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    • 45. 发明申请
    • THERMOELECTRIC CONVERSION MODULE
    • US20180175272A1
    • 2018-06-21
    • US15898317
    • 2018-02-16
    • FUJIFILM Corporation
    • Shinji IMAIHideyuki SUZUKI
    • H01L35/32H01L35/30H01L35/22
    • H01L35/32H01L35/22H01L35/24H01L35/30
    • A thermoelectric conversion module includes a thermoelectric conversion module body which includes a plurality of thermoelectric conversion module substrates in which at least one of a P-type thermoelectric conversion element having a P-type thermoelectric conversion layer and a pair of connection electrodes which are electrically connected to the P-type thermoelectric conversion layer, or an N-type thermoelectric conversion element having an N-type thermoelectric conversion layer and a pair of connection electrodes which are electrically connected to the N-type thermoelectric conversion layer is provided on one surface of an insulating substrate having flexibility, the plurality of thermoelectric conversion module substrates being arranged such that a direction of the connection electrode and a direction of the insulating substrate are aligned, and a heat transfer portion which is provided on a side of the thermoelectric conversion module body close to at least one connection electrode of the thermoelectric conversion module substrate, presses the thermoelectric conversion module substrate in an arrangement direction, and transfers heat to the thermoelectric conversion module body or dissipates heat of the thermoelectric conversion module body. A thermal conductivity of the heat transfer portion is 10 W/mK or higher. A normal stress in a direction perpendicular to a surface of the insulating substrate in a case of pressing the thermoelectric conversion module substrate in the arrangement direction by the heat transfer portion is 0.01 MPa or higher.