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41. 发明申请

US20160185953A1 Halogen-Free Thermosetting Resin Composition, Prepreg and Laminate for Printed Circuit Prepared From the Same 有权
标题翻译：无卤素热固性树脂组合物，由其制备的印刷电路用预浸料和层压板
公开(公告)号：US20160185953A1
公开(公告)日：2016-06-30
申请号：US14679387
申请日：2015-04-06
申请人： Shengyi Technology Co., Ltd.
发明人： Jiang You , Tianhui Huang , Zhongqiang Yang
IPC分类号： C08L63/04 , C08L63/00
CPC分类号： C08L63/04 , C08G59/4071 , C08G59/621 , C08K3/36 , C08K5/0066 , C08K5/523 , C08L63/00
摘要： The present invention relates to a halogen-free thermosetting resin composition, and also a prepreg and a laminate for printed circuit prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 5 to 30 parts by weight of a first curing agent of phosphorus-containing bisphenol, (C) from 5 to 30 parts by weight of a second curing agent of alkylphenol novolac, and (D) a phosphorus-containing flame retardant. The prepreg and laminate for printed circuit prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better process workability, and can fulfill halogen-free flame retardance and achieve the grade of UL94 V-0.
摘要翻译：本发明涉及一种无卤热固性树脂组合物，以及由无卤素热固性树脂组合物制备的预浸料和印刷电路层压板。无卤热固性树脂组合物基于100重量份的有机固体，包含（A）30至60重量份的无卤环氧树脂，（B）5至30重量份的第一含磷双酚的固化剂，（C）5〜30重量份烷基酚酚醛清漆的第二固化剂，（D）含磷阻燃剂。由本发明的无卤素热固性树脂组合物制备的用于印刷电路的预浸料和层压材料具有高的玻璃化转变温度，优异的介电性能，低吸水性，高耐热性和更好的工艺加工性，并且可以实现无卤素火焰延迟并达到UL94 V-0的等级。

42. 发明申请

US20160159971A1 COMPOUND CONTAINING PHOSPHONIUM ION, EPOXY RESIN COMPOSITION CONTAINING SAME, AND DEVICE MANUFACTURED BY USING SAME 审中-公开
标题翻译：包含磷酸盐的复合物，含有环氧树脂的组合物和使用其制造的装置
公开(公告)号：US20160159971A1
公开(公告)日：2016-06-09
申请号：US14907643
申请日：2014-02-27
申请人： SAMSUNG SDI CO., LTD
发明人： Jin Min CHEON , Min Gyum KIM , Jung Seob KIM , Dong Hwan LEE , Hwan Sung CHEON , Seung HAN
IPC分类号： C08G59/68 , C07F9/54 , C07C311/16 , C08L63/04 , C08L63/00 , C08G59/62 , C08G59/24 , C07D239/42 , C07C311/51
CPC分类号： C08G59/688 , C07C311/51 , C07D239/42 , C07F9/5442 , C07F9/5456 , C08G59/245 , C08G59/621 , C08L63/00 , C08L63/04 , C08L2205/05
摘要： The present invention relates to a compound containing phosphonium ion of a chemical formula 1, an epoxy resin composition containing the same, and a device manufactured by using the same.
摘要翻译：本发明涉及化学式1的含有鏻离子的化合物，含有该化合物的鏻离子的化合物，以及使用该鏻离子的装置。

43. 发明申请

US20160137770A1 COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD 有权
标题翻译：含酚羟基，酚醛树脂，可固化组合物，其固化产品，半导体密封材料和印刷电路板
公开(公告)号：US20160137770A1
公开(公告)日：2016-05-19
申请号：US14897850
申请日：2014-02-21
申请人： DIC CORPORATION
发明人： Yutaka Satou , Ayumi Takahashi
IPC分类号： C08G8/02 , H05K1/03 , H05K1/09 , C07C39/15
CPC分类号： C08G8/02 , C07C39/15 , C08G59/621 , C08G61/02 , C08L61/16 , C08L65/00 , H01L23/295 , H01L2924/0002 , H05K1/0373 , H05K1/09 , H01L2924/00
摘要： There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I): wherein X is a structural site represented by the following Structural Formula (x1) or (x2); in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; wherein p is 1 or 2.
摘要翻译：提供了含有酚羟基的化合物，其固化产物具有优异的耐热性和优异的阻燃性，包含该酚羟基的酚醛树脂，固化性组合物及其固化产物，半导体密封材料和印刷电路板。含有酚羟基的化合物具有由以下通式（I）表示的分子结构：其中X是由以下结构式（x1）或（x2）表示的结构位点。在式（x1）或（x2）中，k为1〜3的整数，m为1或2，Ar为下述结构式（Ar1）表示的结构部位，在k或m为 2以上时，多个Ar可以相同或不同; 其中p为1或2。

44. 发明授权

US09340700B2 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same 有权
标题翻译：用于半导体封装的环氧树脂组合物和使用其的半导体器件
公开(公告)号：US09340700B2
公开(公告)日：2016-05-17
申请号：US13611559
申请日：2012-09-12
申请人： Tomohito Iwashige , Tomoaki Ichikawa , Naoya Sugimoto
发明人： Tomohito Iwashige , Tomoaki Ichikawa , Naoya Sugimoto
IPC分类号： C08K5/05 , C08K5/053 , C08K5/06 , C08K5/09 , C08L63/00 , C08L63/02 , C08L63/04 , H01L23/29 , C09D163/00 , C08G59/62 , H01L23/31 , C08K5/101 , C08K3/00 , C08K5/5425 , C08L23/26
CPC分类号： C09D163/00 , C08G59/621 , C08K3/013 , C08K5/05 , C08K5/06 , C08K5/09 , C08K5/101 , C08K5/5425 , C08L23/26 , C08L63/00 , C08L63/04 , H01L23/293 , H01L23/3128 , H01L2224/45144 , H01L2224/48227 , H01L2924/15311 , H01L2924/00
摘要： The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (E), in which the component (D) is contained in an amount of from 0.1 to 1.5% by weight of the whole of the epoxy resin composition: (A) an epoxy resin; (B) a phenol resin; (C) an inorganic filler; (D) a compound represented by the following formula (1) in which R1 represents a hydroxyl group or an alkoxy group, R2 represents a hydrogen atom or a monovalent hydrocarbon group, and n is an integer of from 1 to 7; and (E) a release agent including at least one of the following (α) and (β): (α) a linear saturated carboxylic acid having a number average molecular weight of from 550 to 800, and (β) an oxidized polyethylene wax: R1CH2—CH2—OnR2 (1).
摘要翻译：本发明涉及用于半导体封装的环氧树脂组合物，其包含以下组分（A）至（E）），其中组分（D）的含量为整体的0.1至1.5重量％环氧树脂组合物：（A）环氧树脂; （B）酚醛树脂; （C）无机填料; （D）由下式（1）表示的化合物，其中R 1表示羟基或烷氧基，R 2表示氢原子或一价烃基，n表示1〜7的整数。和（E）包含以下（α）和（bb）中的至少一种的脱模剂：（α）数均分子量为550〜800的直链饱和羧酸，和（bb）氧化的聚乙烯蜡：R1CH2-CH2-OnR2（1）。

45. 发明授权

US09328237B2 Two-pack type epoxy resin composition for fiber-reinforced composite materials, and fiber-reinforced composite material 有权
标题翻译：用于纤维增强复合材料的双组分型环氧树脂组合物和纤维增强复合材料
公开(公告)号：US09328237B2
公开(公告)日：2016-05-03
申请号：US14352342
申请日：2012-10-23
申请人： Toray Industries, Inc.
发明人： Hideki Oka , Nobuyuki Tomioka , Shirou Honda
IPC分类号： B32B27/04 , B32B27/38 , C08L63/00 , C08L63/02 , C08J5/04 , C08G59/42 , C08G59/62 , C08J5/24 , C08G59/68
CPC分类号： C08L63/00 , B32B27/04 , B32B27/38 , C08G59/4284 , C08G59/621 , C08G59/686 , C08G59/688 , C08J5/04 , C08J5/042 , C08J5/24 , C08J2363/00
摘要： A two-pack type epoxy resin composition for fiber-reinforced composite materials includes components [A] to [D], with component [D] being a liquid at room temperature or a solid having a melting point of 130° C. or less: [A] an epoxy resin; [B] an acid anhydride; [C] a compound that has an average of 2.5 or more hydroxyphenyl structures in each molecule; and [D] an organic phosphorus compound or imidazole derivative.
摘要翻译：用于纤维增强复合材料的双组分型环氧树脂组合物包括组分[A]至[D]，组分[D]在室温下为液体或熔点为130℃或更低的固体： [A]环氧树脂; [B]酸酐; [C]每个分子中平均具有2.5个或更多个羟基苯基结构的化合物; 和[D]有机磷化合物或咪唑衍生物。

46. 发明申请

US20160083582A1 PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, AND RESIN COMPOSITION CONTAINING PARTICLES 有权
标题翻译： PREPREG，纤维增强复合材料和含有颗粒的树脂组合物
公开(公告)号：US20160083582A1
公开(公告)日：2016-03-24
申请号：US14780283
申请日：2014-03-24
申请人： JX NIPPON OIL & ENERGY CORPORATION , FUJI JUKOGYO KABUSHIKI KAISHA
发明人： Yoshihiro FUKUDA , Takayuki MATSUMOTO , Masaki MINAMI , Naoyuki SEKINE , Masanori NAKAJIMA
IPC分类号： C08L79/04 , C08L77/00 , C08L63/00
CPC分类号： C08L79/04 , C08G59/621 , C08J5/24 , C08J2379/04 , C08J2463/02 , C08J2477/02 , C08K5/13 , C08K5/353 , C08L63/00 , C08L77/00 , C08L77/02
摘要： A prepreg 10 comprises: a reinforcing fiber layer 3 including reinforcing fibers 1 and a resin composition 2 with which the space between fibers of the reinforcing fibers 1 is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer 6a or 6b provided on at least one surface of the reinforcing fiber layer 3 and containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particles 4 having an average particle size of 5 to 50 μm, wherein the polyamide resin particles 4 include a particle made of a polyamide 11.
摘要翻译：预浸料10包括：包含增强纤维1的增强纤维层3和浸渍增强纤维1的纤维之间的空间的树脂组合物2，其包含（A）苯并恶嗪树脂，（B）环氧树脂，和（C）分子中具有2个以上酚羟基的固化剂; 以及设置在增强纤维层3的至少一个表面上并含有（A）苯并恶嗪树脂，（B）环氧树脂，（C）具有2个以上酚羟基的固化剂的表面层6a或6b 分子和（D）平均粒径为5〜50μm的聚酰胺树脂粒子4，其中聚酰胺树脂粒子4包括由聚酰胺11构成的粒子。

47. 发明授权

US09251956B2 Conductive resin composition and multilayer ceramic capacitor having the same 有权
标题翻译：导电树脂组合物和具有该导电树脂组合物的多层陶瓷电容器
公开(公告)号：US09251956B2
公开(公告)日：2016-02-02
申请号：US13558098
申请日：2012-07-25
申请人： Sung Koo Kang , Myung Jun Park , Hyun Hee Gu , Kyung Pyo Hong , Chang Hoon Kim
发明人： Sung Koo Kang , Myung Jun Park , Hyun Hee Gu , Kyung Pyo Hong , Chang Hoon Kim
IPC分类号： H01G4/008 , H01G4/228 , H01G4/232 , C08L63/00 , H01B1/22 , C08G59/42 , C08G59/62 , C08K3/08 , C08K9/02
CPC分类号： H01B1/22 , C08G59/42 , C08G59/621 , C08K3/08 , C08K9/02 , C08K2003/085 , C08K2201/001 , C08L63/00 , H01B1/24 , H01G4/012 , H01G4/12 , H01G4/224 , H01G4/2325 , H01G4/30
摘要： There is provided a conductive resin composition including epoxy resin, copper powder particles, and non-nitrogen-based hardeners.
摘要翻译：提供了包含环氧树脂，铜粉末颗粒和非氮基硬化剂的导电树脂组合物。

48. 发明授权

US09249294B2 Conductive resin composition and cured product thereof 有权
标题翻译：导电性树脂组合物及其固化物
公开(公告)号：US09249294B2
公开(公告)日：2016-02-02
申请号：US14342864
申请日：2012-09-04
申请人： Noritsuka Mizumura , Takashi Yamaguchi , Yoko Nagara
发明人： Noritsuka Mizumura , Takashi Yamaguchi , Yoko Nagara
IPC分类号： C08G59/38 , C08G59/62 , C08L63/00 , C08L63/04 , C08L63/10 , C08K3/08 , C08K3/10
CPC分类号： C08L63/00 , C08G59/621 , C08K3/08 , C08K2201/001 , C08L63/10 , C08L2205/05 , C08L33/068 , C08L61/04
摘要： A conductive resin composition which includes an epoxy resin (A), a compound (B) having a (meth)acryloyl group and a glycidyl group, a phenolic resin curing agent (C), a radical polymerization initiator (D) and a conductive particle (E). The conductive resin composition which may be B-staged (semi-cured) at a relatively low temperature to exhibit sufficient tack-free properties and excellent pressure-sensitive tackiness. This permits temporary bonding of parts without involving solvent evaporation or light illumination, thereby reducing or avoiding an increase in facility costs. The conductive resin composition may thereafter be cured (C-staged) to provide a cured product having a desirable bond strength, while maintaining a low specific resistivity.
摘要翻译：包含环氧树脂（A），具有（甲基）丙烯酰基和缩水甘油基的化合物（B），酚醛树脂固化剂（C），自由基聚合引发剂（D）和导电颗粒（E）。导电性树脂组合物可以在比较低的温度下进行B阶（半固化），以显示出足够的无粘性和优异的压敏粘合性。这允许临时粘合部件而不涉及溶剂蒸发或光照射，从而减少或避免设备成本的增加。此后，导电性树脂组合物可以固化（C阶段），以提供具有所需粘合强度的固化产物，同时保持低电阻率。

49. 发明申请

US20150380277A1 UNDERFILL SHEET, UNDERFILL SHEET INTEGRATED WITH TAPE FOR GRINDING REAR SURFACE, UNDERFILL SHEET INTEGRATED WITH DICING TAPE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：一体化用于研磨后表面的垫片的底板，与定位带一体化的底板以及制造半导体器件的方法
公开(公告)号：US20150380277A1
公开(公告)日：2015-12-31
申请号：US14769441
申请日：2014-02-07
申请人： NITTO DENKO CORPORATION
发明人： Kosuke Morita , Naohide Takamoto , Hiroyuki Hanazono , Akihiro Fukui
IPC分类号： H01L21/56 , C08J5/18 , H01L23/00 , B32B27/38 , H01L21/683 , H01L23/29
CPC分类号： H01L21/563 , B32B27/38 , B32B2264/102 , B32B2457/14 , C08G59/621 , C08J5/18 , C08J2333/08 , C08J2333/12 , C08J2361/10 , C08J2433/08 , C08J2433/12 , C08J2433/20 , C08J2463/00 , C08L33/06 , C09J133/08 , C09J163/00 , H01L21/6836 , H01L23/293 , H01L23/3114 , H01L23/562 , H01L24/13 , H01L24/14 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2221/68327 , H01L2221/6834 , H01L2221/68377 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/14181 , H01L2224/16225 , H01L2224/27436 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/73253 , H01L2224/81191 , H01L2224/81193 , H01L2224/83191 , H01L2224/8385 , H01L2224/84862 , H01L2924/00011 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/00014 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/0103 , H01L2924/01083 , H01L2924/0105 , H01L2924/0665 , H01L2924/066 , H01L2924/00 , H01L2224/81805
摘要： An object of the present invention is to provide an underfill sheet that enables suitable filling of unevenness of a circuit surface of a semiconductor element, a suitable connection of a terminal of the semiconductor element and a terminal of an adherend, and suppression of outgas. The present invention relates to the underfill sheet having a viscosity of 1,000 Pa·s to 10,000 Pa·s at 150° C. and 0.05 to 0.20 rotations/min; and a minimum viscosity of 100 Pa·s or more at 100 to 200° C. and 0.3 to 0.7 rotations/min.
摘要翻译：本发明的目的是提供一种能够适当地填充半导体元件的电路表面的不均匀性，半导体元件的端子和被粘物的端子的适当连接以及抑制排气的底部填充片。本发明涉及在150℃下粘度为1,000Pa·s〜10,000Pa·s和0.05〜0.20转/分钟的底填料片; 在100〜200℃，最低粘度为100Pa·s以上，0.3〜0.7转/分钟。

50. 发明申请

US20150307708A1 RESIN COMPOSITION, PRE-PREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD 审中-公开
标题翻译：树脂组合物，PRE-PREG，层压板，金属箔层压板和印刷线路板
公开(公告)号：US20150307708A1
公开(公告)日：2015-10-29
申请号：US14435574
申请日：2013-10-18
申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
发明人： Tomo CHIBA , Hiroshi TAKAHASHI , Eisuke SHIGA , Takaaki OGASHIWA
IPC分类号： C08L73/00 , C08J5/24 , H05K1/03 , C08L63/00
CPC分类号： C08L73/00 , B32B5/26 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/306 , B32B2307/3065 , B32B2457/08 , C08G59/24 , C08G59/4246 , C08G59/621 , C08G77/18 , C08G77/52 , C08J5/24 , C08J2363/00 , C08J2373/00 , C08J2383/06 , C08J2463/00 , C08J2473/00 , C08K3/34 , C08K3/36 , C08L63/00 , C08L63/06 , C08L83/06 , C08L83/14 , C08L2201/02 , C08L2203/206 , C08L2205/025 , H05K1/0353 , H05K2201/012 , H05K2201/0162 , H05K2201/0209 , H05K2201/0275 , H05K2201/029
摘要： An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and/or a phenol resin (C), and an inorganic filler (D).
摘要翻译：本发明的目的是提供一种能够获得具有高阻燃性，高耐热性，小热膨胀系数和高钻孔加工性的固化产物的树脂组合物，具有树脂组合物，层压体和金属箔的预浸料具有该预浸料的复合层压板和具有该树脂组合物的印刷电路板。一种树脂组合物，其至少具有通过使具有羧基的线性聚硅氧烷（a）与具有环氧基的环状环氧化合物（b）反应制备的环氧硅氧烷树脂（A），使得环状环氧化合物的环氧基（ b）基于线性聚硅氧烷（a）的羧基，氰酸酯化合物（B）和/或酚醛树脂（C）和无机填料（D）为2〜10当量。

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