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    • 60. 发明申请
    • Photo-radiation source
    • 光辐射源
    • US20060252336A1
    • 2006-11-09
    • US11409410
    • 2006-04-20
    • John DanielsGregory Nelson
    • John DanielsGregory Nelson
    • H01J9/00H01J9/24
    • F21K9/90F21Y2105/10F21Y2115/10G03G15/6582H01L25/0753H01L2924/0002Y10S428/917H01L2924/00
    • A method of manufacturing a photo-radiation source comprising the steps of providing a first planar conductor; disposing a formation of light emitting chips on the first planar conductor, each chip having a cathode and an anode, one of the cathode and anode of each chip being in contact with the first planar conductor. The method of manufacturing a photo-radiation source also includes the steps of disposing a second planar conductor on top of a formation of light emitting chips so that the second planar conductor is in contact with the other of the cathode and anode of each chip; and binding the first planar conductor to the second planar conductor to permanently maintain the formation of light emitting chips without the use of solder or wiring bonding for making an electrical and mechanical contact between the chips and either of the first planar conductor and the second planar conductor.
    • 一种制造光辐射源的方法,包括以下步骤:提供第一平面导体; 在第一平面导体上设置发光芯片的形式,每个芯片具有阴极和阳极,每个芯片的阴极和阳极中的一个与第一平面导体接触。 制造光辐射源的方法还包括以下步骤:将第二平面导体设置在发光芯片形成的顶部,使得第二平面导体与每个芯片的阴极和阳极中的另一个接触; 并且将所述第一平面导体绑定到所述第二平面导体以永久地保持所述发光芯片的形成,而不使用焊料或布线接合,以在所述芯片与所述第一平面导体和所述第二平面导体中的任一个之间进行电和机械接触 。