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41. 发明申请

US20100126761A1 Printed circuit board having buried pattern and method of manufacturing the same 失效
标题翻译：具有掩埋图案的印刷电路板及其制造方法
公开(公告)号：US20100126761A1
公开(公告)日：2010-05-27
申请号：US12382057
申请日：2009-03-06
申请人： Se Won Park
发明人： Se Won Park
IPC分类号： H01R12/06 , H01B13/00
CPC分类号： H05K3/465 , H05K3/107 , H05K3/184 , H05K2203/025 , H05K2203/0582 , H05K2203/095 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165
摘要： Disclosed herein is a method of manufacturing a printed circuit board having a buried pattern, including: forming a second insulation layer on a first insulation layer, the second insulation layer having openings for forming a circuit layer; and filling the openings with a conductive metal to form a circuit layer.
摘要翻译：本文公开了一种制造具有掩埋图案的印刷电路板的方法，包括：在第一绝缘层上形成第二绝缘层，所述第二绝缘层具有用于形成电路层的开口; 并用导电金属填充开口以形成电路层。

42. 发明申请

US20090211798A1 PGA TYPE WIRING BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译： PGA型接线板及其制造方法
公开(公告)号：US20090211798A1
公开(公告)日：2009-08-27
申请号：US12372870
申请日：2009-02-18
申请人： Akio Horiuchi , Yoshikazu Hirabayashi , Yoshitaka Matsushita , Kazuhiro Oshima
发明人： Akio Horiuchi , Yoshikazu Hirabayashi , Yoshitaka Matsushita , Kazuhiro Oshima
IPC分类号： H01R12/06 , H05K3/20
CPC分类号： H05K3/303 , H01L2224/16225 , H05K3/284 , H05K3/305 , H05K3/3426 , H05K2201/10318 , H05K2201/10424 , H05K2201/10977 , Y02P70/613 , Y10T29/49128
摘要： A PGA type wiring board includes a wiring board to which a head portion of a pin is joined to a pad portion with solder interposed therebetween, and a pin fixing plate having a through hole formed therein through which a shank portion of the pin is inserted, and having an adhesive layer formed on one surface thereof. The pin fixing plate is bonded to the wiring board with the adhesive layer interposed therebetween while the shank portion of the pin is inserted through the through hole. The through hole is shaped in a stepped form with a two-step configuration when viewed in cross section.
摘要翻译： PGA型布线基板包括布线基板，其中引脚的头部与焊料插入其中的焊盘部分接合，并且销固定板具有形成在其中的通孔，销的柄部穿过该通孔插入，并且在其一个表面上形成有粘合剂层。销固定板在插入其间的粘合层的同时与布线板接合，同时销的柄部穿过通孔插入。当从横截面观察时，通孔以阶梯形状成形为两步构造。

43. 发明申请

US20090145648A1 MULTILAYER WIRING BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：多层接线板及其制造方法及半导体器件
公开(公告)号：US20090145648A1
公开(公告)日：2009-06-11
申请号：US12323672
申请日：2008-11-26
申请人： Michio HORIUCHI , Yasue TOKUTAKE , Shigeaki SUGANUMA , Naoyuki KOIZUMI , Fumimasa KATAGIRI
发明人： Michio HORIUCHI , Yasue TOKUTAKE , Shigeaki SUGANUMA , Naoyuki KOIZUMI , Fumimasa KATAGIRI
IPC分类号： H05K1/18 , H01R12/06 , B23K37/00
CPC分类号： B23K20/004 , B23K1/0016 , B23K2101/42 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15174 , H01L2924/15311 , H01L2924/19107 , H05K1/111 , H05K3/222 , H05K3/4611 , H05K2201/0355 , H05K2201/10287 , H01L2924/00012
摘要： A multilayer wiring board is so constituted that: a group of electronic part mounting capture pads are provided on one surface thereof; a first wiring layer formed on an uppermost layer thereof includes a first connection part arranged on the same surface as the surface where the pads are provided, and a second connection part spaced from the first connection part; the pad and the first connection part are electrically connected through a conductor wire, and the conductor wire is provided in a first insulating layer laminated on the first wiring layer; and the first connection part is connected linearly or curvedly to the second connection part through a first wiring pattern.
摘要翻译：多层布线板的结构是：一组电子部件安装捕获垫设置在其一个表面上; 形成在其最上层的第一布线层包括布置在与设置有焊盘的表面相同的表面上的第一连接部分和与第一连接部分间隔开的第二连接部分; 所述焊盘和所述第一连接部分通过导线电连接，并且所述导线设置在层压在所述第一布线层上的第一绝缘层中; 并且第一连接部分通过第一布线图形线性地或弯曲地连接到第二连接部分。

44. 发明申请

US20080185181A1 Alternating via fanout patterns 审中-公开
标题翻译：交替通过扇出模式
公开(公告)号：US20080185181A1
公开(公告)日：2008-08-07
申请号：US11983797
申请日：2007-11-08
申请人： Charles L. Pfeil
发明人： Charles L. Pfeil
IPC分类号： H01R12/06 , H05K3/40
CPC分类号： H05K1/114 , H05K3/429 , H05K2201/09227 , H05K2201/09509 , H05K2201/09536 , H05K2201/10734 , Y10T29/49147
摘要： Various techniques are disclosed for identifying different fanout via configurations that can be created using fanout vias, and then arranging those fanout via configurations in an alternating manner in order to increase the amount and/or area of routing channels available to route traces to the fanout vias. According to some of these techniques, a first fanout via configuration is selected, which can connect a component pin to a first layer of a multilayer printed circuit board. Next, a second fanout via configuration is selected, which can connect a component pin to a second layer of a multilayer printed circuit board different from the first layer. When the printed circuit board is designed, lines of these vias configurations are formed to correspond to a component that will be mounted on the printed circuit board. Each line will have a series of the first fanout via configuration alternating with a series of the second fanout via configuration. Further, two or more fanout via configurations of the same type can be arranged into a via configuration model. A printed circuit board design may then have lines of different via configuration models, such that each line has a series of one type of fanout via configuration model alternating with a series of another type of via fanout configuration model. Alternately or additionally, yet another type of fanout via configuration may be identified. Fanout via configurations of this other type may then be placed along a diagonal line bisecting the area of a printed circuit board design corresponding to the location at which a component will be mounted, in order to preserve routing channel area along the diagonal line.
摘要翻译：公开了各种技术，用于识别可以使用扇出通孔创建的不同扇出通孔配置，然后以交替方式布置这些扇出通道配置，以便增加可用于将迹线路由到扇出通孔的量和/或面积。根据这些技术中的一些，选择第一扇出通孔配置，其可以将部件引脚连接到多层印刷电路板的第一层。接下来，选择第二扇出通孔配置，其可以将部件引脚连接到与第一层不同的多层印刷电路板的第二层。当设计印刷电路板时，这些通孔配置的线形成为对应于将安装在印刷电路板上的部件。每行将通过配置与一系列第二扇出通道配置交替配置一系列第一扇出。此外，可以将相同类型的两个或多个扇出通孔配置布置成通孔配置模型。然后，印刷电路板设计可以具有不同通孔配置模型的线，使得每条线通过配置模型具有一系列一种类型的扇出，与一系列另一类型的通孔扇出配置模型交替。可选地或另外地，可以识别另一种类型的扇出通孔配置。然后，通过这种其他类型的配置的扇出可以沿着对应于对准于将要安装组件的位置的印刷电路板设计的区域的对角线放置，以便沿着对角线保留路由信道区域。

45. 发明申请

US20070209831A1 SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, MULTI-LAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD 有权
标题翻译：半导体元件，制造半导体元件的方法，多层印刷电路板以及制造多层印刷电路板的方法
公开(公告)号：US20070209831A1
公开(公告)日：2007-09-13
申请号：US11747972
申请日：2007-05-14
申请人： Hajime Sakamoto , Dongdong Wang
发明人： Hajime Sakamoto , Dongdong Wang
IPC分类号： H01R12/06
CPC分类号： H01L23/49838 , H01L21/568 , H01L21/6835 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49866 , H01L23/49894 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/27 , H01L24/97 , H01L2224/0401 , H01L2224/04105 , H01L2224/1147 , H01L2224/12105 , H01L2224/20 , H01L2224/24137 , H01L2224/24227 , H01L2224/274 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/73267 , H01L2224/92244 , H01L2224/94 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/30107 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/09036 , H05K2201/09563 , H05K2201/096 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2224/82 , H01L2924/3512 , H01L2924/00 , H01L2224/03
摘要： A transition layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit board 10 without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on an aluminum pad 24, it is possible to prevent a resin residue on the pad 24 and to improve connection characteristics between the die pad 24 and a via hole 60 and reliability.
摘要翻译：过渡层38设置在IC芯片20的芯片焊盘22上并集成到多层印刷电路板10中。由此，可以不使用引线部件和密封树脂将IC芯片20电连接到多层印刷电路板10。此外，通过在铝焊盘24上设置由铜制成的过渡层38，可以防止焊盘24上的树脂残留物并改善管芯焊盘24和通孔60之间的连接特性，并且可靠性。

46. 发明申请

US20050181642A1 TRANSMISSION MODULE ASSEMBLY HAVING PRINTED CIRCUIT BOARD 有权
标题翻译：具有印刷电路板的传输模块组件
公开(公告)号：US20050181642A1
公开(公告)日：2005-08-18
申请号：US10778702
申请日：2004-02-12
申请人： Eric Juntwait
发明人： Eric Juntwait
IPC分类号： H01R12/00 , H01R12/06 , H01R12/34 , H01R13/506 , H01R13/52 , H01R13/648 , H01R13/658 , H01R13/66 , H05K1/00 , H05K5/00
CPC分类号： H01R12/585 , H01R13/6594 , H01R13/6596 , H01R13/6599 , H01R13/6658 , Y10S439/936
摘要： A module assembly includes a module cover including a bottom wall, a front wall, a rear wall and two opposite side walls defining a receiving cavity therebetween, an electrical connector and a printed circuit board both received in the receiving cavity and a cover member covering the receiving cavity. The module cover has a mating portion with a mating space defined therein. The front wall defines passageways communicating with the receiving cavity and the mating space. The connector includes an insulating housing and a number of terminals retained in the housing. Each terminal includes an engaging portion extending beyond a front face of the housing into the mating space through a corresponding passageway and a press-tail extending upwardly beyond a top face of the housing. The printed circuit board defines plated through holes compliantly receiving the press-fit tails of the terminals.
摘要翻译：模块组件包括模块盖，模块盖包括底壁，前壁，后壁和在其间限定接收腔的两个相对的侧壁，两个容纳在容纳空腔中的电连接器和印刷电路板，以及覆盖接收腔。模块盖具有与其中限定的配合空间的配合部分。前壁限定了与接收腔和配合空间连通的通道。连接器包括绝缘壳体和保持在壳体中的多个端子。每个端子包括通过对应的通道延伸超过壳体的前表面到配合空间中的接合部分，以及向上延伸超过壳体的顶面的按压尾部。印刷电路板定义了顺应地接收端子压配尾部的电镀通孔。

47. 发明授权

US06926540B1 Transmission module assembly having printed circuit board 有权
标题翻译：传输模块组件具有印刷电路板
公开(公告)号：US06926540B1
公开(公告)日：2005-08-09
申请号：US10778702
申请日：2004-02-12
申请人： Eric D. Juntwait
发明人： Eric D. Juntwait
IPC分类号： H01R12/00 , H01R12/06 , H01R12/34 , H01R13/506 , H01R13/52 , H01R13/648 , H01R13/658 , H01R13/66 , H05K1/00 , H05K5/00
CPC分类号： H01R12/585 , H01R13/6594 , H01R13/6596 , H01R13/6599 , H01R13/6658 , Y10S439/936
摘要： A module assembly includes a module cover including a bottom wall, a front wall, a rear wall and two opposite side walls defining a receiving cavity therebetween, an electrical connector and a printed circuit board both received in the receiving cavity and a cover member covering the receiving cavity. The module cover has a mating portion with a mating space defined therein. The front wall defines passageways communicating with the receiving cavity and the mating space. The connector includes an insulating housing and a number of terminals retained in the housing. Each terminal includes an engaging portion extending beyond a front face of the housing into the mating space through a corresponding passageway and a press-tail extending upwardly beyond a top face of the housing. The printed circuit board defines plated through holes compliantly receiving the press-fit tails of the terminals.
摘要翻译：模块组件包括模块盖，模块盖包括底壁，前壁，后壁和在其间限定接收腔的两个相对的侧壁，两个容纳在容纳空腔中的电连接器和印刷电路板，以及覆盖接收腔。模块盖具有与其中限定的配合空间的配合部分。前壁限定了与接收腔和配合空间连通的通道。连接器包括绝缘壳体和保持在壳体中的多个端子。每个端子包括通过对应的通道延伸超过壳体的前表面到配合空间中的接合部分，以及向上延伸超过壳体的顶面的按压尾部。印刷电路板限定了通过端子接合压合尾部的电镀通孔。

48. 发明授权

US06903935B1 Memory card with a static electricity conducting board 失效
标题翻译：存储卡带静电导电板
公开(公告)号：US06903935B1
公开(公告)日：2005-06-07
申请号：US10893646
申请日：2004-07-16
申请人： Tien-Tzu Chen
发明人： Tien-Tzu Chen
IPC分类号： G06K19/077 , H01L23/06 , H01R12/51 , H05K1/14 , H05K5/02 , H01R12/06
CPC分类号： G06K19/07735 , G06K19/077
摘要： A memory card with a static electricity conducting board has a circuit board, a partitioning board and a conducting board. The circuit board has two contacts. The partitioning board is mounted on the board and has two slots. The conducting board is mounted on the partitioning board and has two conducting tabs located respectively inside the slots and pressing respectively against the contacts on the circuit board. The conducting board attracts static electricity on the circuit board and the chip and keeps the circuit board and the chip from being damaged by the static electricity.
摘要翻译：具有静电导电板的存储卡具有电路板，分隔板和导电板。电路板有两个触点。分隔板安装在电路板上，并有两个插槽。导电板安装在分隔板上，分别位于槽内并分别压靠在电路板上的触头上的两个导电片。导电板在电路板和芯片上吸引静电，保持电路板和芯片免受静电损坏。

49. 发明授权

US06863542B2 Interconnecting structure for electrically connecting two printed circuit boards 失效
标题翻译：用于电连接两个印刷电路板的互连结构
公开(公告)号：US06863542B2
公开(公告)日：2005-03-08
申请号：US10367809
申请日：2003-02-19
申请人： Ikuhito Miyashita
发明人： Ikuhito Miyashita
IPC分类号： H01R12/06 , H01R13/02 , H05K1/14 , H01R12/00
CPC分类号： H01R12/52 , H01R12/592 , H01R12/7023 , H01R12/7052 , H01R12/7082 , H01R13/025
摘要： Disclosed is a printed circuit board-interconnecting structure for integrating two printed circuit boards in a state of being electrically connected. The manufacturing cost is minimized. The board integrating structure permits the automatization of assembling parts, and can meet the occasional requirements for changing the inter-distance between the confronting printed circuit boards. Each printed circuit board has an ordinary connector attached to one side, and a rectangular hollow socket is sandwiched between the confronting printed circuit boards to enclose the connectors, and a short length of flexible flat cable lined with a reinforcement piece traverses the inter-space between the confronting connectors forts conductors to be put in contact with the terminals of the connectors.
摘要翻译：公开了一种印刷电路板互连结构，用于将电连接的两个印刷电路板集成。制造成本最小化。电路板集成结构允许组装部件自动化，可以满足改变面对印刷电路板之间的距离的偶尔要求。每个印刷电路板都有一个连接在一侧的普通连接器，一个矩形的中空插座被夹在相对的印刷电路板之间，以封闭连接器，短长度的带有加强件的柔性扁平电缆横穿第面对的连接器导体将与连接器的端子接触。

50. 发明授权

US5993269A Connecting pin having electrically conductive magnetic fluid 失效
标题翻译：具有导电磁性流体的连接销
公开(公告)号：US5993269A
公开(公告)日：1999-11-30
申请号：US993630
申请日：1997-12-18
申请人： Atsushi Ito
发明人： Atsushi Ito
IPC分类号： H01F1/34 , H01R12/06 , H01R13/02 , H01R13/24 , H01R39/64
CPC分类号： H01R13/2421 , H01R39/646 , H01R13/02
摘要： A connector pin which has a structure wherein a pin which can be moved by a spring is kept in contact with a casing by way of connecting member, an electrically conductive magnetic fluid is sustained in the casing, and the casing and the connecting member are magnetized. Owing to this structure, the connector pin is capable of extremely reducing production of metal powders in the casing and has a prolonged service life. Since the electrically conductive magnetic fluid can be sustained by magnetizing the parts composing the connector pin, no sealing member is required for sealing the electrically conductive magnetic fluid and the connector pin has a remarkably simplified structure.
摘要翻译：具有这样的结构的连接器销，其中可以通过弹簧移动的销与通过连接构件与壳体保持接触，导电的磁性流体被保持在壳体中，并且壳体和连接构件被磁化。由于该结构，连接器销能够极大地减少壳体中的金属粉末的生产，并且具有延长的使用寿命。由于可以通过磁化构成连接器销的部件来维持导电磁性流体，所以不需要密封构件来密封导电磁性流体，并且连接器销具有非常简化的结构。

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