space in which the microstructure is moved, that is, a movable space for the microstructure is formed by processing an insulating layer which is formed in a process of forming the semiconductor element. The movable space can be formed by forming the insulating layer having a plurality of openings and making the openings face each other to be overlapped each other.
摘要翻译：本发明的目的是提供一种在一个表面上具有微结构和半导体元件的微机电装置。特别地，本发明的目的是提供一种简化在一个表面上形成微结构和半导体元件的工艺的方法。通过处理在形成半导体元件的工艺中形成的绝缘层来形成微结构移动的空间，即微结构的可移动空间。可移动空间可以通过形成具有多个开口的绝缘层并使开口彼此面对地彼此重叠而形成。

59. 发明授权

US4882192A Hard butter composition 失效
标题翻译：硬黄油组成
公开(公告)号：US4882192A
公开(公告)日：1989-11-21
申请号：US176181
申请日：1988-03-31
申请人： Hirokazu Maeda , Mayumi Yamaguchi , Tetsuya Uchiyama , Hideki Baba , Hidenobu Matsunami , Yoshitaka Ebihara , Junji Kanegae
发明人： Hirokazu Maeda , Mayumi Yamaguchi , Tetsuya Uchiyama , Hideki Baba , Hidenobu Matsunami , Yoshitaka Ebihara , Junji Kanegae
IPC分类号： A23G1/30 , A23D9/00 , A23G1/00 , A23G1/36 , A23G1/38
CPC分类号： A23G1/36 , A23D9/00 , A23G1/38
摘要： A hard butter composition suitable for the production of solid chocolate having soft mouth feel at the beginning of mastication and sharp melting in the mouth, while it can provide sufficient shape retention at an ordinary temperature. The hard butter composition comprises at least 85% by weight of a triglyceride component mainly composed of triglycerides having one unsaturated bond in one molecule and triglycerides having at least three unsaturated bonds in one molecule, and at most 15% by weight of a nontriglyceride component based on the total weight of said composition. SFI of the composition is at most 65% at 5.degree. C., 20 to 55% at 30.degree. C., 2 to 35% at 35.degree. C., at most 3% at 40.degree. C., and difference between SFI at 5.degree. C. and that of 25.degree. C. being at most 15%.

60. 发明授权

US08822251B2 Micro electro mechanical system, semiconductor device, and manufacturing method thereof 有权
标题翻译：微机电系统，半导体器件及其制造方法
公开(公告)号：US08822251B2
公开(公告)日：2014-09-02
申请号：US12426602
申请日：2009-04-20
申请人： Mayumi Yamaguchi , Konami Izumi , Fuminori Tateishi
发明人： Mayumi Yamaguchi , Konami Izumi , Fuminori Tateishi
IPC分类号： H01L21/00 , H01L21/30 , H01L21/46
CPC分类号： B60C23/0493 , A61B5/02444 , A61B5/681 , B60C23/04 , B60C23/0408 , B60C23/0411 , B60C23/0413 , B60C23/20 , B81C1/0023 , G01L1/16 , G01L17/00 , H01L21/02118 , H01L21/02175 , H01L21/02183 , H01L21/02186 , H01L21/02189 , H01L21/54 , H01L24/93 , H01L27/20 , H01L35/34 , H01L41/25 , H01L41/311 , H01L41/313 , H01L2924/0002 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , Y10T29/42 , H01L2924/00
摘要： The present invention provides a MEMS and a sensor having the MEMS which can be formed without a process of etching a sacrifice layer. The MEMS and the sensor having the MEMS are formed by forming an interspace using a spacer layer. In the MEMS in which an interspace is formed using a spacer layer, a process for forming a sacrifice layer and an etching process of the sacrifice layer are not required. As a result, there is no restriction on the etching time, and thus the yield can be improved.
摘要翻译：本发明提供一种具有MEMS的MEMS和传感器，该传感器可以在没有蚀刻牺牲层的工艺的情况下形成。具有MEMS的MEMS和传感器通过使用间隔层形成间隙而形成。在使用间隔层形成间隙的MEMS中，不需要用于形成牺牲层的工艺和牺牲层的蚀刻工艺。结果，蚀刻时间没有限制，可以提高成品率。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式