专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

41. 发明申请

US20120077359A1 WIRING STRUCTURE AND JOINT BOX INCLUDING THE SAME 有权
标题翻译：接线结构和接线盒包括相同
公开(公告)号：US20120077359A1
公开(公告)日：2012-03-29
申请号：US13233160
申请日：2011-09-15
申请人： Takeyoshi YAMAMOTO , Keisuke TAKAHASHI , Yoshikatsu HASEGAWA
发明人： Takeyoshi YAMAMOTO , Keisuke TAKAHASHI , Yoshikatsu HASEGAWA
IPC分类号： H01R12/51
CPC分类号： H05K3/4046 , H01R12/58 , H05K3/202 , H05K3/4611 , H05K2201/09581 , H05K2201/0969 , H05K2201/10303 , H05K2201/10833
摘要： A wiring structure includes a board assembly and pin terminals. In each of pin terminal insertion holes formed in the board assembly, a terminal connection portion electrically connected to a metal foil wire and fitted onto the pin terminal so as to hold the pin terminal is provided in a through-hole of at least one of a plurality of circuit boards forming the board assembly, which forms a part of the pin terminal insertion hole, whereas an insulating sleeve blocking contact between the pin terminal and each of the remaining circuit boards is fitted into through-holes of the remaining circuit boards, which form the remaining part of the pin terminal insertion hole.
摘要翻译：布线结构包括板组件和销端子。在形成在板组装体中的每一个销端子插入孔中，与金属箔线电连接并安装在销端子上以便固定销端子的端子连接部分设置在至少一个形成板组件的多个电路板，其形成销端子插入孔的一部分，而将引脚端子和每个剩余电路板之间的绝缘套筒阻塞接触装配到剩余电路板的通孔中，形成销端子插入孔的剩余部分。

42. 发明授权

US08139377B2 IC device and method of manufacturing the same 有权
标题翻译： IC器件及其制造方法
公开(公告)号：US08139377B2
公开(公告)日：2012-03-20
申请号：US12215968
申请日：2008-07-01
申请人： Naoya Tanaka
发明人： Naoya Tanaka
IPC分类号： H05K7/00
CPC分类号： H05K3/284 , H05K3/3405 , H05K2201/10303 , H05K2201/1034 , H05K2201/10424 , H05K2203/1316 , Y10T29/49002
摘要： An IC device includes a base plate, a plurality of terminal pins, a functional component such as an IC chip, and a resin package for protection of the functional component. The base plate is generally flat and formed with a plurality of through-holes into which the terminal pins are inserted. The functional component, disposed away from the base plate, is mounted on a printed circuit board to be electrically connected to at least one of the terminal pins. While enclosing the functional component, the resin package is held in contact with the upper surface of the base plate.
摘要翻译： IC器件包括基板，多个端子引脚，诸如IC芯片的功能部件和用于保护功能部件的树脂封装。基板通常是平坦的，并且形成有多个通孔，端子销插入该通孔中。远离基板设置的功能部件安装在印刷电路板上，以与至少一个端子引脚电连接。在封装功能部件的同时，树脂封装件与基板的上表面保持接触。

43. 发明授权

US08014159B2 Printed circuit board with optimized mounting holes and alignment pins 有权
标题翻译：印刷电路板，具有优化的安装孔和对准针
公开(公告)号：US08014159B2
公开(公告)日：2011-09-06
申请号：US12429915
申请日：2009-04-24
申请人： Drew G. Doblar , Gurpreet S. Dayal
发明人： Drew G. Doblar , Gurpreet S. Dayal
IPC分类号： H05K5/00
CPC分类号： H05K7/1454 , H05K1/0271 , H05K3/366 , H05K2201/044 , H05K2201/10189 , H05K2201/10303 , H05K2201/10409 , H05K2201/10545 , H05K2201/2009 , H05K2203/167
摘要： A mounting plane assembly (e.g., backplane or midplane) is provided for interconnecting a plurality of daughterboards in a server computer. The mounting plane assembly includes a printed circuit board (“PCB”) that has a plurality of shared mounting holes for attaching connector alignment pins to a front side of the PCB as well as mechanical support elements to a back side of the PCB through the same mounting holes.
摘要翻译：提供了一种安装平面组件（例如背板或中平面），用于互连服务器计算机中的多个子板。安装平面组件包括印刷电路板（“PCB”），该印刷电路板具有多个共用的安装孔，用于将连接器对准销连接到PCB的正面以及通过其连接到PCB背面的机械支撑元件安装孔。

44. 发明申请

US20110192641A1 MOUNTING BOARD AND METHOD OF MANUFACTURE 有权
标题翻译：安装板及其制造方法
公开(公告)号：US20110192641A1
公开(公告)日：2011-08-11
申请号：US13123814
申请日：2009-12-22
申请人： Hideki Goto
发明人： Hideki Goto
IPC分类号： H05K1/11 , H05K3/34
CPC分类号： H05K3/306 , H01R12/7082 , H01R12/91 , H05K3/3447 , H05K2201/10189 , H05K2201/10303 , H05K2201/10424 , H05K2201/10537 , Y10T29/49149
摘要： A mounting board having a plurality of terminals. The ends of each of the plurality of terminals are inserted into and soldered to through-holes positioned in a printed board, and the terminals are mounted on the printed board. A plurality of pedestals are disposed on one side of the printed board. The pedestals support the terminals. The pedestals are integrally coupled to one another through deformable coupling portions. Mutual displacements among the pedestals are allowed by the coupling portions.
摘要翻译：具有多个端子的安装板。将多个端子中的每一个的端部插入并焊接到位于印刷电路板中的通孔中，并将端子安装在印刷电路板上。多个基座设置在印刷电路板的一侧。支架支撑端子。基座通过可变形的联接部分彼此一体地联接。通过联接部允许基座之间的相互位移。

45. 发明申请

US20110134597A1 PRINTED CIRCUIT BOARD HAVING A NON-PLATED HOLE WITH LIMITED DRILL DEPTH 有权
标题翻译：印刷电路板有一个有限的钻孔深度的非镀层孔
公开(公告)号：US20110134597A1
公开(公告)日：2011-06-09
申请号：US12630677
申请日：2009-12-03
申请人： Mark E. Andresen , Virginia Ott
发明人： Mark E. Andresen , Virginia Ott
IPC分类号： H05K1/18 , G06F1/16 , H01R9/00
CPC分类号： H05K3/308 , H05K3/0047 , H05K2201/044 , H05K2201/09509 , H05K2201/10303 , H05K2201/10545 , H05K2201/10871 , H05K2203/0207 , Y10T29/4913 , Y10T29/49144 , Y10T29/49147 , Y10T29/49165
摘要： A printed circuit board and method of making a print circuit board having one or more holes that are controllably drilled to extend into the printed circuit board substrate to a predetermined depth intermediate first and second faces. A mechanical locating pin is received into each of the one or more holes to mechanically align a first component for electronically interfacing with the printed circuit board substrate. A second component is installed on the second face directly opposite of the one or more holes such that the second component is in electronic communication with conductive traces or interconnects formed on the second face directly opposite of the hole.
摘要翻译：一种印刷电路板和制造具有一个或多个孔的印刷电路板的方法，所述孔被可控制地钻出以延伸到印刷电路板基板中到第一和第二面之间的预定深度。机械定位销被接收到一个或多个孔中的每一个中，以机械对准用于与印刷电路板基板电子接口的第一部件。第二部件安装在与一个或多个孔直接相对的第二面上，使得第二部件与形成在与孔直接相对的第二面上的导电迹线或互连电子连通。

46. 发明申请

US20110110059A1 APPARATUS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES 有权
标题翻译：电子设备热管理装置及方法
公开(公告)号：US20110110059A1
公开(公告)日：2011-05-12
申请号：US13004327
申请日：2011-01-11
申请人： Zdenko GRAJCAR
发明人： Zdenko GRAJCAR
IPC分类号： H01R9/00 , H05K1/18
CPC分类号： H05K1/0204 , H01L2224/48091 , H01L2224/48227 , H05K7/205 , H05K2201/10106 , H05K2201/10303 , H01L2924/00014
摘要： An apparatus is disclosed that may include a printed circuit board (PCB) and an electronics package may be disposed about the first surface of the PCB. The PCB may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core. The metal layer may be disposed on a core first surface. The metal layer may comprise metal or other conductive material suitable to define traces, which may be circuit paths for electronic components affixed to the PCB. In some aspects, the core may be electrically non-conducting, and may be thermally insulating, and, accordingly, inhibit the transfer of heat from the electronics package through the PCB. However, pins may be configured to pass through the PCB including the core from the core first surface to the core second surface to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. A pad may be disposed between the electronic package and the core in some embodiments, the pins passing into the pad.
摘要翻译：公开了一种可以包括印刷电路板（PCB）的装置，并且可以围绕PCB的第一表面设置电子封装。 PCB可以包括金属层和芯，并且在一些方面，可以包括插入在多个金属层之间的多个芯，并且在一些实施例中，背板可以沿着芯布置。金属层可以设置在芯部第一表面上。金属层可以包括适于限定迹线的金属或其它导电材料，其可以是固定到PCB的电子部件的电路路径。在一些方面，芯可以是非导电的，并且可以是绝热的，并且因此抑制来自电子封装件的热量通过PCB传递。然而，引脚可以被配置为将包括芯的PCB从芯第一表面通过到芯第二表面，以传导由电子封装件产生的热量用于分散。在一些实施例中，销可以进入背板。在一些实施例中，焊盘可以设置在电子封装和芯之间，引脚穿过焊盘。

47. 发明授权

US07888173B2 Semiconductor device manufacturing method 有权
标题翻译：半导体器件制造方法
公开(公告)号：US07888173B2
公开(公告)日：2011-02-15
申请号：US12382412
申请日：2009-03-12
申请人： Harutaka Taniguchi , Yoshinari Ikeda
发明人： Harutaka Taniguchi , Yoshinari Ikeda
IPC分类号： H01L21/00
CPC分类号： H05K3/34 , H01L23/5385 , H01L24/01 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/83 , H01L24/91 , H01L25/072 , H01L25/50 , H01L2224/26145 , H01L2224/27013 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/83051 , H01L2224/83101 , H01L2224/83365 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0135 , H01L2924/014 , H01L2924/0665 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/157 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H05K1/145 , H05K2201/10166 , H05K2201/10303 , H05K2201/1059 , H05K2201/10962 , H05K2201/10969 , H05K2203/0405 , H01L2924/00 , H01L2924/07025 , H01L2924/01083 , H01L2924/01049 , H01L2924/01028
摘要： A semiconductor device manufacturing method includes the steps of preparing a semiconductor element having a first electrode, a second electrode, and a third electrode facing the first electrode and second electrode, the first electrode and second electrode being electrically separated by an insulating layer; arranging a first conductive bonding material on a first metal foil and placing the semiconductor element on the first conductive bonding material; supporting a sheet-shape second conductive bonding material by the insulating layer; arranging a first post electrode and a second post electrode above the first and second electrodes respectively with the second conductive bonding material intervening therebetween; and forming a first conductive bonding layer for bonding the first electrode and the first post electrode, a second conductive bonding layer for bonding the second electrode and the second post electrode, and a third conductive bonding layer for bonding the third electrode and the first metal foil.
摘要翻译：半导体器件制造方法包括以下步骤：制备具有第一电极，第二电极和与第一电极和第二电极相对的第三电极的半导体元件，第一电极和第二电极通过绝缘层电隔离; 在第一金属箔上布置第一导电接合材料并将半导体元件放置在第一导电接合材料上; 通过绝缘层支撑片状第二导电接合材料; 在所述第一和第二电极上方分别设置第一电极和第二电极，所述第二电极和第二电极分别与所述第二电极和所述第二电极之间插入所述第二电极和第二电极。以及形成用于接合所述第一电极和所述第一电极的第一导电接合层，用于接合所述第二电极和所述第二电极的第二导电接合层，以及用于接合所述第三电极和所述第一金属箔的第三导电接合层。

48. 发明授权

US07875811B2 High speed interposer 失效
标题翻译：高速插入器
公开(公告)号：US07875811B2
公开(公告)日：2011-01-25
申请号：US12010335
申请日：2008-01-24
申请人： David V. Caletka , Frank D. Egitto
发明人： David V. Caletka , Frank D. Egitto
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H05K1/0219 , H01R12/523 , H01R13/2414 , H05K1/113 , H05K3/4046 , H05K3/429 , H05K3/4614 , H05K2201/0959 , H05K2201/09809 , H05K2201/10303 , H05K2201/10378 , Y10T29/49155 , Y10T29/49165
摘要： A high speed interposer which includes a substrate having alternatingly oriented dielectric and conductive layers which form a substrate, openings which extend from one opposing surface of the substrate to a second opposing surface, conductive members positioned within the openings and also extending from surface to surface (and beyond, in some embodiments), and a plurality of shielding members positioned substantially around the conductive members to provide shielding therefore during the passage of high frequency signals through the conductive members.
摘要翻译：高速插入器，其包括具有交替取向的介电层和导电层的基板，其形成基板，从基板的一个相对表面延伸到第二相对表面的开口，定位在开口内并且还从表面延伸到表面的导电构件并且在一些实施例中超越）以及基本上围绕导电构件定位的多个屏蔽构件，从而在高频信号通过导电构件期间提供屏蔽。

49. 发明申请

US20100294544A1 Bending-Type Rigid Printed Wiring Board and Process for Producing the Same 失效
标题翻译：弯曲型刚性印刷电路板及其制造方法
公开(公告)号：US20100294544A1
公开(公告)日：2010-11-25
申请号：US11989679
申请日：2006-07-28
申请人： Atsushi Momota , Ichiro Terunuma , Takeshi Hasegawa , Yasuo Takemura , Yoshifumi Hatakeyama , Hiroshi Harada , Makoto Katoh
发明人： Atsushi Momota , Ichiro Terunuma , Takeshi Hasegawa , Yasuo Takemura , Yoshifumi Hatakeyama , Hiroshi Harada , Makoto Katoh
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： H05K3/4691 , H05K1/036 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K2201/0187 , H05K2201/0195 , H05K2201/10303 , H05K2203/308 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： This invention provides a bending-type rigid printed wiring board that can easily realize mounting of electric components (can realize a plated circuit having high productivity and assembling properties), can realize space saving, and can realize easy production. The bending-type rigid printed wiring board comprises a hard cure material (1) with a space part (1A) inserted thereinto. A heat-resistant resin layer (31) is stacked on the surface of the hard core material (1) and, at the same time, on the upper surface of the space part (1A). A heat-resistant resin layer (32) is stacked on the backside of the core material (1) except for the space part (1A). Further, a conductor layer (4) is stacked and fixed through the heat-resistant resin layers (31, 32). The conductor layer (4) has been etched to form a circuit.
摘要翻译：本发明提供一种能够容易地实现电气部件的安装的弯曲型刚性印刷电路板（能够实现具有高生产率和组装性能的电镀电路），可以实现节省空间，并且可以实现容易的制造。弯曲型刚性印刷线路板包括具有插入其中的空间部分（1A）的硬固化材料（1）。在该硬质材料（1）的表面上叠层耐热树脂层（31），同时在该空间部（1A）的上表面上层叠耐热树脂层。除了空间部分（1A）之外，在芯材（1）的背面上堆叠耐热树脂层（32）。此外，导体层（4）通过耐热树脂层（31,32）堆叠并固定。导体层（4）已被蚀刻以形成电路。

50. 发明授权

US07790985B2 Device for repair of a contact pad of a printed circuit board 有权
标题翻译：用于修复印刷电路板的接触垫的装置
公开(公告)号：US07790985B2
公开(公告)日：2010-09-07
申请号：US12136308
申请日：2008-06-10
申请人： Joseph P. Palmeri , Vincent P. Mulligan
发明人： Joseph P. Palmeri , Vincent P. Mulligan
IPC分类号： H05K1/00
CPC分类号： H05K3/225 , H05K1/113 , H05K3/0047 , H05K3/3447 , H05K3/4046 , H05K2201/09845 , H05K2201/10303 , H05K2203/0191 , H05K2203/0242 , Y10T29/49174 , Y10T29/49179
摘要： Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surface of the printed circuit board in a location that is substantially centered on an axis passing through the via, and a replacement structure is inserted into the countersink hole. The replacement structure has a stem portion, a head portion, and a shoulder portion that connects the stem and head portions, with the angle of the shoulder portion substantially matching the angle of the shoulder of the countersink hole. The stem portion of the replacement structure is permanently attached to sidewalls of the via so as to electrically couple the head portion of the replacement structure to the via.
摘要翻译：提供了用于修复位于印刷电路板的第一表面上并连接到通过电路板的通孔的损坏的接触垫的方法和装置。根据该方法，在印刷电路板的第一表面中形成基本上位于通过通孔的轴的中心的位置上形成埋头孔，并且将更换结构插入到埋头孔中。替换结构具有杆部，头部和肩部，其连接杆和头部，肩部的角度基本上与埋头孔的肩部的角度相匹配。替换结构的杆部分永久地附接到通孔的侧壁，以便将替换结构的头部部分电连接到通孔。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式