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    • 50. 发明申请
    • FABRICATING METHOD FOR ELECTRONIC CARD
    • 电子卡制作方法
    • US20130118681A1
    • 2013-05-16
    • US13297781
    • 2011-11-16
    • Lee-Chung LinChi-Yuan Ou
    • Lee-Chung LinChi-Yuan Ou
    • B32B38/10B32B37/14
    • B42D25/47B32B37/02B32B37/12B32B37/142B32B38/0004B32B2327/06B32B2367/00B32B2425/00B42D25/00B42D25/46B42D25/475B42D2033/46G06K19/07722
    • A fabricating method for electronic card is to interpose an electronic element between an adhesive first outer layer and a non-adhesive detachable pressing plate. The fabricating method comprises following steps. Deposit a first outer layer on a worktable. Embed an electronic element in the first outer layer. Enclose the electronic element by adhesive stuff layer(s). Press foregoing all components via a detachable pressing plate, a quasi-finished laminate is formed with thickness being in preset range. Remove the pressing plate off to form a semi-finished laminate after solidification of the adhesive stuff layer(s). Deposit a second outer layer with a sticky plane over the semi-finished laminate. Apply pressing process on the second outer layer and semi-finished laminate to form a finished laminate due to solidification of the sticky plane on the second outer layer. Finally cut the finished laminate into single electronic cards.
    • 电子卡的制造方法是将电子元件插入到粘合剂第一外层和不粘合的可拆卸的压板之间。 该制造方法包括以下步骤。 在工作台上放置第一个外层。 将电子元件嵌入第一外层。 用胶粘剂层封闭电子元件。 通过可拆卸的压板压制所有部件,形成厚度在预设范围内的准成品层压板。 在粘合剂填料层凝固后,取下压板以形成半成品层压板。 将第二个外层用粘性平面沉积在半成品层压板上。 在第二外层和半成品层压板上施加压制工艺以由于第二外层上的粘性平面固化而形成成品层压板。 最后将完成的层压板切割成单个电子卡。