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41. 发明申请

US20150274864A1 Injection Stretch Blow Molded Articles and Random Copolymers For Use Therein 审中-公开
标题翻译：注塑拉伸吹塑制品和随机共聚物用于其中
公开(公告)号：US20150274864A1
公开(公告)日：2015-10-01
申请号：US14735329
申请日：2015-06-10
申请人： FINA TECHNOLOGY, INC.
发明人： Luyi Sun , Mark Leland
IPC分类号： C08F210/06 , C08K5/00 , B29C49/06 , C08K3/00
CPC分类号： C08F210/06 , B29C49/0005 , B29C49/06 , B29C49/10 , B29K2023/12 , B29K2023/14 , B29L2007/00 , B29L2022/00 , B29L2031/712 , B29L2031/7158 , C08K3/01 , C08K5/0008 , Y10T428/1397
摘要： A polymer composition adapted for use in injection stretch blow molding may include a metallocene random propylene-based copolymer in the absence of a clarifier. The metallocene random propylene-based copolymer may exhibit a melting point of from 105° C. to less than 175° C., a recrystallization temperature ranging from 85° C. to 100° C. as measured by DSC, a microtacticity ranging from 89% to 99%, a molecular weight (Mw) ranging from 170,000 to 210,000, and a melt flow rate of from about 1 dg/min. to about 40 dg/min. A method of forming an injection stretch blow molded (ISBM) article may include providing the metallocene random propylene-based copolymer, injection molding the metallocene random propylene-based copolymer in the absence of a clarifier into a preform, and stretch-blowing the preform into an article.
摘要翻译：适用于注射拉伸吹塑成型的聚合物组合物可以在不存在澄清剂的情况下包括茂金属无规丙烯基共聚物。金属茂无规丙烯基共聚物可以显示出105℃至小于175℃的熔点，通过DSC测量的重结晶温度为85℃至100℃，微尺度范围为89 ％至99％，分子量（Mw）为170,000至210,000，熔体流动速率为约1dg / min。至约40dg / min。形成注射拉伸吹塑（ISBM）制品的方法可以包括提供金属茂无规丙烯基共聚物，在没有澄清剂的情况下将金属茂无规丙烯基共聚物注射入预成型体中，并将预成型件拉伸吹塑一篇文章。

42. 发明授权

US09115267B2 Lightweight wall repair compounds 有权
标题翻译：轻质墙体修复化合物
公开(公告)号：US09115267B2
公开(公告)日：2015-08-25
申请号：US14180789
申请日：2014-02-14
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： John E. Gozum , Richard A. Mallo
IPC分类号： C08J9/32 , C08K7/28 , C04B26/06 , B29C73/02 , C08K3/18 , C08K3/22 , C08K5/06 , C08K3/26 , C08K7/24 , C04B103/00 , C04B111/00 , C04B111/70
CPC分类号： C08K7/28 , B29C73/02 , C04B26/06 , C04B2103/0065 , C04B2103/0075 , C04B2111/00663 , C04B2111/70 , C08K3/01 , C08K3/18 , C08K3/22 , C08K3/26 , C08K5/0008 , C08K5/06 , C08K7/24 , C08K2003/2241 , C08K2003/265 , E04G23/0203 , C04B14/10 , C04B14/24 , C04B14/301 , C04B20/008 , C04B24/023 , C04B24/383 , C04B2103/67 , C04B14/28 , C04B24/08
摘要： Herein are disclosed wall repair compounds comprising at least one or more polymeric binder latex emulsions, one or more inorganic fillers, and comprising an amount of organic polymeric thickener that is less than about 0.1 percent by weight based on the total weight of the wall repair compound. In certain embodiments, the wall repair compound comprises an inorganic filler system selected such that such that synthetic inorganic fillers comprise essentially 100 percent of the inorganic filler used. In certain embodiments, the wall repair compound comprises one or more glycol ether smoothing agents.
摘要翻译：本文公开了壁修复化合物，其包含至少一种或多种聚合物粘合剂胶乳乳液，一种或多种无机填料，并且包含一定量的有机聚合物增稠剂，其基于壁修复化合物的总重量小于约0.1重量％。在某些实施方案中，壁修复化合物包括无机填料系统，其选择为使得合成无机填料占基本上100％的所用无机填料。在某些实施方案中，壁修复化合物包含一种或多种二醇醚平滑剂。

43. 发明申请

US20150048356A1 ADHESIVE FILM AND SEALING PRODUCT FOR ORGANIC ELECTRONIC DEVICE USING SAME 审中-公开
标题翻译：粘合膜和密封用于有机电子设备的产品
公开(公告)号：US20150048356A1
公开(公告)日：2015-02-19
申请号：US14527182
申请日：2014-10-29
申请人： LG CHEM, LTD.
发明人： Seung Min LEE , Suk Ky CHANG , Hyun Jee YOO , Jung Sup SHIM , Yoon Gyung CHO , Kyung Yul BAE
IPC分类号： H01L51/52 , C08K3/22 , C09J163/00
CPC分类号： C08K3/22 , C08G59/5073 , C08G2650/56 , C08K3/01 , C08K2003/2206 , C08L63/00 , C09J163/00 , H01L21/563 , H01L51/5246 , H01L51/5259
摘要： Provided are an adhesive film, and an organic electronic device (OED) encapsulation product using the same. Dimensional stability, lifespan, and durability may be enhanced even when a panel of an organic electronic device is large-sized and formed as a thin film by controlling dimensional tolerance and edge angular tolerance of the adhesive film, thereby ensuring long-term reliability, and process yields may be enhanced when the adhesive film is applied to an automation process.
摘要翻译：提供了一种粘合膜和使用其的有机电子器件（OED）封装产品。即使通过控制粘合膜的尺寸公差和边缘角度公差，有机电子器件的面板大尺寸并且形成为薄膜，从而确保长期可靠性，也可以提高尺寸稳定性，寿命和耐久性，并且当将粘合剂膜应用于自动化过程时，可以提高工艺成品率。

44. 发明申请

US20140190672A1 Thermal Interface Materials 审中-公开
标题翻译：热界面材料
公开(公告)号：US20140190672A1
公开(公告)日：2014-07-10
申请号：US14210141
申请日：2014-03-13
申请人： Cabot Corporation
发明人： Srinivas H. Swaroop , Timothy D. Davis , Andrea O. Barney
IPC分类号： F28F13/18
CPC分类号： F28F13/18 , C08K3/01 , C08K3/013 , C08K3/22 , Y10T428/257
摘要： The present invention relates to thermal interface materials comprising a filler dispersed in a polymer, wherein the filler has an average aggregate particle size of less than or equal to 1 micron. Preferably the filler is a synthetic alumina, such as fumed alumina.
摘要翻译：本发明涉及包含分散在聚合物中的填料的热界面材料，其中填料的平均聚集体粒度小于或等于1微米。优选地，填料是合成氧化铝，例如热解氧化铝。

45. 发明授权

US08741991B2 Fiber-reinforced polyamide[5,10] molding compounds 有权
标题翻译：纤维增强聚酰胺[5,10]模塑料
公开(公告)号：US08741991B2
公开(公告)日：2014-06-03
申请号：US12865469
申请日：2009-01-29
申请人： Motonori Yamamoto , Weol Kyu Jeong , Arnold Schneller , Matthias Scheibitz , Freddy Gruber , Jürgen Deininger
发明人： Motonori Yamamoto , Weol Kyu Jeong , Arnold Schneller , Matthias Scheibitz , Freddy Gruber , Jürgen Deininger
IPC分类号： C08K5/34 , C08K5/48 , C08K5/3492 , C08K5/16 , C08K3/32
CPC分类号： C08J5/044 , C08J5/043 , C08J2377/06 , C08K3/01 , C08K7/06 , C08K7/14 , C08L77/00
摘要： The present relates to nylon-5,10 molding compositions comprising A) from 40 to 90% by weight of a nylon-5,10, B) from 10 to 60% by weight of fiber-containing or mineral-containing fillers, C) from 0 to 20% by weight of further additives, where the total of the percentages by weight of components A) to C) is 100%. The present invention moreover relates to a process for the preparation of these molding compositions, to the use of these molding compositions for the production of moldings of any type, and to the resultant moldings, preferably motor vehicle bodywork parts or electronics components of any type, foils, and fibers.
摘要翻译：本发明涉及尼龙-5,10模塑组合物，其包含A）40至90重量％的尼龙-5,10，B）10至60重量％的含纤维或矿物填料，C） 0至20重量％的其它添加剂，其中组分A）至C）的重量百分比的总和为100％。本发明还涉及制备这些模塑组合物的方法，使用这些模塑组合物来生产任何类型的模制品，以及所得模制品，优选任何类型的汽车车身零件或电子零件，箔和纤维。

46. 发明授权

US08691889B2 Lightweight wall repair compounds 有权
标题翻译：轻质墙体修复化合物
公开(公告)号：US08691889B2
公开(公告)日：2014-04-08
申请号：US13938770
申请日：2013-07-10
申请人： 3M Innovative Properties Company
发明人： John E. Gozum , Richard A. Mallo
IPC分类号： C08J9/32
CPC分类号： C08K7/28 , B29C73/02 , C04B26/06 , C04B2103/0065 , C04B2103/0075 , C04B2111/00663 , C04B2111/70 , C08K3/01 , C08K3/18 , C08K3/22 , C08K3/26 , C08K5/0008 , C08K5/06 , C08K7/24 , C08K2003/2241 , C08K2003/265 , E04G23/0203 , C04B14/10 , C04B14/24 , C04B14/301 , C04B20/008 , C04B24/023 , C04B24/383 , C04B2103/67 , C04B14/28 , C04B24/08
摘要： Herein are disclosed wall repair compounds comprising at least one or more polymeric binder latex emulsions, one or more inorganic fillers, and comprising an amount of organic polymeric thickener that is less than about 0.1 percent by weight based on the total weight of the wall repair compound. In certain embodiments, the wall repair compound comprises an inorganic filler system selected such that such that synthetic inorganic fillers comprise essentially 100 percent of the inorganic filler used. In certain embodiments, the wall repair compound comprises one or more glycol ether smoothing agents.
摘要翻译：本文公开了壁修复化合物，其包含至少一种或多种聚合物粘合剂胶乳乳液，一种或多种无机填料，并且包含一定量的有机聚合物增稠剂，其基于壁修复化合物的总重量小于约0.1重量％。在某些实施方案中，壁修复化合物包括无机填料系统，所选择的合成无机填料基本上包含100％的所用无机填料。在某些实施方案中，所述壁修复化合物包含一种或多种二醇醚平滑剂。

47. 发明授权

US08680192B2 Crystallized thermoplastic polyhydroxyalkanoate compounds 失效
标题翻译：结晶热塑性聚羟基链烷酸酯化合物
公开(公告)号：US08680192B2
公开(公告)日：2014-03-25
申请号：US13056481
申请日：2009-07-28
申请人： Roger W. Avakian
发明人： Roger W. Avakian
IPC分类号： C08K3/26
CPC分类号： C08L67/04 , C08K3/01 , C08K3/26 , C08K5/0083 , C08K9/04 , C08L2666/02
摘要： A thermoplastic compound is disclosed, comprising polyhydroxyalkanoate and an effective amount of a nucleating agent of surface treated precipitated calcium carbonate. Optionally the compound also includes additional polymers and functional additives to modify physical properties of the compound. Molded or extruded plastic articles can be made from the compound. The compound has a crystallization temperature of more than about 108° C.
摘要翻译：公开了一种热塑性化合物，其包含聚羟基链烷酸酯和有效量的经表面处理的沉淀碳酸钙的成核剂。任选地，该化合物还包括另外的聚合物和功能性添加剂以改变化合物的物理性质。模制或挤出的塑料制品可以由化合物制成。该化合物的结晶温度大于约108℃

48. 发明申请

US20130303716A1 Drying Wet Fluoropolymer Resin and Exposing to Oxygen Source to Reduce Discoloration 有权
标题翻译：干燥湿含氟聚合物树脂并暴露于氧源以减少变色
公开(公告)号：US20130303716A1
公开(公告)日：2013-11-14
申请号：US13875340
申请日：2013-05-02
申请人： E U DU PONT DE NEMOURS AND COMPANY
发明人： Paul Douglas Brothers , Gregory Allen Chapman , Subhash Vishnu Gangal , Adam Paul Smith
IPC分类号： C08F14/26
CPC分类号： C08F14/26 , B01J21/063 , B01J23/06 , B01J35/0013 , B01J35/004 , C08F6/006 , C08F6/008 , C08F8/06 , C08F114/26 , C08F214/262 , C08F2800/20 , C08K2003/3072 , C08F2/26 , C08F2/30 , C08F6/16 , C08L27/18 , C08F6/22 , C08K3/22 , C08K3/18 , C08K3/0008 , C08K3/01
摘要： Process for reducing thermally induced discoloration of fluoropolymer resin produced by polymerizing fluoromonomer in an aqueous dispersion medium to form aqueous fluoropolymer dispersion and isolating fluoropolymer from said aqueous medium by separating wet fluoropolymer resin from the aqueous medium and drying to produce fluoropolymer resin. The process comprises: exposing the wet fluoropolymer resin to an oxygen source during drying.
摘要翻译：通过在水性分散介质中聚合含氟单体而形成的含氟聚合物的热诱导变色的方法，以形成氟聚合物含水分散体，并通过从含水介质中分离出湿的氟聚合物树脂并干燥以产生氟聚合物树脂，从所述水性介质中分离含氟聚合物。该方法包括：在干燥期间将湿氟聚合物树脂暴露于氧源。

49. 发明申请

US20130295277A1 Lightweight Wall Repair Compounds 有权
标题翻译：轻质墙面修复化合物
公开(公告)号：US20130295277A1
公开(公告)日：2013-11-07
申请号：US13938801
申请日：2013-07-10
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： John E. Gozum , Richard A. Mallo
IPC分类号： B29C73/02
CPC分类号： C08K7/28 , B29C73/02 , C04B26/06 , C04B2103/0065 , C04B2103/0075 , C04B2111/00663 , C04B2111/70 , C08K3/01 , C08K3/18 , C08K3/22 , C08K3/26 , C08K5/0008 , C08K5/06 , C08K7/24 , C08K2003/2241 , C08K2003/265 , E04G23/0203 , C04B14/10 , C04B14/24 , C04B14/301 , C04B20/008 , C04B24/023 , C04B24/383 , C04B2103/67 , C04B14/28 , C04B24/08
摘要： Herein are disclosed wall repair compounds comprising at least one or more polymeric binder latex emulsions, one or more inorganic fillers, and comprising an amount of organic polymeric thickener that is less than about 0.1 percent by weight based on the total weight of the wall repair compound. In certain embodiments, the wall repair compound comprises an inorganic filler system selected such that such that synthetic inorganic fillers comprise essentially 100 percent of the inorganic filler used. In certain embodiments, the wall repair compound comprises one or more glycol ether smoothing agents.
摘要翻译：本文公开了壁修复化合物，其包含至少一种或多种聚合物粘合剂胶乳乳液，一种或多种无机填料，并且包含一定量的有机聚合物增稠剂，其基于壁修复化合物的总重量小于约0.1重量％。在某些实施方案中，壁修复化合物包括选择的无机填料体系，使得合成无机填料基本上包含100％的所用无机填料。在某些实施方案中，壁修复化合物包含一种或多种二醇醚平滑剂。

50. 发明授权

US08481630B2 Process for the production of moldings with reduced formation of deposit 有权
标题翻译：减少沉积物形成的模制品的生产过程
公开(公告)号：US08481630B2
公开(公告)日：2013-07-09
申请号：US12743884
申请日：2008-12-02
申请人： Wolfgang Fischer , Moritz Ehrenstein
发明人： Wolfgang Fischer , Moritz Ehrenstein
IPC分类号： C08K3/08 , B29C45/00
CPC分类号： B29C45/0001 , C08K3/01 , C08K5/0008
摘要： The invention relates to processes for the production of moldings via shaping of thermoplastic molding compositions F with reduced formation of deposit on the shaping mold, and it is essential to the invention that the thermoplastic molding compositions F comprise an amount of from 0 mg/kg to 100 mg/kg (calculated as the total of the mg of Mg and the mg of Ca per kg of thermoplastic molding composition F and determined by means of atomic emission spectrometry using inductively coupled plasma (ICPAES)) of magnesium compounds and/or calcium compounds; the invention further relates to the use of molding compositions F in the inventive processes, and also to moldings which can be produced by the inventive processes.
摘要翻译：本发明涉及通过热塑性成型组合物F的成型制造模制品的方法，减少了成型模具上沉积物的形成，本发明必须使热塑性模塑组合物F的含量为0mg / kg至 100mg / kg（以Mg的总和和每kg热塑性模塑组合物F的mg的总和计算，并通过使用电感耦合等离子体（ICPAES）的原子发射光谱测定）镁化合物和/或钙化合物 ; 本发明还涉及本发明方法中模塑组合物F的用途，还涉及可通过本发明方法制备的模制品。

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