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41. 发明申请

US20110034022A1 SEMICONDUCTOR PACKAGE AND FABRICATION METHOD 有权
标题翻译：半导体封装和制造方法
公开(公告)号：US20110034022A1
公开(公告)日：2011-02-10
申请号：US12905540
申请日：2010-10-15
申请人： Junichi Nakamura
发明人： Junichi Nakamura
IPC分类号： H01L21/28
CPC分类号： H05K3/4007 , H01L21/6835 , H01L23/13 , H01L23/49811 , H01L23/49822 , H01L2224/0401 , H01L2224/05568 , H01L2224/16 , H01L2224/16225 , H01L2924/0002 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15159 , H05K3/205 , H05K3/4644 , H05K2201/0367 , H05K2201/09045 , H05K2201/09481 , H05K2203/1536 , H01L2224/05552
摘要： A semiconductor package and a fabrication method thereof are disclosed, whereby an environmental problem is solved by using external connection terminals or semiconductor element-mounting terminals containing a smaller amount of lead, while at the same time achieving a fine pitch of the terminals. The semiconductor package includes a board (20) including a plurality of insulating resin layers, semiconductor element-mounting terminals (18) formed on the uppermost surface of the board, and external connection terminals (12) formed on the bottom surface thereof. Each external connection terminal (12) is formed as a bump projected downward from the bottom surface of the package, and each bump is filled with the insulating resin (14) while the surface thereof is covered by a metal (16). Wiring 124), (26) including a conductor via (26a) electrically connect the metal of the metal layer 16 and the semiconductor element-mounting terminals (18).
摘要翻译：公开了一种半导体封装及其制造方法，通过使用包含较少量的引线的外部连接端子或半导体元件安装端子，同时实现端子的精细间距来解决环境问题。半导体封装包括：多个绝缘树脂层的基板（20），形成在基板的最上表面上的半导体元件安装端子（18）和形成在其底面上的外部连接端子（12）。每个外部连接端子（12）形成为从封装的底表面向下突出的凸起，并且每个凸起都填充有绝缘树脂（14），同时其表面被金属（16）覆盖。包括导体通孔（26a）的布线124），（26）将金属层16的金属与半导体元件安装端子（18）电连接。

42. 发明授权

US07815475B2 Three-dimensional plated support frame 失效
标题翻译：三维电镀支架
公开(公告)号：US07815475B2
公开(公告)日：2010-10-19
申请号：US12340144
申请日：2008-12-19
申请人： Kirk B. Peloza , Victor Zaderej , John Dolaz , Stephen Rushing
发明人： Kirk B. Peloza , Victor Zaderej , John Dolaz , Stephen Rushing
IPC分类号： H01R13/02 , H01R9/24
CPC分类号： H05K1/119 , H05K1/0284 , H05K1/141 , H05K3/185 , H05K3/301 , H05K3/403 , H05K2201/049 , H05K2201/09045 , H05K2201/09118 , H05K2201/10053 , H05K2201/10136 , H05K2201/1059 , H05K2203/107 , Y10S439/931
摘要： A connector assembly of complex shape has a connector body with possesses a plurality of distinct surfaces both parallel and intersecting. Laser directed structuring is used to form patterns of conductive traces on the surfaces of the connector body and raised ribs are formed along the traces and interposed between them to form channels that encompass at least portions of the traces. The raised ribs increase the time in which plating solution can dwell over the laser excited areas and also form abrasion barriers to prevent abrasion for the conductive traces during the plating thereof.
摘要翻译：复杂形状的连接器组件具有连接器主体，其具有平行和相交的多个不同的表面。激光定向结构用于在连接器主体的表面上形成导电迹线图形，并且沿着迹线形成凸起的肋，并且插入在它们之间以形成包围至少部分迹线的通道。凸起的肋条增加了电镀溶液可以停留在激光激发区域上的时间，并且还形成磨损屏障以防止在其镀覆期间导电迹线的磨损。

43. 发明授权

US07794234B2 Electrical connector having a connect portion connecting two contact portions having projections and a drainage at least partially between the projections 有权
标题翻译：电连接器具有将具有突起的两个接触部分连接的连接部分和至少部分地在突出部之间的排水
公开(公告)号：US07794234B2
公开(公告)日：2010-09-14
申请号：US12315305
申请日：2008-12-02
申请人： Naoya Kitajima , Seiya Takahashi , Katsumi Arai
发明人： Naoya Kitajima , Seiya Takahashi , Katsumi Arai
IPC分类号： H01R12/00
CPC分类号： H05K1/118 , H01R12/716 , H01R13/2414 , H05K3/0058 , H05K3/027 , H05K3/365 , H05K2201/0133 , H05K2201/0367 , H05K2201/0373 , H05K2201/09045 , H05K2201/09172 , H05K2201/09663 , H05K2203/0369
摘要： The present invention provides a connector configured to electrically connect two connection objects. The connector comprises an elastic member having a surface and a conductive film placed on the surface of the elastic member. The conductive film comprises two contact portions to be brought into contact with the connection objects, respectively, and a connect portion connecting the contact portions. Each of the contact portions comprises projections and a drainage arranged, at least in part, between the projections.
摘要翻译：本发明提供一种被配置为电连接两个连接对象的连接器。连接器包括具有放置在弹性构件的表面上的表面和导电膜的弹性构件。导电膜包括分别与连接对象接触的两个接触部分和连接接触部分的连接部分。每个接触部分包括至少部分地在突起之间布置的突起和排水。

44. 发明申请

US20100154998A1 ALTERNATE USE FOR LOW VISCOSITY LIQUIDS AND METHOD TO GEL LIQUID 审中-公开
标题翻译：用于低粘度液体的替代方法和凝胶液体的方法
公开(公告)号：US20100154998A1
公开(公告)日：2010-06-24
申请号：US12626363
申请日：2009-11-25
申请人： Qing Yuan Ong
发明人： Qing Yuan Ong
IPC分类号： B01D1/22
CPC分类号： B01D1/22 , H01L21/02617 , H01L21/6715 , H01L22/12 , H01L31/035281 , H01L31/046 , H01L31/1872 , H01L31/1892 , H01L31/202 , H05K1/0284 , H05K3/046 , H05K3/1258 , H05K3/207 , H05K2201/09036 , H05K2201/09045 , H05K2203/0126 , H05K2203/0528 , H05K2203/308 , Y02E10/50 , Y02P70/521
摘要： The present disclosure teaches a method and apparatus to gel a dopant material, which may be a low viscosity liquid, and apply it towards beneficially coating dopant liquid in the manufacture of a three-dimensional thin-film solar cell substrate. As an alternate to using high viscosity dopants, a dopant coating liquid, which is typically distributed in low viscosity alcohol based liquid forms, may instead be utilized as a dopant material in a gelatinous state towards the manufacture of a three-dimensional thin-film solar cell substrate. The methods and devices disclosed herein provide for enhancing the high viscosity characteristics of a dopant material. The present disclosure teaches the use of the dopant material in its gelatinous state towards an exemplary cavity filling method. The more cotable dopant material is applied in an exemplary coating layout and an exemplary integrated coating system to achieve improvements in coating coverage with regards to uniformity, which may be, but is not limited to, homogeneity, color uniformity, opacity, and density of the dopant material.
摘要翻译：本发明公开了一种凝胶化掺杂剂材料的方法和装置，其可以是低粘度液体，并且在制造三维薄膜太阳能电池基板时将其施加到有利地涂覆掺杂剂液体。作为使用高粘度掺杂剂的替代方案，典型地分布在低粘度醇基液体形式中的掺杂剂涂覆液体可以替代地用作凝胶态的掺杂剂材料，以制造三维薄膜太阳能细胞底物。本文公开的方法和装置提供了增强掺杂剂材料的高粘度特性。本公开教导了掺杂剂材料在其凝胶状态下的使用朝向示例性的空腔填充方法。在一个示例性的涂层布局和一个示例性的整体涂层系统中应用较为可套的掺杂剂材料，以实现关于均匀性的涂层覆盖度的改进，其可以但不限于均匀性，颜色均匀性，不透明度和密度掺杂剂材料。

45. 发明申请

US20100139962A1 WIRING BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：接线板及其制造方法
公开(公告)号：US20100139962A1
公开(公告)日：2010-06-10
申请号：US12628284
申请日：2009-12-01
申请人： Kentaro KANEKO
发明人： Kentaro KANEKO
IPC分类号： H05K1/16 , H05K3/00
CPC分类号： H05K3/0014 , H01L21/4857 , H01L21/563 , H01L23/49816 , H01L23/49822 , H01L24/32 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/26175 , H01L2224/27013 , H01L2224/32057 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83051 , H01L2224/83385 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K1/0271 , H05K1/112 , H05K3/305 , H05K3/4682 , H05K2201/09036 , H05K2201/09045 , H05K2201/09136 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , H01L2924/00 , H01L2924/3512 , H01L2224/0401
摘要： A wiring board includes a structure in which a plurality of wiring layers are stacked one on top of another with an insulating layer (resin layer) interposed therebetween, and the wiring layers are connected to each other through a via formed in each of the resin layers. A recessed portion is formed in an annular shape surrounding a chip mounting area on the outermost resin layer on a chip mounting surface side of the wiring board. Alternatively, a projected portion is formed instead of the recessed portion.
摘要翻译：布线基板包括其中多个布线层一层叠置在其上的绝缘层（树脂层）之间的结构，并且布线层通过形成在每个树脂层中的通孔相互连接。凹陷部形成为围绕布线基板的芯片安装面侧的最外层树脂层上的芯片安装区域的环状。或者，形成突出部分而不是凹部。

46. 发明申请

US20100134995A1 Electrical Interconnection System 审中-公开
标题翻译：电气互连系统
公开(公告)号：US20100134995A1
公开(公告)日：2010-06-03
申请号：US12628805
申请日：2009-12-01
申请人： Julie N. Strickland
发明人： Julie N. Strickland
IPC分类号： H05K1/11
CPC分类号： H05K3/365 , H01R12/721 , H01R13/639 , H01R24/60 , H01R2107/00 , H05K1/142 , H05K3/325 , H05K3/4015 , H05K2201/09036 , H05K2201/09045 , H05K2201/09163 , H05K2201/0919 , H05K2201/09845 , H05K2201/10409
摘要： According to one embodiment, an electrical interconnection system includes a pair of printed wiring boards formed of a printed wiring board material. Each printed wiring board has multiple surface pads formed on a surface of the printed wiring board adjacent its outer edge. The surface of each printed wiring board is operable to be placed adjacent to one another such that an electrical circuit coupled to one printed wiring board is electrically coupled to another electrical circuit of the other printed wiring board by contact of the surface pads of each printed wiring board with one another.
摘要翻译：根据一个实施例，电互连系统包括由印刷线路板材料形成的一对印刷线路板。每个印刷电路板具有形成在印刷电路板的与其外边缘相邻的表面上的多个表面焊盘。每个印刷线路板的表面可操作以彼此相邻放置，使得耦合到一个印刷线路板的电路通过每个印刷线路的表面焊盘的接触电耦合到另一个印刷线路板的另一个电路彼此之间。

47. 发明授权

US07713594B2 Method of applying material on a component and component 有权
标题翻译：在材料和组件上施加材料的方法
公开(公告)号：US07713594B2
公开(公告)日：2010-05-11
申请号：US11645829
申请日：2006-12-26
申请人： Knuth Götz , Robert Süβ-Wolf , Marco De Paolis , Dieter Geist
发明人： Knuth Götz , Robert Süβ-Wolf , Marco De Paolis , Dieter Geist
IPC分类号： B05D3/00
CPC分类号： H05K3/14 , B23K26/0006 , B23K26/352 , B23K2103/42 , C23C4/01 , C23C4/02 , H05K3/381 , H05K2201/09045 , H05K2203/107 , H05K2203/1344 , Y10T428/24802
摘要： In order in particular to allow interconnects to be applied to a component (2) by a thermal spraying process in such a way that they are clearly delimited from one another, before the actual spraying process the surface (8) of the component (2) is treated, in particular laser treated, in such a way that a non-adhering region (14) with a nub-like surface structure is formed.
摘要翻译：为了特别地允许通过热喷涂工艺将互连应用于组件（2），使得它们彼此明确地界定，在实际喷涂过程之前，组件（2）的表面（8）被特别地经过激光处理，以形成具有类似表面结构的非粘附区域（14）。

48. 发明申请

US20100112372A1 COMPONENT HAVING A CERAMIC BASE THE SURFACE OF WHICH IS METALIZED 审中-公开
标题翻译：具有金属化表面的陶瓷基体的组分
公开(公告)号：US20100112372A1
公开(公告)日：2010-05-06
申请号：US12596880
申请日：2008-04-17
申请人： Claus Peter Kluge
发明人： Claus Peter Kluge
IPC分类号： B32B3/30 , B32B18/00 , B32B15/04 , B32B3/26 , B32B5/18 , B32B3/00 , C25D7/00 , B32B5/00 , C04B37/02
CPC分类号： C04B37/02 , C04B37/021 , C04B37/026 , C04B2237/121 , C04B2237/122 , C04B2237/123 , C04B2237/124 , C04B2237/125 , C04B2237/34 , C04B2237/343 , C04B2237/348 , C04B2237/365 , C04B2237/366 , C04B2237/368 , H01L23/15 , H01L23/3731 , H01L23/49822 , H01L23/49883 , H01L23/49894 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01021 , H01L2924/01046 , H01L2924/01057 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H05K1/0203 , H05K1/0254 , H05K1/0284 , H05K1/0306 , H05K3/245 , H05K2201/0175 , H05K2201/09045 , Y10T428/12389 , Y10T428/12479 , Y10T428/12576 , Y10T428/12618 , Y10T428/24355 , Y10T428/249953 , Y10T428/26 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A component having a ceramic base the surface of which is covered in at least one area by a metalized coating, the ceramic base being spatially structured and the partial discharge resistance between at least two layers of a metalized structure produced from the same or different materials and between the layer of a metalized structure and the ceramic being
摘要翻译：一种具有陶瓷基体的部件，其表面通过金属化涂层在至少一个区域中被覆盖，陶瓷基体是空间结构的，并且由相同或不同材料制成的至少两层金属化结构之间的部分放电电阻和在金属化结构层和陶瓷之间<20pC。

49. 发明授权

US07688066B2 Rotation detector 有权
标题翻译：旋转检测器
公开(公告)号：US07688066B2
公开(公告)日：2010-03-30
申请号：US11722152
申请日：2006-01-11
申请人： Yuhide Aoki
发明人： Yuhide Aoki
IPC分类号： G01B7/30
CPC分类号： H05K1/0271 , G01D11/245 , H05K1/0284 , H05K1/111 , H05K3/284 , H05K3/3442 , H05K2201/09036 , H05K2201/09045 , H05K2201/10151 , H05K2201/10636 , Y02P70/611
摘要： A rotation detector includes: a magnet to form a magnetic field between the magnet and a rotary member; a magnetism detection element positioned in the proximity of the magnet to detect a variation in the magnetic field due to a rotation of the rotary member; and a signal processing circuit 3 to process a signal from the magnetism detection element and which is coated and sealed with a resin 7, recess portions 14a, 14b which are lower than electrode forming regions 15 are formed at adjoining regions adjacent to electrode forming regions 15 on which surface electrodes 4 are installed and resin 7 is filled within recess portions 14a, 14b. Thus, the rotation detector which can suppress the deficiency generated at a part mounted on a circuit forming portion, at junctions between the part and surface electrodes, or so forth due to expansion and shrinkage involved in a temperature variation can be provided.
摘要翻译：旋转检测器包括：磁体，用于在磁体和旋转部件之间形成磁场; 位于所述磁体附近的磁检测元件，用于检测由所述旋转部件的旋转引起的所述磁场的变化; 以及信号处理电路3，用于处理来自磁检测元件的信号，并用树脂7进行了涂布和密封，低于电极形成区域15的凹部14a，14b形成在与电极形成区域15相邻的邻接区域在其上安装有表面电极4，树脂7填充在凹部14a，14b内。因此，可以提供能够抑制由于与温度变化有关的膨胀和收缩而在安装在电路形成部分上的部分，部件和表面电极之间的接合处产生的不足的旋转检测器。

50. 发明申请

US20100075466A1 METHOD OF FORMING ASSYMETRICAL ENCAPSULANT BEAD 有权
标题翻译：形成大肠埃及珠的方法
公开(公告)号：US20100075466A1
公开(公告)日：2010-03-25
申请号：US12364517
申请日：2009-02-03
申请人： Nadine Lee-Yen Chew , Elmer Dimaculangan Perez , Kiangkai Tankongchumruskul
发明人： Nadine Lee-Yen Chew , Elmer Dimaculangan Perez , Kiangkai Tankongchumruskul
IPC分类号： H01L21/00
CPC分类号： H01L21/56 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49175 , H01L2224/78 , H01L2224/85181 , H01L2224/85205 , H01L2224/8592 , H01L2224/85947 , H01L2924/00014 , H01L2924/01014 , H01L2924/01033 , H01L2924/01082 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/20753 , H05K1/189 , H05K2201/09045 , H05K2203/049 , H01L2924/00 , H01L2224/45099 , H01L2924/20752 , H01L2924/20754 , H01L2224/05599
摘要： A method of forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, the micro-electronic device having a planar active surface. The method has the steps of positioning the die and the wire bonds beneath an encapsulant jetter that jets drops of encapsulant on to the wire bonds, the drops of encapsulant following a vertical trajectory, tilting the die such that the active surface is inclined to the horizontal and, jetting the drops of encapsulant to form a bead of encapsulant material covering the series of wire bonds, the bead having a cross sectional profile that is asymmetrical about an axis parallel to a normal to the active surface.
摘要翻译：在将微电子器件电连接到一系列导体的一系列引线键合上形成不对称密封剂珠的方法，该微电子器件具有平坦的有源表面。该方法具有以下步骤：将管芯和引线接合在密封剂喷射器下方，将密封剂滴喷射到引线键合上，密封剂液滴沿垂直轨迹移动，倾斜模具使得活性表面倾斜于水平并且，喷射所述密封剂滴以形成覆盖所述一系列引线接合的密封剂材料珠，所述珠具有围绕平行于所述活性表面的法线的轴线不对称的横截面轮廓。

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