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    • 55. 发明申请
    • System and Method for Display of Capsule Images and Associated Information
    • 用于显示胶囊图像和相关信息的系统和方法
    • US20160100740A1
    • 2016-04-14
    • US14974126
    • 2015-12-18
    • Capso Vision, Inc.
    • Kang-Huai WangGordon C. WilsonWeiwen Lin
    • A61B1/00A61B1/04
    • A61B1/0005A61B1/00009A61B1/041G06T11/206
    • A method for presentation of image sequence data is disclosed. The intensity of the image sequence data is used to derive the navigation guide. Each representative data may correspond to an average pixel value, a median pixel value, a minimum value, or a maximum value of the sub-image or said one or more images. Each representative data may also comprise a term proportional to a mathematical product of adjusted color values. The series of representative data can be plotted along with highlighting an area between a curve corresponding to the series of representative data and a coordinate axis by filling the area with a highlight color. Each representative data may comprise a minimum value and a maximum value associated with the sub-image, or one or more images.
    • 公开了一种呈现图像序列数据的方法。 图像序列数据的强度用于导出导航指南。 每个代表数据可以对应于子图像或所述一个或多个图像的平均像素值,中值像素值,最小值或最大值。 每个代表数据还可以包括与经调整的颜色值的数学乘积成比例的项。 可以绘制一系列代表性数据,并通过用突出显示颜色填充该区域,突出显示对应于一系列代表性数据的曲线与坐标轴之间的区域。 每个代表数据可以包括与子图像或一个或多个图像相关联的最小值和最大值。
    • 58. 发明授权
    • Camera system with multiple pixel arrays on a chip
    • 相机系统在芯片上具有多个像素阵列
    • US09118850B2
    • 2015-08-25
    • US12323219
    • 2008-11-25
    • Jiafu LuoKang-Huai WangGordon C. Wilson
    • Jiafu LuoKang-Huai WangGordon C. Wilson
    • H04N7/00H04N5/341A61B1/04G02B13/06H04N5/232H04N5/3745H04N5/378
    • H04N5/3415A61B1/041G02B13/06H04N5/23238H04N5/3745H04N5/378
    • A camera system uses one or more image sensor IC chips each having multiple pixel arrays on the same semiconductor substrate (i.e., “multiple pixel arrays on a chip”). In one embodiment, such a camera system includes: (a) optical components that create multiple images in close physical proximity of each other (e.g., within a few millimeters or centimeters); and (b) a single sensor substrate (“chip”) containing multiple 2-dimensional pixel arrays that are aligned to capture these multiple images, so as to convert the multiple images into electrical signal. The pixel arrays can be manufactured using a CCD or a CMOS compatible process. For manufacturing reasons, such a chip is typically two centimeters or less on a side. However, large chips can also be made. Optional electronic components for further signal processing of the captured images may be formed either on the sensor chip (i.e., in a “system-on-a-chip” implementation), or in a separate back-end application specific integrated circuit (ASIC). In addition, digital storage components, display elements, and wired or wireless communication links may also be included in any suitable combination to allow review and further processing of the captured images.
    • 相机系统使用在同一半导体衬底(即,“芯片上的多个像素阵列”)上具有多个像素阵列的一个或多个图像传感器IC芯片。 在一个实施例中,这种照相机系统包括:(a)产生彼此紧密物理接近的多个图像的光学部件(例如,在几毫米或厘米以内); 和(b)包含对准以捕获这些多个图像的多个2维像素阵列的单个传感器基板(“芯片”),以将多个图像转换为电信号。 可以使用CCD或CMOS兼容过程来制造像素阵列。 由于制造原因,这样的芯片在一侧通常为2厘米或更小。 然而,也可以制造大的芯片。 可以在传感器芯片(即,“芯片上系统”实现)中或在单独的后端专用集成电路(ASIC)中形成用于对捕获图像进行进一步信号处理的可选电子部件, 。 此外,数字存储组件,显示元件以及有线或无线通信链路也可以以任何合适的组合包括在内,以允许查看和进一步处理所捕获的图像。