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    • 43. 发明申请
    • SUPERHARD CONSTRUCTIONS & METHODS OF MAKING SAME
    • 超级建筑及其制作方法
    • US20160144483A1
    • 2016-05-26
    • US14892712
    • 2014-05-30
    • ELEMENT SIX ABRASIVES S.A.
    • MAWEJA KASONDEVALENTINE KANYANTAMEHMET SERDAR OZBAYRAKTAR
    • B24D3/14E21B10/573B24D3/06
    • B24D3/14B24D3/06E21B10/567E21B10/5735
    • A superhard polycrystalline construction (1) comprises a body (12) of polycrystalline superhard material having a cutting face (14) and a substrate (10) bonded to the body of polycrystalline superhard material along an interface (18). The substrate comprises a substrate body and a first end surface ( )20 forming the interface, the first end surface of the substrate comprising a projection extending from the body of the substrate into the body of superhard material towards the cutting face. The projection has an outer peripheral surface around which the body of polycrystalline superhard material extends. The body of polycrystalline superhard material has a thickness (h) from the cutting face along the peripheral side edge (13) to the interface with the substrate of at least around 4 mm and at least a portion of the projection has a thickness measured in a plane extending along the longitudinal axis of the construction of at least around 4 mm. There is also disclosed a method of making such a superhard polycrystalline construction.
    • 超硬多晶结构(1)包括具有切割面(14)的多晶超硬材料体(12)和沿着界面(18)结合到多晶超硬材料体的基底(10)。 衬底包括衬底主体和形成界面的第一端面(20),衬底的第一端面包括从衬底本体延伸到超硬材料体朝向切割面的突起。 突起具有外围表面,多晶超硬材料的主体围绕该外周表面延伸。 多晶超硬材料的主体具有从切割面沿着周边侧边缘(13)到与基板的界面至少约4mm的厚度(h),并且突起的至少一部分具有在 平面沿构造的纵向轴线延伸至少约4毫米。 还公开了制造这种超硬多晶结构的方法。
    • 44. 发明申请
    • METHODS OF FABRICATING A POLYCRYSTALLINE DIAMOND COMPACT
    • 制造多晶金刚石紧凑件的方法
    • US20160136785A1
    • 2016-05-19
    • US15005765
    • 2016-01-25
    • US SYNTHETIC CORPORATION
    • Debkumar MukhopadhyayJair J. Gonzalez
    • B24D3/06B24D18/00E21B10/56
    • B24D3/06B01J3/062B01J2203/062B01J2203/0655B01J2203/0685B24D18/0009B24D99/005C04B35/528E21B10/46E21B10/56
    • Embodiments relate to polycrystalline diamond compacts (“PDCs”) and methods of manufacturing such PDCs in which an at least partially leached polycrystalline diamond (“PCD”) table is infiltrated with a low viscosity cobalt-based alloy infiltrant. In an embodiment, a method includes forming a PCD table in the presence of a metal-solvent catalyst in a first high-pressure/high-temperature (“HPHT”) process. The method includes at least partially leaching the PCD table to remove at least a portion of the metal-solvent catalyst therefrom to form an at least partially leached PCD table. The method includes subjecting the at least partially leached PCD table and a substrate to a second HPHT process effective to at least partially infiltrate the at least partially leached PCD table with a cobalt-based alloy infiltrant having a composition at or near a eutectic composition of the cobalt-based alloy infiltrant.
    • 实施例涉及多晶金刚石压块(“PDC”)以及制造这样的PDC的方法,其中至少部分浸出的多晶金刚石(“PCD”)工作台用低粘度钴基合金渗透剂渗透。 在一个实施方案中,一种方法包括在第一高压/高温(“HPHT”)方法中在金属溶剂催化剂存在下形成PCD表。 该方法包括至少部分浸出PCD表以从其中除去至少一部分金属 - 溶剂催化剂以形成至少部分浸出的PCD台。 该方法包括使至少部分浸出的PCD台和基板经受有效的至少部分浸渗的PCD台的第二HPHT方法,所述第二HPHT工艺具有钴基合金浸渗剂,所述钴基合金浸渗剂具有或接近共晶组成 钴基合金浸润剂。
    • 45. 发明授权
    • Grindstone tool and method for manufacturing same
    • 磨石工具及其制造方法
    • US09333627B2
    • 2016-05-10
    • US14129036
    • 2012-02-24
    • Hideaki ArisawaToshio Kimura
    • Hideaki ArisawaToshio Kimura
    • B24D5/00B24D18/00B24D3/06
    • B24D18/0054B24D3/06B24D5/00
    • Provided is a grindstone tool capable of grinding with high precision and a method for manufacturing same, the grindstone tool having improved chip discharge characteristics to thereby prevent chips clogging of the chip pocket. The grinding tool comprises: dimples (14) formed in the external peripheral surface (13a) of a base metal (11) so that the quantity present in any position in the width direction of the external peripheral surface (13a) is the same in the peripheral direction; a grinding surface (21) formed by affixing a plurality of abrasive grains (22) to the external peripheral surface (13a) using a plating layer (23); and recess parts (24) into which chips produced by the grinding of the abrasive grains (22) are discharged, the recess parts being formed by portions that correspond to the dimples (14) in the grinding surface (21) being recessed.
    • 提供一种能够高精度研磨的磨石工具及其制造方法,该磨石工具具有改进的切屑排出特性,从而防止芯片堵塞芯片槽。 研磨工具包括:形成在母材(11)的外周面(13a)中的凹坑(14),使得存在于外周面(13a)的宽度方向上的任何位置的量在 周边方向 使用镀层(23)将多个磨粒(22)固定在外周面(13a)上形成的研磨面(21)。 以及通过研磨磨粒(22)产生的切屑被排出的凹部(24),所述凹部由与研磨面(21)中的凹部(14)对应的部分凹陷形成。