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41. 发明申请

US20180133843A1 BONDING WIRE FOR SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：US20180133843A1
公开(公告)日：2018-05-17
申请号：US15851554
申请日：2017-12-21
申请人： NIPPON MICROMETAL CORPORATION , NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
发明人： Takashi YAMADA , Daizo ODA , Teruo HAIBARA , Ryo OISHI , Kazuyuki SAITO , Tomohiro UNO
IPC分类号： B23K35/02 , H01L23/00 , C22C9/04 , C22C9/06 , B23K35/30
摘要： A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof. Containing an element that provides bonding reliability in a high-temperature environment improves the bonding reliability of the ball bonded part in high temperature. Furthermore, making an orientation proportion of a crystal orientation angled at 15 degrees or less to a wire longitudinal direction among crystal orientations in the wire longitudinal direction 30% or more when measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, and making an average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire 0.9 to 1.5 μm provides a strength ratio of 1.6 or less.

42. 发明授权

US09909196B2 High-purity copper-cobalt alloy sputtering target 有权
公开(公告)号：US09909196B2
公开(公告)日：2018-03-06
申请号：US14759424
申请日：2014-02-19
申请人： JX Nippon Mining & Metals Corporation
发明人： Kenichi Nagata , Tomio Otsuki
IPC分类号： C22C9/06 , H01J37/34 , C22F1/08 , C23C14/16 , C23C14/34
CPC分类号： C22C9/06 , C22F1/08 , C23C14/165 , C23C14/3414 , H01J37/3429
摘要： A high purity copper-cobalt alloy sputtering target containing 0.1 to 20 at % of Co, and remainder being Cu and unavoidable impurities, wherein a size (dimension) of precipitates in the target structure is 10 μm or less, and a number of precipitates is 500 precipitates/mm2 or less. It is thereby possible to provide a high purity copper-cobalt alloy sputtering target capable of inhibiting the generation of particles during sputtering, and in particular improving the yield and reliability of semiconductor products that are being subject to further miniaturization and higher integration.

43. 发明授权

US09856914B2 Joint bearing lubricant system 有权
公开(公告)号：US09856914B2
公开(公告)日：2018-01-02
申请号：US14842482
申请日：2015-09-01
申请人： The Boeing Company
发明人： Daniel J. Kane
IPC分类号： F16C33/10 , C22C9/02 , F16C33/12 , F16C33/14 , C22C9/06 , F16C17/02
CPC分类号： F16C33/1095 , C22C9/02 , C22C9/06 , F16C17/02 , F16C33/10 , F16C33/102 , F16C33/109 , F16C33/121 , F16C33/14 , F16C2204/10 , F16C2223/06 , F16C2223/30 , F16C2231/00 , F16C2240/54 , F16C2326/43 , Y10T29/49638
摘要： A bearing assembly is disclosed having a wearing surface formed from an alloying including tin, a wear material configured to be contacted by the wearing material during use, and the wear material having a smoothed surface. A method of providing superlubricious performance of a bearing assembly is also provided.

44. 发明申请

US20170365238A1 Electric Guitar Strings of Magnetic Copper Alloys 审中-公开
公开(公告)号：US20170365238A1
公开(公告)日：2017-12-21
申请号：US15622582
申请日：2017-06-14
申请人： Materion Corporation
发明人： Ryan C. Elliott
IPC分类号： G10D3/10 , G10D1/00 , C22F1/08 , C22F1/00 , C22C9/06 , G10H3/18 , C22C9/05
CPC分类号： G10D3/10 , C22C9/02 , C22C9/05 , C22C9/06 , C22F1/002 , C22F1/08 , G10D1/00 , G10D1/005 , G10D1/085 , G10D3/00 , G10H3/18
摘要： Guitar strings made of a magnetic copper-nickel-tin-manganese alloy are disclosed. Also disclosed are processing steps that can be performed to fabricate the guitar strings from the alloy. Further described herein are alternative uses for the strings on other electric stringed instruments.

45. 发明申请

US20170349974A1 COPPER ALLOY AND ITS USES 审中-公开
公开(公告)号：US20170349974A1
公开(公告)日：2017-12-07
申请号：US15475781
申请日：2017-03-31
申请人： WIELAND-WERKE AG
发明人： Igor ALTENBERGER , Hans-Achim KUHN
IPC分类号： C22C9/06
CPC分类号： C22C9/06 , C22C9/01 , F16C33/121 , F16C2202/06 , F16C2202/32 , F16C2204/10
摘要： The invention relates to a copper alloy having the following composition (in % by weight): from 10.6 to 18% of Al, from 10.5 to 14.5% of Ni, optionally up to 2% of Fe, optionally up to 1% of Co, optionally up to 0.5% of Ti, optionally up to 0.5% of Mn, optionally up to 0.15% of B, optionally up to 0.1% of Ca, optionally up to 0.1% of C, a balance copper and unavoidable impurities. Nickel aluminides of the NiAl type are embedded as precipitates in the microstructure of the alloy. The invention further relates to a number of uses of this copper alloy.

46. 发明申请

US20170333987A1 METAL POWDER, METHOD OF PRODUCING ADDITIVELY-MANUFACTURED ARTICLE, AND ADDITIVELY-MANUFACTURED ARTICLE 有权
公开(公告)号：US20170333987A1
公开(公告)日：2017-11-23
申请号：US15657300
申请日：2017-07-24
申请人： DAIHEN CORPORATION , TECHNOLOGY RESEARCH INSTITUTE OF OSAKA PREFECTURE
发明人： Ryusuke TSUBOTA , Junichi TANAKA , Yohei OKA , Takayuki NAKAMOTO , Takahiro SUGAHARA , Mamoru TAKEMURA , Sohei UCHIDA
IPC分类号： B22F1/00 , C22C9/06 , C22C9/10 , B22F3/105 , B22F3/24 , C22C9/00 , C22C1/04 , B33Y10/00 , B33Y70/00 , B33Y80/00
摘要： A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.

47. 发明授权

US09790575B2 Electric and electronic part copper alloy sheet with excellent bending workability and stress relaxation resistance 有权
公开(公告)号：US09790575B2
公开(公告)日：2017-10-17
申请号：US14886720
申请日：2015-10-19
申请人： Kobe Steel, Ltd.
发明人： Shinya Katsura
IPC分类号： C22C9/06 , C22F1/08 , C22C9/04
CPC分类号： C22C9/06 , C22C9/04 , C22F1/08 , H01L2924/0002 , H01L2924/00
摘要： An electric and electronic part copper alloy sheet with excellent bending workability and stress relaxation resistance is made from a copper alloy containing 1.5 to 4.0 percent by mass of Ni, Si satisfying a Ni/Si mass ratio of 4.0 to 5.0, 0.01 to 1.3 percent by mass of Sn, and the remainder composed of copper and incidental impurities, wherein the average crystal grain size is 5 to 20 μm, the standard deviation of the crystal grain size satisfies 2σ

48. 发明授权

US09698554B2 Female terminal fabricating method 有权
公开(公告)号：US09698554B2
公开(公告)日：2017-07-04
申请号：US14693990
申请日：2015-04-23
申请人： Yazaki Corporation , DOWA METALTECH CO., LTD.
发明人： Atsushi Kubodera , Hisashi Suda
IPC分类号： H01S4/00 , H01R43/16 , C22C9/06 , H01R13/03 , C22C9/00 , H01R13/11
CPC分类号： H01R43/16 , C22C9/00 , C22C9/06 , H01R13/03 , H01R13/11 , Y10T29/49204
摘要： A female terminal includes a box portion which is formed into a quadrangular prism-like shape so as for a tab of a male terminal to fit therein by bending a copper alloy plate which is obtained by being continuously and repeatedly bent before an age heat treatment is applied thereto, which has a proof stress of 700 MPa or larger and a width of 10 mm or larger and in which no crack is produced therein when bent 180 degrees about a bending axis which is at right angle to a rolling direction of the copper alloy plate. The box portion comprises notches which are formed in inner sides of bent portions produced by bending the copper alloy plate. A depth of the notch is set to be in the range from ¼ to ½ of a thickness of the copper alloy plate.

49. 发明授权

US09586256B2 Forging method and forging die 有权
标题翻译：锻造方法和锻造模具
公开(公告)号：US09586256B2
公开(公告)日：2017-03-07
申请号：US14474645
申请日：2014-09-02
申请人： NGK Insulators, Ltd.
发明人： Hiromi Miura , Naokuni Muramatsu
IPC分类号： B21J5/02 , B21J13/02 , B21J13/14 , C22C9/00 , C22C9/06 , C22C38/00 , C22C38/18 , C22F1/08 , C22C21/10 , C22C23/02 , B21J1/00
CPC分类号： B21J5/02 , B21J1/006 , B21J5/025 , B21J13/02 , B21J13/14 , C22C9/00 , C22C9/06 , C22C21/10 , C22C23/02 , C22C38/00 , C22C38/18 , C22F1/08
摘要： A forging method according to the present invention includes the steps of placing a work having a first shape which is a rectangular hexahedron in a work space of a forging die which has a rectangular opening, which is formed by rectangular plane wall portions, and which is provided with the work space to hold the work in a placement step and applying a plastic strain to the work by deforming the placed work into a second shape which is a rectangular hexahedron in a working step, with the placement step and the working step being performed at least two times.
摘要翻译：根据本发明的锻造方法包括以下步骤：将具有矩形六面体的第一形状的工件放置在由矩形平面壁部分形成的具有矩形开口的锻造模具的工作空间中，并且其是设置有工作空间，以将工件保持在放置步骤中，并且通过在工作步骤中将放置的工件变形为矩形六面体的第二形状而将工件施加塑性应变，其中执行放置步骤和工作步骤至少两次。

50. 发明申请

US20170044651A1 COPPER ALLOY SHEET STRIP WITH SURFACE COATING LAYER EXCELLENT IN HEAT RESISTANCE 审中-公开
标题翻译：铜合金板条表面涂层优良耐热性
公开(公告)号：US20170044651A1
公开(公告)日：2017-02-16
申请号：US15118758
申请日：2015-02-13
申请人： KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.)
发明人： Masahiro TSURU , Daisuke HASHIMOTO
IPC分类号： C22F1/08 , C22C9/02 , B22D7/00 , H01R13/03 , C25D3/30 , C25D3/20 , C25D3/12 , C22C9/06 , C25D3/38
CPC分类号： C22F1/08 , B22D7/005 , C22C9/02 , C22C9/04 , C22C9/06 , C23C28/02 , C23C28/023 , C25D3/12 , C25D3/20 , C25D3/30 , C25D3/38 , C25D5/10 , C25D5/34 , C25D5/505 , H01R13/03 , H01R2201/26
摘要： Disclosed is a copper alloy sheet strip with a surface coating layer, including a copper alloy sheet strip, as a base material, consisting of Ni: 0.4 to 2.5% by mass, Sn: 0.4 to 2.5% by mass, and P: 0.027 to 0.15% by mass, a mass ratio Ni/P between the Ni content to the P content being less than 25, as well as any one of Fe: 0.0005 to 0.15% by mass, Zn: 1% by mass or less, Mn: 0.1% by mass or less, Si: 0.1% by mass or less, and Mg: 0.3% by mass or less, with the balance being Cu and inevitable impurities, and having a structure in which precipitates are dispersed in a copper alloy matrix, each precipitate having a diameter of 60 nm or less, 20 or more precipitates each having a diameter of 5 nm or more and 60 nm or less being observed in the visual field of 500 nm×500 nm; and the surface coating layer composed of a Ni layer, a Cu—Sn alloy layer, and a Sn layer formed on a surface of the copper alloy sheet strip in this order; wherein the Ni layer has an average thickness of 0.1 to 3.0 μm, the Cu—Sn alloy layer has an average thickness of 0.1 to 3.0 μm, and the Sn layer has an average thickness of 0.05 to 5.0 μm; wherein the Cu—Sn alloy layer is partially exposed on the outermost surface of the surface coating layer and a surface exposed area ratio thereof is in a range of 3 to 75%; and wherein the Cu—Sn alloy layer is composed of: 1) a η layer, or 2) a ε phase and a η phase, the ε phase existing between the Ni layer and the η phase, a ratio of the average thickness of the ε phase to the average thickness of the Cu—Sn alloy layer being 30% or less, and a ratio of the length of the ε phase to the length of the Ni layer being 50% or less.
摘要翻译：公开了一种具有表面被覆层的铜合金板条，其包括作为基材的铜合金板条，由Ni组成：0.4〜2.5质量％，Sn：0.4〜2.5质量％，P：0.027〜 0.15质量％，Ni含量与P含量之间的Ni / P的质量比小于25，Fe：0.0005〜0.15质量％，Zn：1质量％以下，Mn： 0.1质量％以下，Si：0.1质量％以下，Mg：0.3质量％以下，余量为Cu和不可避免的杂质，并且具有将析出物分散在铜合金基体中的结构，每个沉淀物具有60nm或更小的直径，在500nm×500nm的视野中观察到直径为5nm以上且60nm以下的20个以上的析出物; 以及依次形成在铜合金板条的表面上的Ni层，Cu-Sn合金层和Sn层构成的表面被覆层。其中Ni层的平均厚度为0.1〜3.0μm，Cu-Sn合金层的平均厚度为0.1〜3.0μm，Sn层的平均厚度为0.05〜5.0μm，其中所述Cu-Sn合金层部分地暴露在所述表面涂层的最外表面上，并且其表面暴露面积比在3至75％的范围内; 并且其中所述Cu-Sn合金层由以下组成：1）η层，或2）ε相和η相，存在于所述Ni层和所述η相之间的ε相， ε相相对于Cu-Sn合金层的平均厚度为30％以下，ε相的长度与Ni层的长度的比例为50％以下。

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