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41. 发明授权

US07424198B2 Method and device for packaging a substrate 失效
标题翻译：包装基材的方法和装置
公开(公告)号：US07424198B2
公开(公告)日：2008-09-09
申请号：US11045738
申请日：2005-01-28
申请人： Lauren Palmateer , William J. Cummings , Brian Gally , Mark Miles , Jeffrey B. Sampsell , Clarence Chui , Manish Kothari
发明人： Lauren Palmateer , William J. Cummings , Brian Gally , Mark Miles , Jeffrey B. Sampsell , Clarence Chui , Manish Kothari
IPC分类号： G02B6/00
CPC分类号： G02B26/007 , B81B2201/047 , B81C1/00285 , B81C1/00333 , B81C2203/0136 , B81C2203/0145 , G02B26/001 , G02B26/0825 , G02B26/0833
摘要： A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.
摘要翻译：用于干涉式调制器的封装结构和封装方法。在干涉式调制器和透明衬底上沉积薄膜材料以封装干涉式调制器。干涉式调制器和薄膜之间的间隙或腔提供干涉式调制器的机械部分可以移动的空间。通过去除沉积在干涉式调制器上的牺牲层产生间隙。

42. 发明授权

US07417307B2 System and method for direct-bonding of substrates 失效
标题翻译：用于直接粘合基材的系统和方法
公开(公告)号：US07417307B2
公开(公告)日：2008-08-26
申请号：US11192377
申请日：2005-07-29
申请人： Charles C Haluzak , Arthur Piehl , Chien-Hua Chen , Jennifer Shih
发明人： Charles C Haluzak , Arthur Piehl , Chien-Hua Chen , Jennifer Shih
IPC分类号： H01L23/20
CPC分类号： B81C1/00285 , B81B2201/042 , G02B26/0833
摘要： A method of forming a MEMS (Micro-Electro-Mechanical System), includes forming an ambient port through a MEMS cap which defines a cavity containing a plurality of MEMS actuators therein; and bonding a lid arrangement to the MEMS cap to hermetically seal the ambient port.
摘要翻译：一种形成MEMS（微机电系统）的方法包括：通过限定在其中包含多个MEMS致动器的空腔的MEMS盖形成环境端口; 以及将盖装置结合到MEMS盖以密封环境端口。

43. 发明申请

US20080049386A1 ENCAPSULATED MICROCOMPONENT EQUIPPED WITH AT LEAST ONE GETTER 有权
标题翻译：封装的微型计算机配备最少的一个GETTER
公开(公告)号：US20080049386A1
公开(公告)日：2008-02-28
申请号：US11774200
申请日：2007-07-06
申请人： Jean-Louis Pornin , Charlotte Gillot , Francois Baleras
发明人： Jean-Louis Pornin , Charlotte Gillot , Francois Baleras
IPC分类号： H05K7/00 , B05D5/12
CPC分类号： B81C1/00285 , B81C2203/0136 , B81C2203/0145
摘要： The invention relates to an encapsulated microcomponent having a cover (3) delimiting a sealed cavity (4) equipped with at least one orifice (5) provided with a plug (6). The plug (6) comprises a getter material portion (6.1) exposed inside the cavity (4).Application in particular in MEMS.
摘要翻译：本发明涉及一种封装的微型部件，其具有限定密封空腔（4）的盖（3），所述密封空腔（4）配备有至少一个具有插头（6）的孔口（5）。插塞（6）包括暴露在空腔（4）内的吸气材料部分（6.1）。尤其适用于MEMS。

44. 发明申请

US20070281381A1 Method for sealing and backside releasing of microelectromechanical systems 有权
标题翻译：微机电系统的密封和背面释放方法
公开(公告)号：US20070281381A1
公开(公告)日：2007-12-06
申请号：US11807848
申请日：2007-05-30
申请人： Farrokh Ayazi
发明人： Farrokh Ayazi
IPC分类号： H01L21/00
CPC分类号： B81C1/00285 , B81B2207/015 , B81C1/00476
摘要： Disclosed are methods for fabricating encapsulated microelectromechanical systems (MEMS) devices. A MEMS device fabricated on a CMOS wafer is encapsulated using an etch resistant thin film layer prior to the release of the MEMS device. Once CMOS processing is completed, the wafer is etched to release the MEMS device. If the MEMS is fabricated on a silicon-on-insulator (SOI) wafer, the buried oxide of the SOI wafer acts as an etch stop for the etching. A sacrificial layer(s) is accessed and removed from the back side of the wafer, while the front side of the wafer is protected by a masking layer. The MEMS device is released without having any detrimental effects on CMOS components. If desired, the wafer can be mounted on another substrate to provide hermetic or semi-hermetic sealing of the device.
摘要翻译：公开了用于制造封装的微机电系统（MEMS）装置的方法。在MEMS器件释放之前，使用耐蚀刻薄膜层在CMOS晶片上制造的MEMS器件被封装。一旦CMOS处理完成，则蚀刻晶片以释放MEMS器件。如果MEMS制造在绝缘体上硅（SOI）晶片上，则SOI晶片的掩埋氧化物用作蚀刻的蚀刻停止。牺牲层从晶片的背面进入和移除，而晶片的前侧由掩模层保护。 MEMS器件被释放，不会对CMOS元件产生任何不利影响。如果需要，晶片可以安装在另一基板上，以提供装置的密封或半封闭密封。

45. 发明申请

US20070242341A1 MEMS DEVICES AND PROCESSES FOR PACKAGING SUCH DEVICES 有权
标题翻译：用于包装这种装置的MEMS装置和方法
公开(公告)号：US20070242341A1
公开(公告)日：2007-10-18
申请号：US11734730
申请日：2007-04-12
申请人： Bangalore Natarajan , Surya Ganti
发明人： Bangalore Natarajan , Surya Ganti
IPC分类号： G02B26/00
CPC分类号： G02B27/0006 , B81B2201/047 , B81C1/00285 , B81C2203/0145 , B81C2203/019 , B81C2203/032 , G02B26/001 , G02B26/0841
摘要： A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to the transparent substrate with a seal. The interferometric modulator array may be exposed to the surrounding environment through an opening in either the backplate or the seal.
摘要翻译：描述了用于MEMS器件的封装结构和封装方法。示出了其上形成有干涉式调制器阵列的透明基板。单层或双层背板通过密封接合到透明基板上。干涉式调制器阵列可以通过背板或密封件中的开口暴露于周围环境。

46. 发明授权

US07180163B2 Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices 有权
标题翻译：支持用于制造微电子，微电子或微机电器件的气体吸收材料的集成沉积
公开(公告)号：US07180163B2
公开(公告)日：2007-02-20
申请号：US10211426
申请日：2002-07-19
申请人： Marco Amiotti
发明人： Marco Amiotti
IPC分类号： H01L23/20
CPC分类号： B81C1/00285 , C23C14/025 , C23C16/0281 , H01L21/3221 , H01L21/6835 , H01L31/18 , H01L31/208 , H01L2221/6835 , H01L2221/68377 , H01L2924/16152 , Y02E10/50 , Y02P70/521
摘要： The specification teaches a device for use in the manufacturing of microelectronic, microoptoelectronic or micromechanical devices (microdevices) in which a contaminant absorption layer improves the life and operation of the microdevice. In a preferred embodiment the invention includes a mechanical supporting base, and a layer of a gas absorbing or purifier material is deposited on the base by a variety of techniques and a layer for temporary protection of the purification material is placed on top of the purification material. The temporary protection material is compatible for use in the microdevice and can be removed during the manufacture of the microdevice.
摘要翻译：本说明书教导了一种用于制造微电子，微电子或微机电器件（微器件）的器件，其中污染物吸收层改善了微器件的寿命和操作。在优选实施例中，本发明包括机械支撑底座，并且通过各种技术将一层气体吸收或净化材料沉积在基座上，并且将用于临时保护净化材料的层放置在净化材料的顶部。临时保护材料与微型装置相兼容，并可在微型装置的制造过程中移除。

47. 发明授权

US07172916B2 Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate 失效
标题翻译：将微机电系统真空安装在基板上的方法和装置
公开(公告)号：US07172916B2
公开(公告)日：2007-02-06
申请号：US10701552
申请日：2003-11-06
申请人： Kyu-dong Jung , Chan-Bong Jun , Hyung Choi , Seok-jin Kang , Seog-woo Hong , Seok-whan Chung , Moon-chul Lee , Eun-sung Lee
发明人： Kyu-dong Jung , Chan-Bong Jun , Hyung Choi , Seok-jin Kang , Seog-woo Hong , Seok-whan Chung , Moon-chul Lee , Eun-sung Lee
IPC分类号： H01L21/00
CPC分类号： B81C1/00285
摘要： A method and apparatus for vacuum-mounting at least one micro electro mechanical system (MEMS) on a substrate includes a gas injecting section for injecting an inert gas into a vacuum chamber; a substrate aligning section for aligning a semiconductor substrate and a cover, the cover having a cavity formed therein and a getter attached to an interior surface of the cavity; a bonding section for bonding the semiconductor substrate and the cover together; and a controlling section for controlling the substrate aligning section to align the semiconductor and the cover, for controlling the gas injecting section to inject the inert gas into the vacuum chamber, and for controlling the bonding section to bond the semiconductor substrate and the cover together after the inert gas is injected.
摘要翻译：用于真空安装至少一个微机电系统（MEMS）在基板上的方法和装置包括用于将惰性气体注入真空室的气体注入部分; 用于对准半导体衬底和盖的衬底对准部分，所述盖具有形成在其中的空腔和附着到腔的内表面的吸气剂; 用于将半导体衬底和盖结合在一起的接合部分; 以及控制部分，用于控制衬底对准部分以对准半导体和盖子，用于控制气体注入部分以将惰性气体注入真空室中，并且用于控制接合部分将半导体衬底和盖子结合在一起，之后注入惰性气体。

48. 发明申请

US20070026559A1 System and method for direct-bonding of substrates 失效
标题翻译：用于直接粘合基材的系统和方法
公开(公告)号：US20070026559A1
公开(公告)日：2007-02-01
申请号：US11192377
申请日：2005-07-29
申请人： Charles Haluzak , Arthur Piehl , Chien-Hua Chen , Jennifer Shih
发明人： Charles Haluzak , Arthur Piehl , Chien-Hua Chen , Jennifer Shih
IPC分类号： H01L21/00 , H01L21/30
CPC分类号： B81C1/00285 , B81B2201/042 , G02B26/0833
摘要： A method of forming a MEMS (Micro-Electro-Mechanical System), includes forming an ambient port through a MEMS cap which defines a cavity containing a plurality of MEMS actuators therein; and bonding a lid arrangement to the MEMS cap to hermetically seal the ambient port.
摘要翻译：一种形成MEMS（微机电系统）的方法包括：通过限定在其中包含多个MEMS致动器的空腔的MEMS盖形成环境端口; 以及将盖装置结合到MEMS盖以密封环境端口。

49. 发明申请

US20060258039A1 Integrated getter area for wafer level encapsulated microelectromechanical systems 有权
公开(公告)号：US20060258039A1
公开(公告)日：2006-11-16
申请号：US11484431
申请日：2006-07-11
申请人： Markus Lutz , Aaron Patridge
发明人： Markus Lutz , Aaron Patridge
IPC分类号： H01L21/00
CPC分类号： B81B7/0038 , B81C1/00269 , B81C1/00285 , H01L2224/48091 , H01L2924/00014
摘要： There are many inventions described and illustrated herein. In one aspect, present invention is directed to a thin film encapsulated MEMS, and technique of fabricating or manufacturing a thin film encapsulated MEMS including an integrated getter area and/or an increased chamber volume, which causes little to no increase in overall dimension(s) from the perspective of the mechanical structure and chamber. The integrated getter area is disposed within the chamber and is capable of (i) “capturing” impurities, atoms and/or molecules that are out-gassed from surrounding materials and/or (ii) reducing and/or minimizing the adverse impact of such impurities, atoms and/or molecules (for example, reducing the probability of adding mass to a resonator which would thereby change the resonator's frequency). In this way, the thin film wafer level packaged MEMS of the present invention includes a relatively stable, controlled pressure environment within the chamber to provide, for example, a more stable predetermined, desired and/or selected mechanical damping of the mechanical structure.

50. 发明申请

US20050158914A1 Process for manufacturing microelectronic, microoptoelectronic or micromechanical devices 有权
标题翻译：微电子，微电子或微机械器件的制造工艺
公开(公告)号：US20050158914A1
公开(公告)日：2005-07-21
申请号：US11067526
申请日：2005-02-25
申请人： Marco Amiotti
发明人： Marco Amiotti
IPC分类号： G02B26/08 , B01D53/14 , B01D53/28 , B01J20/02 , B01J20/04 , B81B3/00 , B81B7/00 , B81C1/00 , C23C14/04 , C23C16/04 , H01L21/02 , H01L21/68 , H01L23/26 , H01L21/44 , H01L21/48
CPC分类号： B81C1/00285 , C23C14/04 , C23C16/04 , G01J5/045 , H01L21/6835 , H01L23/26 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： The specification teaches a technique for manufacturing microelectronic, microoptoelectronic or micromechanical devices (microdevices) in which a contaminant absorption layer improves the life and operation of the microdevice. In an embodiment, a process for manufacturing the devices includes efficiently integrating a getter material.
摘要翻译：本说明书教导了一种用于制造微电子，微细胞电子学或微机械器件（微器件）的技术，其中污染物吸收层改善微器件的寿命和操作。在一个实施例中，用于制造装置的方法包括有效地整合吸气材料。

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